FR2205745A1 - - Google Patents

Info

Publication number
FR2205745A1
FR2205745A1 FR7339062A FR7339062A FR2205745A1 FR 2205745 A1 FR2205745 A1 FR 2205745A1 FR 7339062 A FR7339062 A FR 7339062A FR 7339062 A FR7339062 A FR 7339062A FR 2205745 A1 FR2205745 A1 FR 2205745A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7339062A
Other languages
French (fr)
Other versions
FR2205745B1 (cs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2205745A1 publication Critical patent/FR2205745A1/fr
Application granted granted Critical
Publication of FR2205745B1 publication Critical patent/FR2205745B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR7339062A 1972-11-02 1973-11-02 Expired FR2205745B1 (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722253627 DE2253627A1 (de) 1972-11-02 1972-11-02 Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement

Publications (2)

Publication Number Publication Date
FR2205745A1 true FR2205745A1 (cs) 1974-05-31
FR2205745B1 FR2205745B1 (cs) 1978-08-11

Family

ID=5860646

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7339062A Expired FR2205745B1 (cs) 1972-11-02 1973-11-02

Country Status (6)

Country Link
JP (1) JPS5638060B2 (cs)
DE (1) DE2253627A1 (cs)
FR (1) FR2205745B1 (cs)
GB (1) GB1443028A (cs)
IT (1) IT996899B (cs)
NL (1) NL7314802A (cs)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2412167A1 (fr) * 1977-12-13 1979-07-13 Philips Nv Dispositif semi-conducteur, comportant une feuille mince flexible et isolante
WO1989010005A1 (en) * 1988-04-12 1989-10-19 Bolger Justin C Pre-formed chip carrier cavity package
EP0421599A3 (en) * 1989-09-09 1991-11-21 International Business Machines Corporation Integral protective enclosure for tab device mounted on a flexible printed circuit board
WO1994002960A1 (de) * 1992-07-22 1994-02-03 Manfred Michalk Miniaturgehäuse für elektronische komponenten

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272466U (cs) * 1975-11-26 1977-05-30
US4272644A (en) * 1979-09-27 1981-06-09 Hybrid Systems Corporation Electronic hybrid circuit package
DE2942261A1 (de) * 1979-10-19 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
DE3138743A1 (de) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München In einem dichten gehaeuse montiertes oberflaechenwellenfilter und dergleichen
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
US8018042B2 (en) 2007-03-23 2011-09-13 Microsemi Corporation Integrated circuit with flexible planar leads
US8058719B2 (en) 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads
JP6397127B2 (ja) * 2015-05-20 2018-09-26 京セラ株式会社 半導体素子パッケージ、半導体装置および実装構造体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS476963U (cs) * 1971-02-13 1972-09-25
JPS4816345U (cs) * 1971-07-02 1973-02-23

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2412167A1 (fr) * 1977-12-13 1979-07-13 Philips Nv Dispositif semi-conducteur, comportant une feuille mince flexible et isolante
WO1989010005A1 (en) * 1988-04-12 1989-10-19 Bolger Justin C Pre-formed chip carrier cavity package
EP0421599A3 (en) * 1989-09-09 1991-11-21 International Business Machines Corporation Integral protective enclosure for tab device mounted on a flexible printed circuit board
WO1994002960A1 (de) * 1992-07-22 1994-02-03 Manfred Michalk Miniaturgehäuse für elektronische komponenten

Also Published As

Publication number Publication date
JPS4977172A (cs) 1974-07-25
FR2205745B1 (cs) 1978-08-11
DE2253627A1 (de) 1974-05-16
IT996899B (it) 1975-12-10
NL7314802A (cs) 1974-05-06
JPS5638060B2 (cs) 1981-09-03
GB1443028A (en) 1976-07-21

Similar Documents

Publication Publication Date Title
JPS4977172A (cs)
CH571207A5 (cs)
BG18384A1 (cs)
BG18980A1 (cs)
BG20222A1 (cs)
BG22050A1 (cs)
CH1244273A4 (cs)
CH1285173A4 (cs)
CH133373A4 (cs)
CH560038A5 (cs)
CH561123A5 (cs)
CH561486A5 (cs)
CH561855A5 (cs)
CH561859A5 (cs)
CH561921A (cs)
CH562097A5 (cs)
CH562322A5 (cs)
CH562938A5 (cs)
CH563179A5 (cs)
CH563555A5 (cs)
CH564628A5 (cs)
CH564636A (cs)
CH564840A5 (cs)
CH565082A5 (cs)
CH565653A5 (cs)

Legal Events

Date Code Title Description
ST Notification of lapse