FR2082505A5 - - Google Patents
Info
- Publication number
- FR2082505A5 FR2082505A5 FR7009665A FR7009665A FR2082505A5 FR 2082505 A5 FR2082505 A5 FR 2082505A5 FR 7009665 A FR7009665 A FR 7009665A FR 7009665 A FR7009665 A FR 7009665A FR 2082505 A5 FR2082505 A5 FR 2082505A5
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7009665A FR2082505A5 (fr) | 1970-03-18 | 1970-03-18 | |
DE2111732A DE2111732C3 (de) | 1970-03-18 | 1971-03-11 | Vorrichtung zum Gravieren von Gegenständen durch Kathodenzerstäubung mit Ionenaufprall |
JP46014706A JPS5145435B1 (fr) | 1970-03-18 | 1971-03-17 | |
US00125731A US3730873A (en) | 1970-03-18 | 1971-03-18 | Cathode sputtering etching device with movable guard ring |
GB2440371*A GB1342513A (en) | 1970-03-18 | 1971-04-19 | Ion engraving apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7009665A FR2082505A5 (fr) | 1970-03-18 | 1970-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2082505A5 true FR2082505A5 (fr) | 1971-12-10 |
Family
ID=9052447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7009665A Expired FR2082505A5 (fr) | 1970-03-18 | 1970-03-18 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3730873A (fr) |
JP (1) | JPS5145435B1 (fr) |
DE (1) | DE2111732C3 (fr) |
FR (1) | FR2082505A5 (fr) |
GB (1) | GB1342513A (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2232832A1 (en) * | 1973-06-06 | 1975-01-03 | Radiotechnique Compelec | Discharge control in cathodic sputtering - using voltage variation on auxiliary insulated electrode to adjust gas supply |
EP0093316A2 (fr) * | 1982-05-03 | 1983-11-09 | International Business Machines Corporation | Appareil pour le décapage ionique réactif |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2241229C2 (de) * | 1972-08-22 | 1983-01-20 | Leybold-Heraeus GmbH, 5000 Köln | Vorrichtung zum Ätzen von Substraten durch eine Glimmentladung |
US3984301A (en) * | 1973-08-11 | 1976-10-05 | Nippon Electric Varian, Ltd. | Sputter-etching method employing fluorohalogenohydrocarbon etching gas and a planar electrode for a glow discharge |
US3943047A (en) * | 1974-05-10 | 1976-03-09 | Bell Telephone Laboratories, Incorporated | Selective removal of material by sputter etching |
US4169031A (en) * | 1978-01-13 | 1979-09-25 | Polyohm, Inc. | Magnetron sputter cathode assembly |
JPS5687672A (en) * | 1979-12-15 | 1981-07-16 | Anelva Corp | Dry etching apparatus |
US4333814A (en) * | 1979-12-26 | 1982-06-08 | Western Electric Company, Inc. | Methods and apparatus for improving an RF excited reactive gas plasma |
US4309267A (en) * | 1980-07-21 | 1982-01-05 | Bell Telephone Laboratories, Incorporated | Reactive sputter etching apparatus |
DE3045922A1 (de) * | 1980-12-05 | 1982-07-08 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von strukturen von aus siliziden oder aus silizid-polysilizium bestehenden schichten durch reaktives sputteraetzen |
US4362611A (en) * | 1981-07-27 | 1982-12-07 | International Business Machines Corporation | Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield |
US4392932A (en) * | 1981-11-12 | 1983-07-12 | Varian Associates, Inc. | Method for obtaining uniform etch by modulating bias on extension member around radio frequency etch table |
US4392938A (en) * | 1981-11-12 | 1983-07-12 | Varian Associates, Inc. | Radio frequency etch table with biased extension member |
FR2550681B1 (fr) * | 1983-08-12 | 1985-12-06 | Centre Nat Rech Scient | Source d'ions a au moins deux chambres d'ionisation, en particulier pour la formation de faisceaux d'ions chimiquement reactifs |
US4496448A (en) * | 1983-10-13 | 1985-01-29 | At&T Bell Laboratories | Method for fabricating devices with DC bias-controlled reactive ion etching |
US4600489A (en) * | 1984-01-19 | 1986-07-15 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization for non-permeable targets utilizing permeable stop ring |
GB2159753B (en) * | 1984-03-06 | 1988-09-07 | Asm Fico Tooling | Method and apparatus for cleaning lead pins before soldering operations |
US4938859A (en) * | 1984-07-31 | 1990-07-03 | Vacuum Optics Corporation Of Japan | Ion bombardment device with high frequency |
JP2515731B2 (ja) * | 1985-10-25 | 1996-07-10 | 株式会社日立製作所 | 薄膜形成装置および薄膜形成方法 |
US4595484A (en) * | 1985-12-02 | 1986-06-17 | International Business Machines Corporation | Reactive ion etching apparatus |
WO1988001435A1 (fr) * | 1986-08-13 | 1988-02-25 | The Australian National University | Ameliorations apportees a un appareil d'attaque a ions reactifs |
JPS6454733A (en) * | 1987-08-26 | 1989-03-02 | Toshiba Corp | Production device for semiconductor |
JP3033104B2 (ja) * | 1989-11-17 | 2000-04-17 | ソニー株式会社 | エッチング方法 |
DE4025396A1 (de) * | 1990-08-10 | 1992-02-13 | Leybold Ag | Einrichtung fuer die herstellung eines plasmas |
US5662770A (en) | 1993-04-16 | 1997-09-02 | Micron Technology, Inc. | Method and apparatus for improving etch uniformity in remote source plasma reactors with powered wafer chucks |
JP2659919B2 (ja) * | 1994-01-13 | 1997-09-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | プラズマの不均一性を補正するプラズマ装置 |
WO1996031997A1 (fr) * | 1995-04-07 | 1996-10-10 | Seiko Epson Corporation | Equipement de traitement de surface |
US7528386B2 (en) * | 2005-04-21 | 2009-05-05 | Board Of Trustees Of University Of Illinois | Submicron particle removal |
US20090095095A1 (en) * | 2006-11-02 | 2009-04-16 | Tokyo Electron Limited | Microstructure inspecting apparatus, microstructure inspecting method and substrate holding apparatus |
CN113561689A (zh) * | 2021-07-28 | 2021-10-29 | 薛烁 | 一种合成珠宝加工专用雕刻装置 |
-
1970
- 1970-03-18 FR FR7009665A patent/FR2082505A5/fr not_active Expired
-
1971
- 1971-03-11 DE DE2111732A patent/DE2111732C3/de not_active Expired
- 1971-03-17 JP JP46014706A patent/JPS5145435B1/ja active Pending
- 1971-03-18 US US00125731A patent/US3730873A/en not_active Expired - Lifetime
- 1971-04-19 GB GB2440371*A patent/GB1342513A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2232832A1 (en) * | 1973-06-06 | 1975-01-03 | Radiotechnique Compelec | Discharge control in cathodic sputtering - using voltage variation on auxiliary insulated electrode to adjust gas supply |
EP0093316A2 (fr) * | 1982-05-03 | 1983-11-09 | International Business Machines Corporation | Appareil pour le décapage ionique réactif |
EP0093316A3 (en) * | 1982-05-03 | 1984-07-18 | International Business Machines Corporation | Reactive ion etching apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS5145435B1 (fr) | 1976-12-03 |
GB1342513A (en) | 1974-01-03 |
DE2111732A1 (de) | 1971-10-07 |
DE2111732C3 (de) | 1980-05-22 |
US3730873A (en) | 1973-05-01 |
DE2111732B2 (de) | 1979-08-09 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |