FR2122360A1 - Semi-conductor mask oxidising compsn - used prior to soldering of wire connections - Google Patents
Semi-conductor mask oxidising compsn - used prior to soldering of wire connectionsInfo
- Publication number
- FR2122360A1 FR2122360A1 FR7102166A FR7102166A FR2122360A1 FR 2122360 A1 FR2122360 A1 FR 2122360A1 FR 7102166 A FR7102166 A FR 7102166A FR 7102166 A FR7102166 A FR 7102166A FR 2122360 A1 FR2122360 A1 FR 2122360A1
- Authority
- FR
- France
- Prior art keywords
- semi
- oxidising
- compsn
- soldering
- wire connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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Abstract
Oxidising bath for the removal of semi-conductor masking layers consisting fuming nitric acid to which has been added 4 (pref. 0.1-2)% HF based on pure nitric acid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7102166A FR2122360A1 (en) | 1971-01-22 | 1971-01-22 | Semi-conductor mask oxidising compsn - used prior to soldering of wire connections |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7102166A FR2122360A1 (en) | 1971-01-22 | 1971-01-22 | Semi-conductor mask oxidising compsn - used prior to soldering of wire connections |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2122360A1 true FR2122360A1 (en) | 1972-09-01 |
FR2122360B1 FR2122360B1 (en) | 1976-09-03 |
Family
ID=9070741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7102166A Granted FR2122360A1 (en) | 1971-01-22 | 1971-01-22 | Semi-conductor mask oxidising compsn - used prior to soldering of wire connections |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2122360A1 (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3290180A (en) * | 1962-03-09 | 1966-12-06 | Texas Instruments Inc | Method of treating silicon and devices containing pn junctions |
-
1971
- 1971-01-22 FR FR7102166A patent/FR2122360A1/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3290180A (en) * | 1962-03-09 | 1966-12-06 | Texas Instruments Inc | Method of treating silicon and devices containing pn junctions |
Non-Patent Citations (3)
Title |
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(REVUE AMERICAINE"IBM TECHNICAL DISCLOSURE BULLETIN",VOL.9,AVRIL 1967,"REMOVING HARDENED PHOTORESISTS"M.D.PALMER ET AL,PAGE 1484.) * |
1967,"REMOVING HARDENED PHOTORESISTS"M.D.PALMER ET AL,PAGE 1484.) * |
REVUE AMERICAINE"IBM TECHNICAL DISCLOSURE BULLETIN",VOL.9,AVRIL * |
Also Published As
Publication number | Publication date |
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FR2122360B1 (en) | 1976-09-03 |
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Date | Code | Title | Description |
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ST | Notification of lapse |