FR2200620A1 - Encapsulated semiconductor devices prodn - using cored polybutadiene mate-rial - Google Patents

Encapsulated semiconductor devices prodn - using cored polybutadiene mate-rial

Info

Publication number
FR2200620A1
FR2200620A1 FR7333840A FR7333840A FR2200620A1 FR 2200620 A1 FR2200620 A1 FR 2200620A1 FR 7333840 A FR7333840 A FR 7333840A FR 7333840 A FR7333840 A FR 7333840A FR 2200620 A1 FR2200620 A1 FR 2200620A1
Authority
FR
France
Prior art keywords
semiconductor devices
polybutadiene
omega
alpha
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7333840A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2200620A1 publication Critical patent/FR2200620A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W74/131—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/45116—Lead (Pb) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H10W72/01515—
    • H10W72/075—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
FR7333840A 1972-09-20 1973-09-20 Encapsulated semiconductor devices prodn - using cored polybutadiene mate-rial Withdrawn FR2200620A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9361972A JPS4951875A (enExample) 1972-09-20 1972-09-20

Publications (1)

Publication Number Publication Date
FR2200620A1 true FR2200620A1 (en) 1974-04-19

Family

ID=14087321

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7333840A Withdrawn FR2200620A1 (en) 1972-09-20 1973-09-20 Encapsulated semiconductor devices prodn - using cored polybutadiene mate-rial

Country Status (4)

Country Link
JP (1) JPS4951875A (enExample)
DE (1) DE2346798A1 (enExample)
FR (1) FR2200620A1 (enExample)
NL (1) NL7312842A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5639543B2 (enExample) * 1975-03-05 1981-09-14
JPS5291756U (enExample) * 1975-12-27 1977-07-08
JPS5740936A (en) * 1980-08-25 1982-03-06 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
DE2346798A1 (de) 1974-04-18
JPS4951875A (enExample) 1974-05-20
NL7312842A (enExample) 1974-03-22

Similar Documents

Publication Publication Date Title
CA987044A (en) Epoxy resin curing agent compositions, their preparation and use
ES410205A1 (es) Un metodo para producir una copia a partir de un documento original.
ES402764A1 (es) Procedimiento de preparacion de una pelicula de envase de soldadura desprendible.
AU463631B2 (en) Storage-stable, rapidly curable epoxide resin composition
CA982467A (en) Substrate encapsulated in a fluorinated polymer containing sulfonyl groups
ATE14380T1 (de) Gegenstand mit klebrigen eigenschaften.
FR2220378B1 (enExample)
IT963328B (it) Procedimento per ridurre il conte nuto di i butene di una miscela polimerica contenente etilene e i butene
FR2200620A1 (en) Encapsulated semiconductor devices prodn - using cored polybutadiene mate-rial
GB1093904A (en) Organosilicon compositions
JPS5272742A (en) Rubber composition
JPS5356233A (en) Water-dispersed adhesive composition
JPS6476741A (en) Semiconductor device
FI47777C (fi) Menetelmä luonnon- tai synteettisen, tyydyttämättömän kumin modifioimi seksi saattamalla kumin etyleenisiin kaksoissidoksiin sitoutumaan karb oksyyliryhmiä tai ryhmiä, jotka on johdettu karboksyyliryhmästä.
FR2282333A1 (fr) Perfectionnements apportes au renforcement d'articles flexibles, notamment en caoutchouc
GB1382703A (en) Delay lines
JPS52172A (en) Semiconductor
JPS5316061A (en) Room temperature curing aqueous resin compositions
KR840008536A (ko) 반도체장치 및 그 제조법
FUKAYA et al. A case report of fibrosalcoma on child mandible
JPS5318960A (en) Bonding method
NL155567B (nl) Bereiding van een hardbaar materiaal op basis van epoxyhars en toepassing daarvan in een oppervlaktelaag voor een buigzaam plaveisel.
JPS52134645A (en) Room temperature curing adhesive compositions
FR2085552A1 (en) Oxadiazine-4-thiones in vulcanizable rubber - compositions
JPS5312941A (en) Curable resin composition

Legal Events

Date Code Title Description
ST Notification of lapse