FR2088302B1 - - Google Patents

Info

Publication number
FR2088302B1
FR2088302B1 FR7115623A FR7115623A FR2088302B1 FR 2088302 B1 FR2088302 B1 FR 2088302B1 FR 7115623 A FR7115623 A FR 7115623A FR 7115623 A FR7115623 A FR 7115623A FR 2088302 B1 FR2088302 B1 FR 2088302B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7115623A
Other languages
French (fr)
Other versions
FR2088302A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of FR2088302A1 publication Critical patent/FR2088302A1/fr
Application granted granted Critical
Publication of FR2088302B1 publication Critical patent/FR2088302B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/40Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
    • H10D84/401Combinations of FETs or IGBTs with BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • H10P14/6306
    • H10P14/6322
    • H10P14/6529
FR7115623A 1970-05-04 1971-04-30 Expired FR2088302B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3413770A 1970-05-04 1970-05-04

Publications (2)

Publication Number Publication Date
FR2088302A1 FR2088302A1 (enExample) 1972-01-07
FR2088302B1 true FR2088302B1 (enExample) 1976-12-03

Family

ID=21874544

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7115623A Expired FR2088302B1 (enExample) 1970-05-04 1971-04-30

Country Status (7)

Country Link
JP (1) JPS4913909B1 (enExample)
BE (1) BE766651A (enExample)
CA (1) CA921617A (enExample)
DE (1) DE2120832C3 (enExample)
FR (1) FR2088302B1 (enExample)
GB (1) GB1299811A (enExample)
MY (1) MY7400018A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739058B2 (enExample) * 1973-05-07 1982-08-19
IN145547B (enExample) * 1976-01-12 1978-11-04 Rca Corp
JPS5299538U (enExample) * 1976-01-26 1977-07-27
DE3005384C2 (de) * 1979-02-15 1994-10-27 Texas Instruments Inc Verfahren zum Herstellen einer monolithischen integrierten Halbleiterschaltung
JPS6118348U (ja) * 1984-07-04 1986-02-03 シャープ株式会社 石油燃焼器具

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL210216A (enExample) * 1955-12-02
BE562973A (enExample) * 1956-12-06 1900-01-01
US3556879A (en) * 1968-03-20 1971-01-19 Rca Corp Method of treating semiconductor devices

Also Published As

Publication number Publication date
BE766651A (fr) 1971-10-01
DE2120832A1 (de) 1971-11-25
JPS4913909B1 (enExample) 1974-04-03
CA921617A (en) 1973-02-20
MY7400018A (en) 1974-12-31
FR2088302A1 (enExample) 1972-01-07
GB1299811A (en) 1972-12-13
DE2120832C3 (de) 1982-06-03
DE2120832B2 (de) 1978-11-30

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