FR2150334A1 - Impregnating surface to be chemically metallised - with soln contg gold or platinum cpd - Google Patents

Impregnating surface to be chemically metallised - with soln contg gold or platinum cpd

Info

Publication number
FR2150334A1
FR2150334A1 FR7228654A FR7228654A FR2150334A1 FR 2150334 A1 FR2150334 A1 FR 2150334A1 FR 7228654 A FR7228654 A FR 7228654A FR 7228654 A FR7228654 A FR 7228654A FR 2150334 A1 FR2150334 A1 FR 2150334A1
Authority
FR
France
Prior art keywords
cpd
contg
metallised
platinum
chemically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7228654A
Other languages
English (en)
French (fr)
Other versions
FR2150334B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2150334A1 publication Critical patent/FR2150334A1/fr
Application granted granted Critical
Publication of FR2150334B1 publication Critical patent/FR2150334B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
FR7228654A 1971-08-20 1972-08-03 Impregnating surface to be chemically metallised - with soln contg gold or platinum cpd Granted FR2150334A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17362171A 1971-08-20 1971-08-20

Publications (2)

Publication Number Publication Date
FR2150334A1 true FR2150334A1 (en) 1973-04-06
FR2150334B1 FR2150334B1 (enExample) 1974-10-04

Family

ID=22632837

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7228654A Granted FR2150334A1 (en) 1971-08-20 1972-08-03 Impregnating surface to be chemically metallised - with soln contg gold or platinum cpd

Country Status (4)

Country Link
JP (1) JPS4829635A (enExample)
CA (1) CA984236A (enExample)
DE (1) DE2232276C3 (enExample)
FR (1) FR2150334A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3601834A1 (de) * 1986-01-20 1987-07-23 Schering Ag Verfahren zur haftfesten metallisierung von keramischen materialien
JPH0765180B2 (ja) * 1986-06-19 1995-07-12 新光電気工業株式会社 無解電ニツケルめつき用活性化液
DE4042220C2 (de) * 1990-12-29 1995-02-02 Heraeus Noblelight Gmbh Verfahren zur Herstellung von ganzflächigen oder partiellen Goldschichten

Also Published As

Publication number Publication date
CA984236A (en) 1976-02-24
JPS4829635A (enExample) 1973-04-19
DE2232276A1 (de) 1973-02-22
DE2232276C3 (de) 1980-10-23
DE2232276B2 (enExample) 1980-02-28
FR2150334B1 (enExample) 1974-10-04

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Legal Events

Date Code Title Description
ST Notification of lapse