US2433441A - Electrolytic production of thin - Google Patents
Electrolytic production of thin Download PDFInfo
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- US2433441A US2433441A US2433441DA US2433441A US 2433441 A US2433441 A US 2433441A US 2433441D A US2433441D A US 2433441DA US 2433441 A US2433441 A US 2433441A
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- Prior art keywords
- foil
- film
- band
- metal
- thin
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- Expired - Lifetime
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- 238000004519 manufacturing process Methods 0.000 title description 16
- 239000011888 foil Substances 0.000 description 78
- 239000002184 metal Substances 0.000 description 66
- 229910052751 metal Inorganic materials 0.000 description 66
- 238000000151 deposition Methods 0.000 description 40
- 239000000463 material Substances 0.000 description 28
- 239000011248 coating agent Substances 0.000 description 24
- 238000000576 coating method Methods 0.000 description 24
- 239000010935 stainless steel Substances 0.000 description 22
- 229910001220 stainless steel Inorganic materials 0.000 description 22
- 238000004140 cleaning Methods 0.000 description 20
- 239000002904 solvent Substances 0.000 description 20
- 238000004049 embossing Methods 0.000 description 18
- 238000009740 moulding (composite fabrication) Methods 0.000 description 18
- 238000007747 plating Methods 0.000 description 14
- 238000005498 polishing Methods 0.000 description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 12
- 229910052737 gold Inorganic materials 0.000 description 12
- 239000010931 gold Substances 0.000 description 12
- 239000011086 glassine Substances 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 230000003014 reinforcing Effects 0.000 description 10
- 238000001035 drying Methods 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N acetic acid ethyl ester Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- 229920002456 HOTAIR Polymers 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000010924 continuous production Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- 238000004513 sizing Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 240000008602 Eucalyptus cornuta Species 0.000 description 2
- 229920001800 Shellac Polymers 0.000 description 2
- 210000002268 Wool Anatomy 0.000 description 2
- 125000003158 alcohol group Chemical group 0.000 description 2
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000001680 brushing Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229960004756 ethanol Drugs 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- -1 gold- Silver Chemical compound 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010907 mechanical stirring Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000000149 penetrating Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004208 shellac Substances 0.000 description 2
- 229940113147 shellac Drugs 0.000 description 2
- 235000013874 shellac Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000001488 sodium phosphate Substances 0.000 description 2
- 229910000162 sodium phosphate Inorganic materials 0.000 description 2
- 239000004753 textile Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 2
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Definitions
- a more specific object is I have further found that the use of other to provide a continuous and uninterrupted process depositing bases is attended by various disadentailing the deposit of the foil on an endless vantages, including the frequent and expensive metal depositing base, the formation of a rein- 10 repreparation of the surface of any relatively forcing film on th foil, the mechanical stripping soft, metal depositing base, such as copper Qr of the foil from the base, the removal of the nickel, as by forming and maintainin thereon reinforcing film from the foil, the backing of a film of an oxide or a sulph e. the foil, and its assembly in roll form for com- I furthermore have found that by the use of flashal use.
- the metal foil so produced may be stainless steel as a depositing base it is not Only of gold, silver, copper, nickel, or alloys of such possible, to secure a continuous deposit which metal, or substantially any metal or alloy which is readily removable me a y wit out marmay be deposited from a plating bath. ring the depositing base and without interrupt.-
- the invention consists possible, by changing the degree and type of of a novel method more fully disclosed in the polish of the stainless steel depositing base to detailed description following and in the accomobtain a desired thickness of the deposited metal. panying drawings and more specifically defined The following table gives the film thicknesses in the claims appended hereto. attainable, with different finishes:
- Approx. 0.000001 Approx. 0.0001-.- Approx. 0.000038.
- AItJDIOX 0.000005 Approx. 0.090005 Approx. 0.000038.
- Approx. 0.000001 Approx. 0.000001 Approx. 0.000015.
- Fig. l is a schematic plan of the apparatus for preparing the metal plating base, for plating the foil thereon, for applying a reinforcing pulloff coating to the foil and for mechanically stripping the reinforced foil from the base.
- Fig. 2 is a preferred apparatus for adding an embossing foil support.
- Fig. 3 is a perspective view of the embossing strip before the null-on coating has been removed
- Fig. l is a perspective view of the completed embossing strip.
- foil of this nature does not in itself possess suificient tensile strength to permit of mechanical stripping without rupture unless it is reinforced by a pull-off film, which is applied to the foil in liquid state.
- This penetrating deposit on the base must be removed. I prefer to remove it by the employment of the apparatus hereinafter disclosed although it also may be removed by a suitable washing in a proper solvent. I also have discovered that the depositing base itself may be so treated as uni formly and continuously to allow the foil to be stripped therefrom.
- I first cause the depositing base to pass under a series of polishing heads which are covered with a textile material, the preferred material being woven of a mixture of soft wool and silk threads which are preferably wetted with a solution of finely suspended alundum so fine that it will not affect the polish of the depositing base but will aid the polishing heads in removing the minute particles of pull-off film which still adhere thereto after the stripping operation.
- a textile material the preferred material being woven of a mixture of soft wool and silk threads which are preferably wetted with a solution of finely suspended alundum so fine that it will not affect the polish of the depositing base but will aid the polishing heads in removing the minute particles of pull-off film which still adhere thereto after the stripping operation.
- I may use open cotton buffs wetted as above,'and rotating against the surface of the depositing base.
- I cause the depositing base to be electrolytically treated, using the depositing base as an anode in an alkaline electrolytic bath.
- This film although preferably an organic material, such as ethyl cellulose dissolved in a mixture comprising 20% ethylalcohol, 40% ethyl acetate and 40% toluol, need not necessarily be organic or thermoplastic but may be any suitable film-forming material having sufficient strength to act as a carrier for the foil and having properties such as solubility, which make it possible, if desired, thereafter to separate the film from the foil.
- organic material such as ethyl cellulose dissolved in a mixture comprising 20% ethylalcohol, 40% ethyl acetate and 40% toluol
- the foil, backed with the film is entirely satisfactory, and in such cases it is unnecessary that the product be further treated.
- the pull-ofi: film has too great strength to allow of clearcut embossing. I overcome this difficulty by entirely removing this film, after having attached to the opposite face of the foil a backing material such as waxed glassine 4 paper and readily separable therefrom during the embossing operation.
- an endless band [0, of the type heretofore disclosed, is mounted on mechanically actuated rollers H for continuous movement.
- the band is continuously advanced during the entire operation.
- a mechanical cleaner I2 is provided with rubbing apparatus, a preferred rubbing apparatus comprising rotatable or reciprocatory polishing heads l3. When the band has been thoroughly cleaned it is washed free of the mixture.
- the cleaned and polished band is then washed again in a washer l5 and treated in an electrolytic bath IS, in which, as disclosed, the band is made the anode in order to obtain passivation. It is then passed through a washer l1, and through a conventional alkaline or other plating tank I8 wherein it is plated with an extremely thin layer of metal.
- the plated band is now washed by passing through a washer I9, in which the washing is continued until the endless band and its plated layer are entirely free of any entrained plating bath fluid, and is then passed through a dryer 20.
- a suitable dryer for accomplishing the desired drying is of the hot air type in which the advancing band is continually met by counterfiowing hot air.
- the dried plated layer is now coated with a film-forming material in a coating apparatus 2
- the coated layer and band are now passed through a second dryer 22, and the coat and the metal layer are mechanically separated in any conventional way from the endless band as indicated by the pull-off mechanism 23, thus producing a continuous metal foil 24 which may be wound in a rolled package 25.
- the endless band continues to advance, and the operations are repeated, the polishing heads I3 now removing any particles of coating material which have penetrated through the pores of the metal layer to adhere to the polished surface of the metal band, during the preceding operation.
- the stainless steel band is thus continuously cleaned, polished, passivated, or anodically treated in an electrochemical bath, plated with a, metal layer, and coated, and the coated metal layer is continuously stripped from the steel band, whereby an endless length of metal foil is obtained although the stainless steel band is of relatively small and fixed length.
- the embossing foil When the embossing foil is desired, it is necessary to remove the pull-off coating, which has too great a film strength to permit cleancut embossing, and substitute a backing having substantially-no film strength, and which is heat-releasable, a preferred material being a very thin size coating of shellac or varnish which is dried to such a physical form as to have no film strength.
- a proper backing material preferably waxed glassine paper, is attached to the face of the foil opposite to that having the to-be-removed pull-01f coating.
- the strip, with its metal foil 24 and the pulloff coating 26, see Fig. 2, is therefore joined to a support 27, which, in the form I prefer, comprises glassine paper 28, having a wax face 29.
- a support 27 which, in the form I prefer, comprises glassine paper 28, having a wax face 29.
- a continuous strip of the waxed support is fed over a heated roller 33, and is pressed against the coated strip 26 by a gravity roller 31 or the like, the waxed surface 29 contacting the metal film 24.
- the waxed surface is softened and is momentarily melted as it contacts the metal film,
- a combined strip 32 see Fig. 3, which has four layers, namely, the pull-ofi coating 26, the metal film 24, the Wax 29, and the glassine paper 28.
- the pull-off coating is now removed by solvent action in a suitable solvent, a preferred method being to pass the combined strip over the surface of a tank containing solvent with the pulloff coating down.
- a suitable solvent for an organic backing such as ethyl cellulose is alcohol, and mechanical stirring of the solvent to hasten the solvent action may be provided if desired.
- the resulting strip see Fig. 4, consists of the metal foil 24, the wax 29, and the glassine paper 28, and is dried; it then receives a final varnish sizing 33 on the metal film surface to complete the embossing strip 34 as illustrated in Fig. 4.
- the varnish sizing may, if desired, be pigmented or dyed.
- a continuous process for the manufacture of extremely thin metal foils comprising the steps of mechanically polishing an endless band of stainless steel, thereafter making the polished band the anode in an alkaline electrolytic bath to passivate the band and maintain it in condition for clean stripping, continuously electroplating a thin layer of metal on the surface of the treated band, applying a reinforcing pull-off film forming material in a solvent directly to the thin layer of electroplated metal, drying the film form ing material, and mechanically stripping the composite strip of thin metal and film from the endless band.
- a continuous process for the manufacture of extremely thin gold foil comprising the steps of mechanically polishing an endless band of stainless steel, thereafter making the polished band the anode in an alkaline electrolytic bath to passivate the band and maintain it in condition for clean stripping, continuously electroplating a thin layer of gold on the surface of the treated band, applying a reinforcing pull-off film forming material in a solvent directly to the thin layer of electroplated gold, drying the film forming material, and mechanically stripping the composite strip of thin gold and film from the endless band.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Description
y M E. ,ww M .Nm. v wfiw Rw w, 4 5% v wztfim WEEEHQ Dec. 30, 1947. c. DAVIDOFF ELECTROLYTIC PRODUCTION OF THIN METAL FOIL w Filed April 1, 1943 Z9555 Eiam E93? E56 Patented Dec. 30, 1947 E'HCE ELECTROLYTIG PRODUCTION F THIN METAL FOIL Charles David fis New York, N. Y., assignor to M. Swift &, Sons, 1110., a corporation of Connecticut Application April 1, 1943, Serial No. 481. L09
