FR2064105B1 - - Google Patents

Info

Publication number
FR2064105B1
FR2064105B1 FR707035546A FR7035546A FR2064105B1 FR 2064105 B1 FR2064105 B1 FR 2064105B1 FR 707035546 A FR707035546 A FR 707035546A FR 7035546 A FR7035546 A FR 7035546A FR 2064105 B1 FR2064105 B1 FR 2064105B1
Authority
FR
France
Prior art keywords
wafers
slabs
unitary
stack
repositioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR707035546A
Other languages
English (en)
French (fr)
Other versions
FR2064105A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2064105A1 publication Critical patent/FR2064105A1/fr
Application granted granted Critical
Publication of FR2064105B1 publication Critical patent/FR2064105B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thyristors (AREA)
FR707035546A 1969-10-02 1970-10-01 Expired FR2064105B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86321069A 1969-10-02 1969-10-02

Publications (2)

Publication Number Publication Date
FR2064105A1 FR2064105A1 (enExample) 1971-07-16
FR2064105B1 true FR2064105B1 (enExample) 1974-06-21

Family

ID=25340560

Family Applications (1)

Application Number Title Priority Date Filing Date
FR707035546A Expired FR2064105B1 (enExample) 1969-10-02 1970-10-01

Country Status (7)

Country Link
US (1) US3771025A (enExample)
JP (1) JPS4827498B1 (enExample)
DE (2) DE7036188U (enExample)
FR (1) FR2064105B1 (enExample)
GB (1) GB1327207A (enExample)
IE (1) IE34522B1 (enExample)
SE (1) SE372373B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5116264B2 (enExample) * 1971-10-01 1976-05-22
JPS5310862Y2 (enExample) * 1972-12-28 1978-03-23
DE3248695A1 (de) * 1982-12-30 1984-07-05 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement mit insbesondere zwei drahtfoermigen zuleitungen
JPS59198740A (ja) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp 樹脂封止形半導体複合素子
JPS6060172U (ja) * 1983-09-13 1985-04-26 本田技研工業株式会社 整流器付トランス装置
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
MY114888A (en) * 1994-08-22 2003-02-28 Ibm Method for forming a monolithic electronic module by stacking planar arrays of integrated circuit chips
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL275029A (enExample) * 1961-05-16 1900-01-01
US3274454A (en) * 1961-09-21 1966-09-20 Mallory & Co Inc P R Semiconductor multi-stack for regulating charging of current producing cells
US3383760A (en) * 1965-08-09 1968-05-21 Rca Corp Method of making semiconductor devices
US3422527A (en) * 1965-06-21 1969-01-21 Int Rectifier Corp Method of manufacture of high voltage solar cell
US3416046A (en) * 1965-12-13 1968-12-10 Dickson Electronics Corp Encased zener diode assembly and method of producing same

Also Published As

Publication number Publication date
GB1327207A (en) 1973-08-15
IE34522B1 (en) 1975-05-28
US3771025A (en) 1973-11-06
IE34522L (en) 1971-04-02
FR2064105A1 (enExample) 1971-07-16
DE2048068A1 (de) 1971-04-22
JPS4827498B1 (enExample) 1973-08-23
DE7036188U (de) 1972-05-04
SE372373B (enExample) 1974-12-16

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Legal Events

Date Code Title Description
ST Notification of lapse