FR2140007A1 - - Google Patents
Info
- Publication number
- FR2140007A1 FR2140007A1 FR7219025A FR7219025A FR2140007A1 FR 2140007 A1 FR2140007 A1 FR 2140007A1 FR 7219025 A FR7219025 A FR 7219025A FR 7219025 A FR7219025 A FR 7219025A FR 2140007 A1 FR2140007 A1 FR 2140007A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H10W20/40—
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- H10D64/0113—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
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- H10P32/1414—
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- H10P32/171—
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- H10P14/6309—
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- H10P14/6322—
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- H10P14/69215—
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- H10P14/6923—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/049—Equivalence and options
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/053—Field effect transistors fets
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/133—Reflow oxides and glasses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/151—Simultaneous diffusion
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3675471A JPS53274B1 (cg-RX-API-DMAC10.html) | 1971-05-28 | 1971-05-28 | |
| JP6113471A JPS55911B2 (cg-RX-API-DMAC10.html) | 1971-08-12 | 1971-08-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2140007A1 true FR2140007A1 (cg-RX-API-DMAC10.html) | 1973-01-12 |
| FR2140007B1 FR2140007B1 (cg-RX-API-DMAC10.html) | 1977-12-23 |
Family
ID=26375846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7219025A Expired FR2140007B1 (cg-RX-API-DMAC10.html) | 1971-05-28 | 1972-05-26 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3837935A (cg-RX-API-DMAC10.html) |
| DE (1) | DE2225374B2 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2140007B1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1388772A (cg-RX-API-DMAC10.html) |
| NL (1) | NL161306C (cg-RX-API-DMAC10.html) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2434485A1 (fr) * | 1978-08-25 | 1980-03-21 | Rca Corp | Configuration de contact enfoui pour circuits integres cmos/sos |
| EP0009910A1 (en) * | 1978-09-20 | 1980-04-16 | Fujitsu Limited | Semiconductor memory device and process for fabricating the device |
| FR2445023A1 (fr) * | 1978-12-23 | 1980-07-18 | Vlsi Technology Res Ass | Procede de fabrication d'un circuit integre contenant du silicium polycristallin |
| EP0022388A1 (fr) * | 1979-07-10 | 1981-01-14 | Thomson-Csf | Procédé de fabrication d'un transistor à effet de champ du type DMOS à fonctionnement vertical |
| FR2492166A1 (fr) * | 1980-10-15 | 1982-04-16 | Philips Nv | Transistor a effet de champ et son procede de fabrication |
| FR2546664A1 (fr) * | 1983-05-27 | 1984-11-30 | American Telephone & Telegraph | Procede de fabrication de transistors a effet de champ |
| EP0268266A3 (en) * | 1986-11-19 | 1990-01-31 | Kabushiki Kaisha Toshiba | Contacts of semiconductor devices |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2640465A1 (de) * | 1976-09-08 | 1978-03-09 | Siemens Ag | Verfahren zur herstellung dotierter zonen in einem halbleitersubstrat |
| US4045259A (en) * | 1976-10-26 | 1977-08-30 | Harris Corporation | Process for fabricating diffused complementary field effect transistors |
| US4277881A (en) * | 1978-05-26 | 1981-07-14 | Rockwell International Corporation | Process for fabrication of high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines |
| US4587711A (en) * | 1978-05-26 | 1986-05-13 | Rockwell International Corporation | Process for high density VLSI circuits, having self-aligned gates and contacts for FET devices and conducting lines |
| US4157269A (en) * | 1978-06-06 | 1979-06-05 | International Business Machines Corporation | Utilizing polysilicon diffusion sources and special masking techniques |
| DE2936724A1 (de) * | 1978-09-11 | 1980-03-20 | Tokyo Shibaura Electric Co | Halbleitervorrichtung und verfahren zu ihrer herstellung |
| JPS57204172A (en) * | 1981-06-08 | 1982-12-14 | Ibm | Field effect transistor |
| US4587709A (en) * | 1983-06-06 | 1986-05-13 | International Business Machines Corporation | Method of making short channel IGFET |
| CA1258320A (en) * | 1985-04-01 | 1989-08-08 | Madhukar B. Vora | Small contactless ram cell |
| GB8719842D0 (en) * | 1987-08-21 | 1987-09-30 | Atomic Energy Authority Uk | Transistor |
| JPH0817173B2 (ja) * | 1993-11-10 | 1996-02-21 | キヤノン販売株式会社 | 成膜方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1152156A (en) * | 1967-03-22 | 1969-05-14 | Rca Corp | Semiconductor Devices |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3519901A (en) * | 1968-01-29 | 1970-07-07 | Texas Instruments Inc | Bi-layer insulation structure including polycrystalline semiconductor material for integrated circuit isolation |
| US3664896A (en) * | 1969-07-28 | 1972-05-23 | David M Duncan | Deposited silicon diffusion sources |
| US3646665A (en) * | 1970-05-22 | 1972-03-07 | Gen Electric | Complementary mis-fet devices and method of fabrication |
| US3699646A (en) * | 1970-12-28 | 1972-10-24 | Intel Corp | Integrated circuit structure and method for making integrated circuit structure |
-
1972
- 1972-05-25 NL NL7207071.A patent/NL161306C/xx not_active IP Right Cessation
- 1972-05-25 DE DE19722225374 patent/DE2225374B2/de not_active Withdrawn
- 1972-05-25 US US00256753A patent/US3837935A/en not_active Expired - Lifetime
- 1972-05-26 FR FR7219025A patent/FR2140007B1/fr not_active Expired
- 1972-05-30 GB GB2533972A patent/GB1388772A/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1152156A (en) * | 1967-03-22 | 1969-05-14 | Rca Corp | Semiconductor Devices |
Non-Patent Citations (1)
| Title |
|---|
| REVUE AMERICAINE "IEEE TRANSACTIONS ON ELECTRON DEVICES" VOLUME ED-17, AOUT 1970 "SILICON CONTACT FOR AREA REDUCTION OF INTEGRATED CIRCUITS" H.C.LIN ET AL,PAGE 636 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2434485A1 (fr) * | 1978-08-25 | 1980-03-21 | Rca Corp | Configuration de contact enfoui pour circuits integres cmos/sos |
| EP0009910A1 (en) * | 1978-09-20 | 1980-04-16 | Fujitsu Limited | Semiconductor memory device and process for fabricating the device |
| FR2445023A1 (fr) * | 1978-12-23 | 1980-07-18 | Vlsi Technology Res Ass | Procede de fabrication d'un circuit integre contenant du silicium polycristallin |
| EP0022388A1 (fr) * | 1979-07-10 | 1981-01-14 | Thomson-Csf | Procédé de fabrication d'un transistor à effet de champ du type DMOS à fonctionnement vertical |
| FR2461360A1 (fr) * | 1979-07-10 | 1981-01-30 | Thomson Csf | Procede de fabrication d'un transistor a effet de champ du type dmos a fonctionnement vertical et transistor obtenu par ce procede |
| FR2492166A1 (fr) * | 1980-10-15 | 1982-04-16 | Philips Nv | Transistor a effet de champ et son procede de fabrication |
| FR2546664A1 (fr) * | 1983-05-27 | 1984-11-30 | American Telephone & Telegraph | Procede de fabrication de transistors a effet de champ |
| EP0268266A3 (en) * | 1986-11-19 | 1990-01-31 | Kabushiki Kaisha Toshiba | Contacts of semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2225374B2 (de) | 1977-06-02 |
| NL161306B (nl) | 1979-08-15 |
| GB1388772A (en) | 1975-03-26 |
| NL161306C (nl) | 1980-01-15 |
| NL7207071A (cg-RX-API-DMAC10.html) | 1972-11-30 |
| DE2225374A1 (de) | 1973-06-20 |
| FR2140007B1 (cg-RX-API-DMAC10.html) | 1977-12-23 |
| US3837935A (en) | 1974-09-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |