FR2020963B1 - - Google Patents

Info

Publication number
FR2020963B1
FR2020963B1 FR696923605A FR6923605A FR2020963B1 FR 2020963 B1 FR2020963 B1 FR 2020963B1 FR 696923605 A FR696923605 A FR 696923605A FR 6923605 A FR6923605 A FR 6923605A FR 2020963 B1 FR2020963 B1 FR 2020963B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR696923605A
Other versions
FR2020963A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2020963A1 publication Critical patent/FR2020963A1/fr
Application granted granted Critical
Publication of FR2020963B1 publication Critical patent/FR2020963B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686Pulsed laser beam
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B1/00Single-crystal growth directly from the solid state
    • C30B1/02Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02587Structure
    • H01L21/0259Microstructure
    • H01L21/02598Microstructure monocrystalline
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/903Dendrite or web or cage technique
    • Y10S117/904Laser beam
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/037Diffusion-deposition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/071Heating, selective
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/085Isolated-integrated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/122Polycrystalline
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/152Single crystal on amorphous substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR696923605A 1968-10-18 1969-07-08 Expired FR2020963B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US76866468A 1968-10-18 1968-10-18

Publications (2)

Publication Number Publication Date
FR2020963A1 FR2020963A1 (fr) 1970-07-17
FR2020963B1 true FR2020963B1 (fr) 1973-03-16

Family

ID=25083145

Family Applications (1)

Application Number Title Priority Date Filing Date
FR696923605A Expired FR2020963B1 (fr) 1968-10-18 1969-07-08

Country Status (5)

Country Link
US (1) US3585088A (fr)
JP (1) JPS4947630B1 (fr)
DE (1) DE1933690C3 (fr)
FR (1) FR2020963B1 (fr)
GB (1) GB1258657A (fr)

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130437B1 (fr) * 1970-03-25 1976-09-01
BE788894A (fr) * 1971-09-17 1973-01-02 Siemens Ag Couche electriquement conductrice sur base de forte resistivite, procede de fabrication et application d'une telle couchecomme resistance electrique
US4046618A (en) * 1972-12-29 1977-09-06 International Business Machines Corporation Method for preparing large single crystal thin films
US4020221A (en) * 1973-03-28 1977-04-26 Mitsubishi Denki Kabushiki Kaisha Thin film device
JPS544826B2 (fr) * 1974-06-11 1979-03-10
US4151008A (en) * 1974-11-15 1979-04-24 Spire Corporation Method involving pulsed light processing of semiconductor devices
US4059461A (en) * 1975-12-10 1977-11-22 Massachusetts Institute Of Technology Method for improving the crystallinity of semiconductor films by laser beam scanning and the products thereof
US4152535A (en) * 1976-07-06 1979-05-01 The Boeing Company Continuous process for fabricating solar cells and the product produced thereby
US4137100A (en) * 1977-10-26 1979-01-30 Western Electric Company Forming isolation and device regions due to enhanced diffusion of impurities in semiconductor material by laser
EP0002109B1 (fr) * 1977-11-15 1981-12-02 Imperial Chemical Industries Plc Procédé pour la fabrication des couches minces et photoconductives et des cellules solaires en employant lesdites couches minces et photoconductives
US4154625A (en) * 1977-11-16 1979-05-15 Bell Telephone Laboratories, Incorporated Annealing of uncapped compound semiconductor materials by pulsed energy deposition
US4240843A (en) * 1978-05-23 1980-12-23 Western Electric Company, Inc. Forming self-guarded p-n junctions by epitaxial regrowth of amorphous regions using selective radiation annealing
US4179310A (en) * 1978-07-03 1979-12-18 National Semiconductor Corporation Laser trim protection process
US4147563A (en) * 1978-08-09 1979-04-03 The United States Of America As Represented By The United States Department Of Energy Method for forming p-n junctions and solar-cells by laser-beam processing
US4155779A (en) * 1978-08-21 1979-05-22 Bell Telephone Laboratories, Incorporated Control techniques for annealing semiconductors
DE2837750A1 (de) * 1978-08-30 1980-03-13 Philips Patentverwaltung Verfahhren zum herstellen von halbleiterbauelementen
US4214918A (en) * 1978-10-12 1980-07-29 Stanford University Method of forming polycrystalline semiconductor interconnections, resistors and contacts by applying radiation beam
US4198246A (en) * 1978-11-27 1980-04-15 Rca Corporation Pulsed laser irradiation for reducing resistivity of a doped polycrystalline silicon film
WO1980001121A1 (fr) * 1978-11-28 1980-05-29 Western Electric Co Recuit de materiau par laser a double longueur d'onde
JPS55115341A (en) * 1979-02-28 1980-09-05 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
US4234358A (en) * 1979-04-05 1980-11-18 Western Electric Company, Inc. Patterned epitaxial regrowth using overlapping pulsed irradiation
US4272880A (en) * 1979-04-20 1981-06-16 Intel Corporation MOS/SOS Process
US5122223A (en) * 1979-05-29 1992-06-16 Massachusetts Institute Of Technology Graphoepitaxy using energy beams
US4402787A (en) * 1979-05-31 1983-09-06 Ngk Insulators, Ltd. Method for producing a single crystal
DE2924920A1 (de) * 1979-06-20 1981-01-22 Siemens Ag Verfahren zur herstellung grobkristalliner oder einkristalliner metalloder legierungsschichten
DE3072182D1 (de) * 1979-07-24 1990-12-06 Hughes Aircraft Co Verfahren zur laserbehandlung fuer "silizium auf saphir".
US4341569A (en) * 1979-07-24 1982-07-27 Hughes Aircraft Company Semiconductor on insulator laser process
JPS5640275A (en) * 1979-09-12 1981-04-16 Hitachi Ltd Preparation of semiconductor device
US4309225A (en) * 1979-09-13 1982-01-05 Massachusetts Institute Of Technology Method of crystallizing amorphous material with a moving energy beam
EP0028739B1 (fr) * 1979-11-13 1985-03-27 International Business Machines Corporation Procédé de formation de l'émetteur d'un transistor
US4257827A (en) * 1979-11-13 1981-03-24 International Business Machines Corporation High efficiency gettering in silicon through localized superheated melt formation
US4269631A (en) * 1980-01-14 1981-05-26 International Business Machines Corporation Selective epitaxy method using laser annealing for making filamentary transistors
US4345967A (en) * 1980-03-04 1982-08-24 Cook Melvin S Method of producing thin single-crystal sheets
DE3003285A1 (de) * 1980-01-30 1981-08-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen niederohmiger, einkristalliner metall- oder legierungsschichten auf substraten
JPS5713777A (en) 1980-06-30 1982-01-23 Shunpei Yamazaki Semiconductor device and manufacture thereof
US5091334A (en) * 1980-03-03 1992-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US4381201A (en) * 1980-03-11 1983-04-26 Fujitsu Limited Method for production of semiconductor devices
JPS56145198A (en) * 1980-04-04 1981-11-11 Hitachi Ltd Forming method of single crystal silicon membrane and device therefor
JPS56155100A (en) * 1980-05-02 1981-12-01 Ngk Insulators Ltd Production of single crystal of ferrite
US4323417A (en) * 1980-05-06 1982-04-06 Texas Instruments Incorporated Method of producing monocrystal on insulator
US4284659A (en) * 1980-05-12 1981-08-18 Bell Telephone Laboratories Insulation layer reflow
US4308078A (en) * 1980-06-06 1981-12-29 Cook Melvin S Method of producing single-crystal semiconductor films by laser treatment
US4379020A (en) * 1980-06-16 1983-04-05 Massachusetts Institute Of Technology Polycrystalline semiconductor processing
US6900463B1 (en) 1980-06-30 2005-05-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US5859443A (en) * 1980-06-30 1999-01-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US5262350A (en) * 1980-06-30 1993-11-16 Semiconductor Energy Laboratory Co., Ltd. Forming a non single crystal semiconductor layer by using an electric current
DE3028111A1 (de) * 1980-07-24 1982-02-18 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement und seine verwendung fuer statische 6-transistorzelle
US4803528A (en) * 1980-07-28 1989-02-07 General Electric Company Insulating film having electrically conducting portions
EP0045551B1 (fr) * 1980-08-05 1984-10-31 L'Etat belge, représenté par le Secrétaire Général des Services de la Programmation de la Politique Scientifique Procédé de préparation de films polycristallins semi-conducteurs composés ou élémentaires et films ainsi obtenus
JPS5734331A (en) * 1980-08-11 1982-02-24 Toshiba Corp Manufacture of semiconductor device
US4325777A (en) * 1980-08-14 1982-04-20 Olin Corporation Method and apparatus for reforming an improved strip of material from a starter strip of material
US4330363A (en) * 1980-08-28 1982-05-18 Xerox Corporation Thermal gradient control for enhanced laser induced crystallization of predefined semiconductor areas
EP0048514B1 (fr) * 1980-09-18 1984-07-18 L'Etat belge, représenté par le Secrétaire Général des Services de la Programmation de la Politique Scientifique Procédé de cristallisation de films et films ainsi obtenus
US4303463A (en) * 1980-09-29 1981-12-01 Cook Melvin S Method of peeling thin films using directional heat flow
US4410392A (en) * 1980-10-06 1983-10-18 Olin Corporation Process for restructuring thin strip semi-conductor material
US4400715A (en) * 1980-11-19 1983-08-23 International Business Machines Corporation Thin film semiconductor device and method for manufacture
JPS5792591A (en) * 1980-11-28 1982-06-09 Ngk Insulators Ltd Production of single crystal
EP0087426B1 (fr) * 1981-04-16 1989-07-26 Massachusetts Institute Of Technology Croissance epitaxiale laterale a l'aide d'une solidification provoquee par des germes
US4371421A (en) * 1981-04-16 1983-02-01 Massachusetts Institute Of Technology Lateral epitaxial growth by seeded solidification
JPS57192081A (en) * 1981-05-19 1982-11-26 Ibm Field effect transistor unit
US4448632A (en) * 1981-05-25 1984-05-15 Mitsubishi Denki Kabushiki Kaisha Method of fabricating semiconductor devices
US4494300A (en) * 1981-06-30 1985-01-22 International Business Machines, Inc. Process for forming transistors using silicon ribbons as substrates
US4388145A (en) * 1981-10-29 1983-06-14 Xerox Corporation Laser annealing for growth of single crystal semiconductor areas
US4565599A (en) * 1981-12-21 1986-01-21 Massachusetts Institute Of Technology Graphoepitaxy by encapsulation
US4396456A (en) * 1981-12-21 1983-08-02 Cook Melvin S Method of peeling epilayers
US4450041A (en) * 1982-06-21 1984-05-22 The United States Of America As Represented By The Secretary Of The Navy Chemical etching of transformed structures
US4477308A (en) * 1982-09-30 1984-10-16 At&T Bell Laboratories Heteroepitaxy of multiconstituent material by means of a _template layer
JPS59205711A (ja) * 1983-03-31 1984-11-21 Fujitsu Ltd 半導体装置の製造方法
US4476150A (en) * 1983-05-20 1984-10-09 The United States Of America As Represented By The Secretary Of The Army Process of and apparatus for laser annealing of film-like surface layers of chemical vapor deposited silicon carbide and silicon nitride
US4555301A (en) * 1983-06-20 1985-11-26 At&T Bell Laboratories Formation of heterostructures by pulsed melting of precursor material
US4549913A (en) * 1984-01-27 1985-10-29 Sony Corporation Wafer construction for making single-crystal semiconductor device
US4555300A (en) * 1984-02-21 1985-11-26 North American Philips Corporation Method for producing single crystal layers on insulators
US4602422A (en) * 1984-06-18 1986-07-29 Khanh Dinh Flash compression process for making photovoltaic cells
US5363799A (en) * 1987-08-08 1994-11-15 Canon Kabushiki Kaisha Method for growth of crystal
DE3730644A1 (de) * 1987-09-11 1989-03-30 Baeuerle Dieter Verfahren zur vorgegeben strukturierten abscheidung von mikrostrukturen mit laserlicht
DE3834963A1 (de) * 1988-01-27 1989-08-10 Siemens Ag Verfahren zur epitaktischen herstellung einer schicht aus einem metalloxidischen supraleitermaterial mit hoher sprungtemperatur
US5238879A (en) * 1988-03-24 1993-08-24 Siemens Aktiengesellschaft Method for the production of polycrystalline layers having granular crystalline structure for thin-film semiconductor components such as solar cells
US5190613A (en) * 1988-10-02 1993-03-02 Canon Kabushiki Kaisha Method for forming crystals
JP2858434B2 (ja) * 1989-03-31 1999-02-17 キヤノン株式会社 結晶の形成方法および結晶物品
US5597411A (en) * 1991-02-19 1997-01-28 Energy Conversion Devices, Inc. Method of forming a single crystal material
US6562672B2 (en) 1991-03-18 2003-05-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor material and method for forming the same and thin film transistor
US5373803A (en) * 1991-10-04 1994-12-20 Sony Corporation Method of epitaxial growth of semiconductor
US5338388A (en) * 1992-05-04 1994-08-16 Mitsubishi Denki Kabushiki Kaisha Method of forming single-crystal semiconductor films
US5290368A (en) * 1992-02-28 1994-03-01 Ingersoll-Rand Company Process for producing crack-free nitride-hardened surface on titanium by laser beams
JP3573811B2 (ja) * 1994-12-19 2004-10-06 株式会社半導体エネルギー研究所 線状レーザー光の照射方法
TW305063B (fr) * 1995-02-02 1997-05-11 Handotai Energy Kenkyusho Kk
GB9819338D0 (en) * 1998-09-04 1998-10-28 Philips Electronics Nv Laser crystallisation of thin films
JP3542014B2 (ja) * 1998-09-21 2004-07-14 セントラル硝子株式会社 単結晶または多結晶含有非晶質材料の作製方法及びその非晶質材料
DE10005484B4 (de) * 2000-02-08 2004-07-29 Rwe Schott Solar Gmbh Verfahren zum Ausbilden einer dünnen kristallisierten Schicht
US6847006B2 (en) * 2001-08-10 2005-01-25 Semiconductor Energy Laboratory Co., Ltd. Laser annealing apparatus and semiconductor device manufacturing method
DE10217876A1 (de) * 2002-04-22 2003-11-06 Infineon Technologies Ag Verfahren zur Herstellung dünner metallhaltiger Schichten mit geringem elektrischen Widerstand
US7294874B2 (en) * 2003-08-15 2007-11-13 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation method, method for manufacturing a semiconductor device, and a semiconductor device
JP7085194B2 (ja) * 2018-05-17 2022-06-16 大学共同利用機関法人自然科学研究機構 物質生成方法

Also Published As

Publication number Publication date
DE1933690B2 (fr) 1979-06-28
JPS4947630B1 (fr) 1974-12-17
DE1933690C3 (de) 1980-03-06
US3585088A (en) 1971-06-15
GB1258657A (fr) 1971-12-30
DE1933690A1 (de) 1970-04-30
FR2020963A1 (fr) 1970-07-17

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