FR2145352A1 - Transistor mfr - with fewer mask alignment steps - Google Patents
Transistor mfr - with fewer mask alignment stepsInfo
- Publication number
- FR2145352A1 FR2145352A1 FR7124909A FR7124909A FR2145352A1 FR 2145352 A1 FR2145352 A1 FR 2145352A1 FR 7124909 A FR7124909 A FR 7124909A FR 7124909 A FR7124909 A FR 7124909A FR 2145352 A1 FR2145352 A1 FR 2145352A1
- Authority
- FR
- France
- Prior art keywords
- layer
- transistor
- emitter
- base
- metallic contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010410 layer Substances 0.000 abstract 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000002019 doping agent Substances 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 230000000873 masking effect Effects 0.000 abstract 1
- 239000011241 protective layer Substances 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Weting (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5381370A | 1970-07-10 | 1970-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2145352A1 true FR2145352A1 (en) | 1973-02-23 |
Family
ID=21986720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7124909A Withdrawn FR2145352A1 (en) | 1970-07-10 | 1971-07-07 | Transistor mfr - with fewer mask alignment steps |
Country Status (4)
| Country | Link |
|---|---|
| BE (1) | BE769785A (enrdf_load_stackoverflow) |
| DE (1) | DE2134385A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2145352A1 (enrdf_load_stackoverflow) |
| NL (1) | NL7109327A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3860461A (en) * | 1973-05-29 | 1975-01-14 | Texas Instruments Inc | Method for fabricating semiconductor devices utilizing composite masking |
| IT1089299B (it) * | 1977-01-26 | 1985-06-18 | Mostek Corp | Procedimento per fabbricare un dispositivo semiconduttore |
-
1971
- 1971-07-06 NL NL7109327A patent/NL7109327A/xx unknown
- 1971-07-07 FR FR7124909A patent/FR2145352A1/fr not_active Withdrawn
- 1971-07-09 BE BE769785A patent/BE769785A/xx unknown
- 1971-07-09 DE DE19712134385 patent/DE2134385A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| BE769785A (fr) | 1972-01-10 |
| DE2134385A1 (de) | 1972-02-03 |
| NL7109327A (enrdf_load_stackoverflow) | 1972-01-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3468728A (en) | Method for forming ohmic contact for a semiconductor device | |
| GB1194159A (en) | Improvements relating to Integrated Circuits. | |
| GB1335814A (en) | Transistor and method of manufacturing the same | |
| GB1418969A (en) | Method of making integrated circuits | |
| GB1198696A (en) | Semiconductor Devices and Methods of Making Them. | |
| US3445303A (en) | Manufacture of semiconductor arrangements using a masking step | |
| US3832247A (en) | Process for manufacturing integrated circuits | |
| GB1093664A (en) | Semiconductor process | |
| US3725150A (en) | Process for making a fine geometry, self-aligned device structure | |
| FR2145352A1 (en) | Transistor mfr - with fewer mask alignment steps | |
| GB1188950A (en) | Semiconductor Device having Insulating Films and Method of Making Same. | |
| US3600642A (en) | Mos structure with precisely controlled channel length and method | |
| US3638079A (en) | Complementary semiconductor devices in monolithic integrated circuits | |
| US3756873A (en) | Method of making a semiconductor device | |
| GB1308764A (en) | Production of semiconductor components | |
| JPS5363878A (en) | Production of semiconductor device | |
| GB1099049A (en) | A method of manufacturing transistors | |
| GB1470804A (en) | Method for fabrucating semiconductor devices utilizing compo site masking | |
| GB1411864A (en) | Method of manufacturing an interconnection pattern | |
| GB1535086A (en) | Manufacture of transistors | |
| US3372071A (en) | Method of forming a small area junction semiconductor | |
| GB1052135A (enrdf_load_stackoverflow) | ||
| US2966720A (en) | Method of forming semiconductive devices | |
| US3398030A (en) | Forming a semiconduuctor device by diffusing | |
| GB993388A (en) | Improvements in or relating to semiconductor devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |