FR2205745B1 - - Google Patents

Info

Publication number
FR2205745B1
FR2205745B1 FR7339062A FR7339062A FR2205745B1 FR 2205745 B1 FR2205745 B1 FR 2205745B1 FR 7339062 A FR7339062 A FR 7339062A FR 7339062 A FR7339062 A FR 7339062A FR 2205745 B1 FR2205745 B1 FR 2205745B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7339062A
Other languages
French (fr)
Other versions
FR2205745A1 (enFirst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2205745A1 publication Critical patent/FR2205745A1/fr
Application granted granted Critical
Publication of FR2205745B1 publication Critical patent/FR2205745B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
FR7339062A 1972-11-02 1973-11-02 Expired FR2205745B1 (enFirst)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2253627A DE2253627A1 (de) 1972-11-02 1972-11-02 Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement

Publications (2)

Publication Number Publication Date
FR2205745A1 FR2205745A1 (enFirst) 1974-05-31
FR2205745B1 true FR2205745B1 (enFirst) 1978-08-11

Family

ID=5860646

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7339062A Expired FR2205745B1 (enFirst) 1972-11-02 1973-11-02

Country Status (6)

Country Link
JP (1) JPS5638060B2 (enFirst)
DE (1) DE2253627A1 (enFirst)
FR (1) FR2205745B1 (enFirst)
GB (1) GB1443028A (enFirst)
IT (1) IT996899B (enFirst)
NL (1) NL7314802A (enFirst)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272466U (enFirst) * 1975-11-26 1977-05-30
NL7713758A (nl) * 1977-12-13 1979-06-15 Philips Nv Halfgeleiderinrichting.
US4272644A (en) * 1979-09-27 1981-06-09 Hybrid Systems Corporation Electronic hybrid circuit package
DE2942261A1 (de) * 1979-10-19 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
DE3138743A1 (de) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München In einem dichten gehaeuse montiertes oberflaechenwellenfilter und dergleichen
US5072283A (en) * 1988-04-12 1991-12-10 Bolger Justin C Pre-formed chip carrier cavity package
GB2236213A (en) * 1989-09-09 1991-03-27 Ibm Integral protective enclosure for an assembly mounted on a flexible printed circuit board
DE4224103A1 (de) * 1992-07-22 1994-01-27 Manfred Dr Ing Michalk Miniaturgehäuse mit elektronischen Bauelementen
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
US8058719B2 (en) 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads
US8018042B2 (en) 2007-03-23 2011-09-13 Microsemi Corporation Integrated circuit with flexible planar leads
US10068818B2 (en) * 2015-05-20 2018-09-04 Kyocera Corporation Semiconductor element package, semiconductor device, and mounting structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS476963U (enFirst) * 1971-02-13 1972-09-25
JPS4816345U (enFirst) * 1971-07-02 1973-02-23

Also Published As

Publication number Publication date
JPS5638060B2 (enFirst) 1981-09-03
JPS4977172A (enFirst) 1974-07-25
NL7314802A (enFirst) 1974-05-06
GB1443028A (en) 1976-07-21
FR2205745A1 (enFirst) 1974-05-31
IT996899B (it) 1975-12-10
DE2253627A1 (de) 1974-05-16

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Legal Events

Date Code Title Description
ST Notification of lapse