FR2227351A1 - - Google Patents

Info

Publication number
FR2227351A1
FR2227351A1 FR7412621A FR7412621A FR2227351A1 FR 2227351 A1 FR2227351 A1 FR 2227351A1 FR 7412621 A FR7412621 A FR 7412621A FR 7412621 A FR7412621 A FR 7412621A FR 2227351 A1 FR2227351 A1 FR 2227351A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7412621A
Other languages
French (fr)
Other versions
FR2227351B1 (xx
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Foil USA Inc
Original Assignee
Yates Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yates Industries Inc filed Critical Yates Industries Inc
Publication of FR2227351A1 publication Critical patent/FR2227351A1/fr
Application granted granted Critical
Publication of FR2227351B1 publication Critical patent/FR2227351B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
FR7412621A 1973-04-25 1974-04-10 Expired FR2227351B1 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35419673A 1973-04-25 1973-04-25

Publications (2)

Publication Number Publication Date
FR2227351A1 true FR2227351A1 (xx) 1974-11-22
FR2227351B1 FR2227351B1 (xx) 1979-06-15

Family

ID=23392262

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7412621A Expired FR2227351B1 (xx) 1973-04-25 1974-04-10

Country Status (9)

Country Link
JP (1) JPS542179B2 (xx)
BE (1) BE813813A (xx)
DE (1) DE2413932C2 (xx)
FR (1) FR2227351B1 (xx)
GB (1) GB1458260A (xx)
IT (1) IT1004196B (xx)
LU (1) LU69919A1 (xx)
NL (1) NL155600B (xx)
SE (1) SE406023C (xx)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2498125A1 (fr) * 1981-01-22 1982-07-23 Gen Electric Stratifie revetu de cuivre et procede de fabrication
WO1985002969A1 (en) * 1983-12-19 1985-07-04 Microclad Laminates Limited Production of copper-clad dielectric boards

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5434259Y2 (xx) * 1974-07-12 1979-10-20
JPS5266962U (xx) * 1975-11-12 1977-05-18
DE2659625C3 (de) * 1976-12-30 1981-07-02 Ferrozell-Gesellschaft Sachs & Co Mbh, 8900 Augsburg Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen
US4293617A (en) * 1979-12-26 1981-10-06 Gould Inc. Process for producing strippable copper on an aluminum carrier and the article so obtained
US4357395A (en) * 1980-08-22 1982-11-02 General Electric Company Transfer lamination of vapor deposited foils, method and product
JPS58122865A (ja) * 1982-01-14 1983-07-21 高安　清輝 複合材料
US4534831A (en) * 1982-09-27 1985-08-13 Inoue-Japax Research Incorporated Method of and apparatus for forming a 3D article
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
SE9203327L (sv) 1992-11-06 1993-12-20 Metfoils Ab Förfarande vid mönsterkortstillverkning samt användning därvid
US6319620B1 (en) 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6270889B1 (en) 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6183880B1 (en) 1998-08-07 2001-02-06 Mitsui Mining & Smelting Co., Ltd. Composite foil of aluminum and copper
JP3670179B2 (ja) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板
CN102442025A (zh) * 2011-09-08 2012-05-09 深圳市必事达电子有限公司 散热铝基板的制作方法
KR101944784B1 (ko) * 2017-01-16 2019-02-08 일진머티리얼즈 주식회사 캐리어박 부착 극박동박
CN112941478A (zh) * 2021-01-29 2021-06-11 山东金宝电子股份有限公司 一种微弧氧化处理铝箔为载体超薄铜箔及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2433441A (en) * 1947-12-30 Electrolytic production of thin
US880484A (en) * 1904-06-29 1908-02-25 Edison Storage Battery Co Process of producing very thin sheet metal.
US3468765A (en) * 1966-08-04 1969-09-23 Nasa Method of plating copper on aluminum
US3565771A (en) * 1967-10-16 1971-02-23 Shipley Co Etching and metal plating silicon containing aluminum alloys
US3551122A (en) * 1967-12-18 1970-12-29 Shipley Co Surface finished aluminum alloys
BE788117A (fr) * 1971-08-30 1973-02-28 Perstorp Ab Procede de production d'elements pour circuits imprimes
US3866022A (en) * 1972-12-26 1975-02-11 Nasa System for generating timing and control signals

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2498125A1 (fr) * 1981-01-22 1982-07-23 Gen Electric Stratifie revetu de cuivre et procede de fabrication
WO1985002969A1 (en) * 1983-12-19 1985-07-04 Microclad Laminates Limited Production of copper-clad dielectric boards

Also Published As

Publication number Publication date
FR2227351B1 (xx) 1979-06-15
BE813813A (fr) 1974-08-16
LU69919A1 (xx) 1974-08-06
NL7404748A (xx) 1974-10-29
SE406023B (sv) 1979-01-15
IT1004196B (it) 1976-07-10
SE406023C (sv) 1987-05-04
JPS542179B2 (xx) 1979-02-03
DE2413932A1 (de) 1974-11-14
GB1458260A (en) 1976-12-15
DE2413932C2 (de) 1984-08-30
NL155600B (nl) 1978-01-16
JPS502658A (xx) 1975-01-11

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