less steel, which may be of any suitable length, although a stainless steel drum would serve the same purpose. I have found that an 1 8% (Zr-8% Ni stainless steel depositing base, which has, been film therefrom. It is an object of the invention work-hardened and tempered, has a greater life to provide an improved method for producing an than an annealed ordead soft base. improved metal foil. A more specific object is I have further found that the use of other to provide a continuous and uninterrupted process depositing bases is attended by various disadentailing the deposit of the foil on an endless vantages, including the frequent and expensive metal depositing base, the formation of a rein- 10 repreparation of the surface of any relatively forcing film on th foil, the mechanical stripping soft, metal depositing base, such as copper Qr of the foil from the base, the removal of the nickel, as by forming and maintainin thereon reinforcing film from the foil, the backing of a film of an oxide or a sulph e. the foil, and its assembly in roll form for com- I furthermore have found that by the use of mercial use. The metal foil so produced may be stainless steel as a depositing base it is not Only of gold, silver, copper, nickel, or alloys of such possible, to secure a continuous deposit which metal, or substantially any metal or alloy which is readily removable me a y wit out marmay be deposited from a plating bath. ring the depositing base and without interrupt.-
With the above and other objects and advaning the continuity of the operation, but it also is tageous features in view, the invention consists possible, by changing the degree and type of of a novel method more fully disclosed in the polish of the stainless steel depositing base to detailed description following and in the accomobtain a desired thickness of the deposited metal. panying drawings and more specifically defined The following table gives the film thicknesses in the claims appended hereto. attainable, with different finishes:
. 16 Kar Gold. Description of Finish 24 Karat Gold l(gold- Silver Al- Copper Brass Approx. 0.000014- Approx. 0.000005".
Approx. 0.000001 Approx. 0.0001-.- Approx. 0.000038.
Approx. 0.000025".
AItJDIOX. 0.000005 Approx. 0.090005 Approx. 0.000038.
to 0.00001 0 0.00001. Approx. 0.000001" Approx. 0.000001 Approx. 0.000015.
to. 0.000005". to 0.000005.
In the drawings Fig. l is a schematic plan of the apparatus for preparing the metal plating base, for plating the foil thereon, for applying a reinforcing pulloff coating to the foil and for mechanically stripping the reinforced foil from the base.
Fig. 2 is a preferred apparatus for adding an embossing foil support.
Fig. 3 is a perspective view of the embossing strip before the null-on coating has been removed, and
Fig. l is a perspective view of the completed embossing strip.
By my method have produced a continuous strip of commercial metal foil of any desired length and having any desired width and a thickness within the ranges hereinafter shown. In making such foil I have employed a depositing base in the form of an endless band of stain Up to new stainless steel has not been satisfactorily used so as to permit of its utilization in com mercial practice. This has been due to the fact that frequently the foil adheres so firmly to the base as to malge mechanical stripping therefrom impossible.
I have also found in the manufacture of extremely thin foil of the type with which we are here concerned that another factor frequently makes impossible the continuous deposit of foil upon an endless band or cylinder. This difficulty is occasioned by the fact that foil of this nature does not in itself possess suificient tensile strength to permit of mechanical stripping without rupture unless it is reinforced by a pull-off film, which is applied to the foil in liquid state. Extremely thin foil frequently is porous and While this porosity is ordinarily invisible to the naked eye and does not affect the commercial value of the fi ished prodnot for usual purposes, I have discovered that its pores are penetrated by the liquid pull-off film, which hardens upon and adheres to the depositing base in such way that subsequent electrodeposition thereon is in the form of a powdery mass rather than the desired continuous film.
This penetrating deposit on the base must be removed. I prefer to remove it by the employment of the apparatus hereinafter disclosed although it also may be removed by a suitable washing in a proper solvent. I also have discovered that the depositing base itself may be so treated as uni formly and continuously to allow the foil to be stripped therefrom.
In the preferred practice of my process, I first cause the depositing base to pass under a series of polishing heads which are covered with a textile material, the preferred material being woven of a mixture of soft wool and silk threads which are preferably wetted with a solution of finely suspended alundum so fine that it will not affect the polish of the depositing base but will aid the polishing heads in removing the minute particles of pull-off film which still adhere thereto after the stripping operation. In lieu of the polishing heads as described above, I may use open cotton buffs wetted as above,'and rotating against the surface of the depositing base. Thereafter I cause the depositing base to be electrolytically treated, using the depositing base as an anode in an alkaline electrolytic bath. This continuously passivates the stainless steel band and places it in condition for continuous non-adhering plating and continuous clean stripping. Under conditions of manufacture where there is a probability that foreign particles might adhere to the surface of the base, it may be advantageous to employ a cathodic treatment in order to insure their removal. In any such case such treatment must be followed by an anodie treatment. such anodic electrolytic treatment, the foil will sometimes adhere to the depositing base, or isolated parts thereof. Such treatment additionally serves the purpose of cleaning the surface of the depositing base. Illustrative of such alkaline elec- Without trolytic baths are those composed of sodium hydroxide, sodium carbonate and sodium phosphate, although other alkaline preparations may also be used.
Following the mechanical cleaning and the anodic electrolytic treatment of the depositing base, I cause the latter to be immersed as the oathode in an electrochemical depositing bath of conventional type, after which the depositing base with the foil deposited thereon is immersed in a bath containing the reinforcing pull-off filmin a liquid condition, This film, although preferably an organic material, such as ethyl cellulose dissolved in a mixture comprising 20% ethylalcohol, 40% ethyl acetate and 40% toluol, need not necessarily be organic or thermoplastic but may be any suitable film-forming material having sufficient strength to act as a carrier for the foil and having properties such as solubility, which make it possible, if desired, thereafter to separate the film from the foil. For some commercial applications the foil, backed with the film, is entirely satisfactory, and in such cases it is unnecessary that the product be further treated. In many cases, however, particularly when the foil is to be used for embossing, the pull-ofi: film has too great strength to allow of clearcut embossing. I overcome this difficulty by entirely removing this film, after having attached to the opposite face of the foil a backing material such as waxed glassine 4 paper and readily separable therefrom during the embossing operation.
Referring to the drawings, an endless band [0, of the type heretofore disclosed, is mounted on mechanically actuated rollers H for continuous movement. The band is continuously advanced during the entire operation. A mechanical cleaner I2 is provided with rubbing apparatus, a preferred rubbing apparatus comprising rotatable or reciprocatory polishing heads l3. When the band has been thoroughly cleaned it is washed free of the mixture.
The cleaned and polished band is then washed again in a washer l5 and treated in an electrolytic bath IS, in which, as disclosed, the band is made the anode in order to obtain passivation. It is then passed through a washer l1, and through a conventional alkaline or other plating tank I8 wherein it is plated with an extremely thin layer of metal.
The plated band is now washed by passing through a washer I9, in which the washing is continued until the endless band and its plated layer are entirely free of any entrained plating bath fluid, and is then passed through a dryer 20. I have found that a suitable dryer for accomplishing the desired drying is of the hot air type in which the advancing band is continually met by counterfiowing hot air.
The dried plated layer is now coated with a film-forming material in a coating apparatus 2|. The coated layer and band are now passed through a second dryer 22, and the coat and the metal layer are mechanically separated in any conventional way from the endless band as indicated by the pull-off mechanism 23, thus producing a continuous metal foil 24 which may be wound in a rolled package 25.
The endless band continues to advance, and the operations are repeated, the polishing heads I3 now removing any particles of coating material which have penetrated through the pores of the metal layer to adhere to the polished surface of the metal band, during the preceding operation. The stainless steel band is thus continuously cleaned, polished, passivated, or anodically treated in an electrochemical bath, plated with a, metal layer, and coated, and the coated metal layer is continuously stripped from the steel band, whereby an endless length of metal foil is obtained although the stainless steel band is of relatively small and fixed length.
