FR2224786B1 - - Google Patents

Info

Publication number
FR2224786B1
FR2224786B1 FR7412070A FR7412070A FR2224786B1 FR 2224786 B1 FR2224786 B1 FR 2224786B1 FR 7412070 A FR7412070 A FR 7412070A FR 7412070 A FR7412070 A FR 7412070A FR 2224786 B1 FR2224786 B1 FR 2224786B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7412070A
Other versions
FR2224786A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of FR2224786A1 publication Critical patent/FR2224786A1/fr
Application granted granted Critical
Publication of FR2224786B1 publication Critical patent/FR2224786B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/156—Precursor compound
    • Y10S430/16—Blocked developers
FR7412070A 1973-04-06 1974-04-05 Expired FR2224786B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00348579A US3832176A (en) 1973-04-06 1973-04-06 Novel photoresist article and process for its use

Publications (2)

Publication Number Publication Date
FR2224786A1 FR2224786A1 (fr) 1974-10-31
FR2224786B1 true FR2224786B1 (fr) 1977-03-04

Family

ID=23368632

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7412070A Expired FR2224786B1 (fr) 1973-04-06 1974-04-05

Country Status (6)

Country Link
US (1) US3832176A (fr)
JP (1) JPS5018978A (fr)
BE (1) BE813391A (fr)
CA (1) CA1018814A (fr)
FR (1) FR2224786B1 (fr)
GB (1) GB1460191A (fr)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001061A (en) * 1975-03-05 1977-01-04 International Business Machines Corporation Single lithography for multiple-layer bubble domain devices
US4174216A (en) * 1975-06-03 1979-11-13 E. I. Du Pont De Nemours And Company Process for image reproduction using multilayer photosensitive tonable element
US4022927A (en) * 1975-06-30 1977-05-10 International Business Machines Corporation Methods for forming thick self-supporting masks
US4144108A (en) * 1975-08-26 1979-03-13 Imperial Metal Industries (Kynoch) Limited Support
GB1574910A (en) * 1976-04-07 1980-09-10 Rca Corp Fabrication of diffractive subtractive filter embossing master
GB2000874B (en) * 1977-07-12 1982-02-17 Asahi Chemical Ind Process for producing image and photosensitive element therefor and method of producing printed circuit board
DE2832932A1 (de) * 1978-07-27 1980-02-14 Bosch Gmbh Robert Membran und verfahren zur herstellung einer membran
US4353622A (en) * 1979-06-25 1982-10-12 Rca Corporation Recording blank and method for fabricating therefrom diffractive subtractive filter metal embossing master
US4876178A (en) * 1981-05-11 1989-10-24 Sierracin Corporation Electroconductive film system for aircraft windows
US4707586A (en) * 1981-05-11 1987-11-17 Sierracin Corporation Electro conductive film system for aircraft windows
US4393130A (en) * 1982-01-11 1983-07-12 Critikon, Inc. System for encapsulation of semiconductor chips
FR2531011B1 (fr) * 1982-07-30 1988-05-13 Thomson Csf Representation graphique sur un substrat transparent et son application a la fabrication de circuits imprimes
US4874930A (en) * 1983-09-07 1989-10-17 Sierracin Corporation Electroconductive film system for aircraft windows
US4606788A (en) * 1984-04-12 1986-08-19 Moran Peter L Methods of and apparatus for forming conductive patterns on a substrate
MY101308A (en) * 1986-06-09 1991-09-05 Minnesota Mining & Mfg Presensitized circuit material.
US4902605A (en) * 1987-07-24 1990-02-20 Eastman Kodak Company Photoresist composition comprising cyclohexyleneoxyalkyl acrylates
US4767883A (en) * 1987-07-24 1988-08-30 Eastman Kodak Company Polymerizable cyclohexyleneoxyalkyl acrylates
FR2619984B1 (fr) * 1987-08-24 1996-03-01 Aerospatiale Procede de realisation de circuits imprimes presentant des surfaces complexes a priori non developpables
CH675323A5 (fr) * 1987-12-24 1990-09-14 Contraves Ag
JPH04100294A (ja) * 1990-08-20 1992-04-02 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
US5252195A (en) * 1990-08-20 1993-10-12 Mitsubishi Rayon Company Ltd. Process for producing a printed wiring board
EP0508946B1 (fr) * 1991-04-10 1996-07-24 Dyconex AG Feuille métallique à surface structurée
EP0590205B1 (fr) * 1992-09-30 1995-12-13 Agfa-Gevaert N.V. Matériau d'enregistrement thermosensible pour former des images ou plaques d'impression driographiques
US5376232A (en) * 1993-08-23 1994-12-27 Parlex Corporation Method of manufacturing a printed circuit board
NL9400225A (nl) * 1994-02-14 1995-09-01 Od & Me Bv Werkwijze voor het zonder tussenkomst van een master vervaardigen van een stamper voor het voortbrengen van optische schijven.
WO1996005970A1 (fr) * 1994-08-25 1996-02-29 Parlex Corporation Plaquette a circuit imprime et fabrication de ladite plaquette
TW277204B (fr) * 1994-12-02 1996-06-01 Nippon Paint Co Ltd
US20040137376A1 (en) * 2003-01-15 2004-07-15 Bishop John L. Method and system for replicating film data to a metal substrate and article of manufacture
KR20080019308A (ko) * 2004-01-13 2008-03-03 우베 고산 가부시키가이샤 폴리이미드-금속 적층체 및 폴리이미드 회로 기판
NL1026013C2 (nl) 2004-04-23 2005-10-25 Otb Group Bv Werkwijze en inrichting voor het nauwkeurig aanbrengen van structuren op een substraat.
JP4403049B2 (ja) * 2004-10-13 2010-01-20 日東電工株式会社 配線回路基板の製造方法
EP1783548B1 (fr) * 2005-11-08 2017-03-08 Rohm and Haas Electronic Materials LLC Procédé de formation d'une couche à motifs sur un substrat
TWI311831B (en) * 2006-07-26 2009-07-01 Nan Ya Printed Circuit Board Corporatio Wave-shaped charge collection plate of fuel cells and method of making the same
US20100205804A1 (en) * 2009-02-17 2010-08-19 Alireza Ousati Ashtiani Thick Conductor
KR101221689B1 (ko) * 2009-12-29 2013-01-11 주식회사 엘지화학 발열체 및 이의 제조방법
JP5792746B2 (ja) 2010-02-02 2015-10-14 バイエル・インテレクチュアル・プロパティ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツングＢａｙｅｒ Ｉｎｔｅｌｌｅｃｔｕａｌ Ｐｒｏｐｅｒｔｙ ＧｍｂＨ エステル系書込モノマー含有感光性ポリマー組成物
CN108346952B (zh) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 电连接器固持装置
US11239167B2 (en) 2019-12-04 2022-02-01 International Business Machines Corporation Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate
US11171006B2 (en) * 2019-12-04 2021-11-09 International Business Machines Corporation Simultaneous plating of varying size features on semiconductor substrate

Also Published As

Publication number Publication date
GB1460191A (en) 1976-12-31
FR2224786A1 (fr) 1974-10-31
JPS5018978A (fr) 1975-02-27
BE813391A (fr) 1974-10-07
US3832176A (en) 1974-08-27
CA1018814A (fr) 1977-10-11

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Legal Events

Date Code Title Description
ST Notification of lapse