FR2061685B1 - - Google Patents

Info

Publication number
FR2061685B1
FR2061685B1 FR7032896A FR7032896A FR2061685B1 FR 2061685 B1 FR2061685 B1 FR 2061685B1 FR 7032896 A FR7032896 A FR 7032896A FR 7032896 A FR7032896 A FR 7032896A FR 2061685 B1 FR2061685 B1 FR 2061685B1
Authority
FR
France
Prior art keywords
substrate
layer
sept
semi
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7032896A
Other languages
English (en)
French (fr)
Other versions
FR2061685A1 (enrdf_load_stackoverflow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2061685A1 publication Critical patent/FR2061685A1/fr
Application granted granted Critical
Publication of FR2061685B1 publication Critical patent/FR2061685B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
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    • H01L2224/484Connecting portions
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    • H01L2224/485Material
    • H01L2224/48505Material at the bonding interface
    • H01L2224/48699Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2924/01005Boron [B]
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    • H01L2924/01006Carbon [C]
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    • H01L2924/01082Lead [Pb]
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    • H01L2924/1306Field-effect transistor [FET]
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    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
FR7032896A 1969-09-12 1970-09-10 Expired FR2061685B1 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6913958.A NL160682C (nl) 1969-09-12 1969-09-12 Veldeffecttransistor met geisoleerde stuurelektrode in omhulling.

Publications (2)

Publication Number Publication Date
FR2061685A1 FR2061685A1 (enrdf_load_stackoverflow) 1971-06-25
FR2061685B1 true FR2061685B1 (enrdf_load_stackoverflow) 1974-03-22

Family

ID=19807901

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7032896A Expired FR2061685B1 (enrdf_load_stackoverflow) 1969-09-12 1970-09-10

Country Status (8)

Country Link
AT (1) AT336081B (enrdf_load_stackoverflow)
BE (1) BE756002A (enrdf_load_stackoverflow)
CH (1) CH506888A (enrdf_load_stackoverflow)
DE (1) DE2043298A1 (enrdf_load_stackoverflow)
FR (1) FR2061685B1 (enrdf_load_stackoverflow)
GB (1) GB1322511A (enrdf_load_stackoverflow)
NL (1) NL160682C (enrdf_load_stackoverflow)
SE (1) SE363542B (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356858A (en) * 1963-06-18 1967-12-05 Fairchild Camera Instr Co Low stand-by power complementary field effect circuitry
US3440500A (en) * 1966-09-26 1969-04-22 Itt High frequency field effect transistor

Also Published As

Publication number Publication date
NL160682C (nl) 1979-11-15
DE2043298A1 (de) 1971-03-18
ATA817070A (de) 1976-08-15
NL6913958A (enrdf_load_stackoverflow) 1971-03-16
BE756002A (fr) 1971-03-10
CH506888A (de) 1971-04-30
GB1322511A (en) 1973-07-04
SE363542B (enrdf_load_stackoverflow) 1974-01-21
FR2061685A1 (enrdf_load_stackoverflow) 1971-06-25
AT336081B (de) 1977-04-12

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