When the embossing foil is desired, it is necessary to remove the pull-off coating, which has too great a film strength to permit cleancut embossing, and substitute a backing having substantially-no film strength, and which is heat-releasable, a preferred material being a very thin size coating of shellac or varnish which is dried to such a physical form as to have no film strength. Before removing the pull-off coating a proper backing material, preferably waxed glassine paper, is attached to the face of the foil opposite to that having the to-be-removed pull-01f coating.
The strip, with its metal foil 24 and the pulloff coating 26, see Fig. 2, is therefore joined to a support 27, which, in the form I prefer, comprises glassine paper 28, having a wax face 29. A continuous strip of the waxed support is fed over a heated roller 33, and is pressed against the coated strip 26 by a gravity roller 31 or the like, the waxed surface 29 contacting the metal film 24. The waxed surface is softened and is momentarily melted as it contacts the metal film,
and then solidifies as the strips leave the rollers to form a combined strip 32, see Fig. 3, which has four layers, namely, the pull-ofi coating 26, the metal film 24, the Wax 29, and the glassine paper 28.
The pull-off coating is now removed by solvent action in a suitable solvent, a preferred method being to pass the combined strip over the surface of a tank containing solvent with the pulloff coating down. A suitable solvent for an organic backing such as ethyl cellulose is alcohol, and mechanical stirring of the solvent to hasten the solvent action may be provided if desired.
The resulting strip, see Fig. 4, consists of the metal foil 24, the wax 29, and the glassine paper 28, and is dried; it then receives a final varnish sizing 33 on the metal film surface to complete the embossing strip 34 as illustrated in Fig. 4. The varnish sizing may, if desired, be pigmented or dyed.
I claim:
1. A continuous process for the manufacture of extremely thin metal foils, comprising the steps of mechanically polishing an endless band of stainless steel, thereafter making the polished band the anode in an alkaline electrolytic bath to passivate the band and maintain it in condition for clean stripping, continuously electroplating a thin layer of metal on the surface of the treated band, applying a reinforcing pull-off film forming material in a solvent directly to the thin layer of electroplated metal, drying the film form ing material, and mechanically stripping the composite strip of thin metal and film from the endless band.
2. A continuous process for the manufacture of extremely thin gold foil, comprising the steps of mechanically polishing an endless band of stainless steel, thereafter making the polished band the anode in an alkaline electrolytic bath to passivate the band and maintain it in condition for clean stripping, continuously electroplating a thin layer of gold on the surface of the treated band, applying a reinforcing pull-off film forming material in a solvent directly to the thin layer of electroplated gold, drying the film forming material, and mechanically stripping the composite strip of thin gold and film from the endless band.
3. In the electrolyticproduction of thin metal foil by making an endless band of polished stain- 6 less steel the anode in an alkaline electrolytic bath to passivate the band and maintain it in condition for clean stripping, electroplating the metal on the surface of the treated band, applying a film forming material in a solvent directly to the electroplated metal, drying the film forming material, and subsequently mechanically stripping the composite strip of metal-and film from the endless band in foil form, the steps comprising preparing the stainless steel band by first brushing and then butting the same to obtain a surface having a mirror finish, anodically treating said surface in an alkaline electrolytic bath to passivate the band and maintain it in condition for clean stripping, and plating to a thickness of between about .000001 and .000015 of an inch on the treated surface.
CHARLES DAVIDOFF.
REFERENCES CETED The following references are of record in the file of this patent:
UNITED STATES PATENTS Number Name Date 676,357 E ndruweit June 11, 1901 1,287,793 Tillyer et al Dec. 17, 1918 1,425,184 Edison Aug. 8, 1922 1,731,415 Grupe Oct. 15, 1929 1,945,142 Fichtmueller Jan. 30, 1934 1,978,037 Yates Oct. 23, 1934 2,075,332 Antisell Mar. 30, 1937 2,133,685 Coughlin et a1 Oct. 18, 1938 2,282,350 Faust May 12, 1942 1,709,268 Hutchins Apr. 16, 1929 2,325,660 Chamberlain Aug. 3, 1943 1,096,822 Brandt May 19, 1914 2,133,685 Coughlin et al. Oct. 18, 1938 1,970,723 Wolfe Aug. 21, 1934 1,954,473 Dunn Apr. 10, 1934 1,978,151 Van Mater Oct. 23, 1934 2,327,870 Coxe Aug. 24, 1943 OTHER REFERENCES Schweizer Archiv fur Angewandte Wissenschaft und Technik, vol. 4, pages 289 through 293 (1938). Electrometallurgy, Supplement of the Metal Industry, pages 519-521, Nov. 22, 1935.
The Electrochemical Society Preprint 64-8, 1933, pages 83-97.
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Cited By (24)
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US2559926A (en) * | 1947-02-04 | 1951-07-10 | John C Schwartz | Anode basket |
US2646396A (en) * | 1949-03-17 | 1953-07-21 | Reginald S Dean | Method of making electroformed articles |
US2853442A (en) * | 1955-11-18 | 1958-09-23 | Pfaudler Permutit Inc | Method and means of electrolytic plating |
DE1092266B (en) * | 1956-02-24 | 1960-11-03 | Philips Nv | Process for the galvanic production of cobalt foils |
US3332128A (en) * | 1964-04-18 | 1967-07-25 | Mitsui Mining & Smelting Co | Apparatus for peeling electro-deposited metals from cathode plates |
US3397133A (en) * | 1960-03-21 | 1968-08-13 | Benjamin B Doch | Apparatus for producing silver nitrate |
US3457634A (en) * | 1966-03-29 | 1969-07-29 | Sperry Rand Corp | Method for fabricating memory apparatus |
US3619400A (en) * | 1969-12-15 | 1971-11-09 | Norton Co | Electrodeposited metal formation |
US3619383A (en) * | 1970-05-04 | 1971-11-09 | Norton Co | Continuous process of electrodeposition |
DE2413932A1 (en) * | 1973-04-25 | 1974-11-14 | Yates Industries | THIN FILM |
US3887440A (en) * | 1974-01-24 | 1975-06-03 | Mishima Kosan Co Ltd | Method of manufacturing a continuous magnetic foil by electrodeposition |
US3939046A (en) * | 1975-04-29 | 1976-02-17 | Westinghouse Electric Corporation | Method of electroforming on a metal substrate |
US3998601A (en) * | 1973-12-03 | 1976-12-21 | Yates Industries, Inc. | Thin foil |
US4073699A (en) * | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
US4097354A (en) * | 1975-05-12 | 1978-06-27 | Ginatta Marco | Continuous process for electrolytic refining and electrowinning of elements and compounds |
US4108737A (en) * | 1976-03-29 | 1978-08-22 | Battelle-Institute | Method of continuous production of a ductile superconducting material in the form of tapes, foils or wires |
US4113576A (en) * | 1976-06-17 | 1978-09-12 | Hutkin Irving J | Method of making a thin-copper foil-carrier composite |
US4468291A (en) * | 1982-07-14 | 1984-08-28 | Basf Aktiengesellschaft | Continuous production of polypyrrole films |
US4530739A (en) * | 1984-03-09 | 1985-07-23 | Energy Conversion Devices, Inc. | Method of fabricating an electroplated substrate |
US4565607A (en) * | 1984-03-09 | 1986-01-21 | Energy Conversion Devices, Inc. | Method of fabricating an electroplated substrate |
US4789438A (en) * | 1987-06-23 | 1988-12-06 | Olin Corporation | Cathode surface treatment for electroforming metallic foil or strip |
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US5009750A (en) * | 1988-11-15 | 1991-04-23 | Maschinenfabrik Andritz Actiengesellschaft | Process and apparatus for the manufacture of a metal foil |
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US2559926A (en) * | 1947-02-04 | 1951-07-10 | John C Schwartz | Anode basket |
US2646396A (en) * | 1949-03-17 | 1953-07-21 | Reginald S Dean | Method of making electroformed articles |
US2853442A (en) * | 1955-11-18 | 1958-09-23 | Pfaudler Permutit Inc | Method and means of electrolytic plating |
DE1092266B (en) * | 1956-02-24 | 1960-11-03 | Philips Nv | Process for the galvanic production of cobalt foils |
US3397133A (en) * | 1960-03-21 | 1968-08-13 | Benjamin B Doch | Apparatus for producing silver nitrate |
US3332128A (en) * | 1964-04-18 | 1967-07-25 | Mitsui Mining & Smelting Co | Apparatus for peeling electro-deposited metals from cathode plates |
US3457634A (en) * | 1966-03-29 | 1969-07-29 | Sperry Rand Corp | Method for fabricating memory apparatus |
US3619400A (en) * | 1969-12-15 | 1971-11-09 | Norton Co | Electrodeposited metal formation |
US3619383A (en) * | 1970-05-04 | 1971-11-09 | Norton Co | Continuous process of electrodeposition |
DE2413932A1 (en) * | 1973-04-25 | 1974-11-14 | Yates Industries | THIN FILM |
US3998601A (en) * | 1973-12-03 | 1976-12-21 | Yates Industries, Inc. | Thin foil |
US3887440A (en) * | 1974-01-24 | 1975-06-03 | Mishima Kosan Co Ltd | Method of manufacturing a continuous magnetic foil by electrodeposition |
US3939046A (en) * | 1975-04-29 | 1976-02-17 | Westinghouse Electric Corporation | Method of electroforming on a metal substrate |
US4097354A (en) * | 1975-05-12 | 1978-06-27 | Ginatta Marco | Continuous process for electrolytic refining and electrowinning of elements and compounds |
US4073699A (en) * | 1976-03-01 | 1978-02-14 | Hutkin Irving J | Method for making copper foil |
US4108737A (en) * | 1976-03-29 | 1978-08-22 | Battelle-Institute | Method of continuous production of a ductile superconducting material in the form of tapes, foils or wires |
US4113576A (en) * | 1976-06-17 | 1978-09-12 | Hutkin Irving J | Method of making a thin-copper foil-carrier composite |
US4468291A (en) * | 1982-07-14 | 1984-08-28 | Basf Aktiengesellschaft | Continuous production of polypyrrole films |
US4530739A (en) * | 1984-03-09 | 1985-07-23 | Energy Conversion Devices, Inc. | Method of fabricating an electroplated substrate |
US4565607A (en) * | 1984-03-09 | 1986-01-21 | Energy Conversion Devices, Inc. | Method of fabricating an electroplated substrate |
US4789438A (en) * | 1987-06-23 | 1988-12-06 | Olin Corporation | Cathode surface treatment for electroforming metallic foil or strip |
WO1988010327A1 (en) * | 1987-06-23 | 1988-12-29 | Olin Corporation | Cathode surface treatment for electroforming metallic foil or strip |
US5009750A (en) * | 1988-11-15 | 1991-04-23 | Maschinenfabrik Andritz Actiengesellschaft | Process and apparatus for the manufacture of a metal foil |
US5100522A (en) * | 1988-11-15 | 1992-03-31 | Maschinonfabrik Andritz Actiengesellschaft | Process and apparatus for the manufacture of a metal foil |
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US20080115350A1 (en) * | 2006-10-26 | 2008-05-22 | Kerr Roger S | Metal substrate having electronic devices formed thereon |
US20100129965A1 (en) * | 2006-10-26 | 2010-05-27 | Kerr Roger S | Metal substrate having electronic devices formed thereon |
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