FR2122360A1 - Semi-conductor mask oxidising compsn - used prior to soldering of wire connections - Google Patents

Semi-conductor mask oxidising compsn - used prior to soldering of wire connections

Info

Publication number
FR2122360A1
FR2122360A1 FR7102166A FR7102166A FR2122360A1 FR 2122360 A1 FR2122360 A1 FR 2122360A1 FR 7102166 A FR7102166 A FR 7102166A FR 7102166 A FR7102166 A FR 7102166A FR 2122360 A1 FR2122360 A1 FR 2122360A1
Authority
FR
France
Prior art keywords
semi
oxidising
compsn
soldering
wire connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7102166A
Other languages
French (fr)
Other versions
FR2122360B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7102166A priority Critical patent/FR2122360A1/en
Publication of FR2122360A1 publication Critical patent/FR2122360A1/en
Application granted granted Critical
Publication of FR2122360B1 publication Critical patent/FR2122360B1/fr
Granted legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/03Manufacturing methods
    • HELECTRICITY
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    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • H01L24/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
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Abstract

Oxidising bath for the removal of semi-conductor masking layers consisting fuming nitric acid to which has been added 4 (pref. 0.1-2)% HF based on pure nitric acid.
FR7102166A 1971-01-22 1971-01-22 Semi-conductor mask oxidising compsn - used prior to soldering of wire connections Granted FR2122360A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7102166A FR2122360A1 (en) 1971-01-22 1971-01-22 Semi-conductor mask oxidising compsn - used prior to soldering of wire connections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7102166A FR2122360A1 (en) 1971-01-22 1971-01-22 Semi-conductor mask oxidising compsn - used prior to soldering of wire connections

Publications (2)

Publication Number Publication Date
FR2122360A1 true FR2122360A1 (en) 1972-09-01
FR2122360B1 FR2122360B1 (en) 1976-09-03

Family

ID=9070741

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7102166A Granted FR2122360A1 (en) 1971-01-22 1971-01-22 Semi-conductor mask oxidising compsn - used prior to soldering of wire connections

Country Status (1)

Country Link
FR (1) FR2122360A1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290180A (en) * 1962-03-09 1966-12-06 Texas Instruments Inc Method of treating silicon and devices containing pn junctions

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3290180A (en) * 1962-03-09 1966-12-06 Texas Instruments Inc Method of treating silicon and devices containing pn junctions

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
(REVUE AMERICAINE"IBM TECHNICAL DISCLOSURE BULLETIN",VOL.9,AVRIL 1967,"REMOVING HARDENED PHOTORESISTS"M.D.PALMER ET AL,PAGE 1484.) *
1967,"REMOVING HARDENED PHOTORESISTS"M.D.PALMER ET AL,PAGE 1484.) *
REVUE AMERICAINE"IBM TECHNICAL DISCLOSURE BULLETIN",VOL.9,AVRIL *

Also Published As

Publication number Publication date
FR2122360B1 (en) 1976-09-03

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