FR1598452A - - Google Patents

Info

Publication number
FR1598452A
FR1598452A FR1598452DA FR1598452A FR 1598452 A FR1598452 A FR 1598452A FR 1598452D A FR1598452D A FR 1598452DA FR 1598452 A FR1598452 A FR 1598452A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1598452A publication Critical patent/FR1598452A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P34/00—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices
    • H10P34/40—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation
    • H10P34/42—Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices with high-energy radiation with electromagnetic radiation, e.g. laser annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
FR1598452D 1967-12-19 1968-12-16 Expired FR1598452A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69188367A 1967-12-19 1967-12-19

Publications (1)

Publication Number Publication Date
FR1598452A true FR1598452A (enExample) 1970-07-06

Family

ID=24778354

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1598452D Expired FR1598452A (enExample) 1967-12-19 1968-12-16

Country Status (7)

Country Link
US (1) US3629545A (enExample)
BE (1) BE725595A (enExample)
DE (1) DE1815129A1 (enExample)
FR (1) FR1598452A (enExample)
GB (1) GB1254120A (enExample)
NL (1) NL157455B (enExample)
SE (1) SE350921B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2081018A1 (enExample) * 1970-02-19 1971-11-26 Western Electric Co

Families Citing this family (59)

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US3828159A (en) * 1970-01-19 1974-08-06 Hughes Aircraft Co Laser cutting surface
US4020317A (en) * 1971-12-10 1977-04-26 New Mexico Tech Research Foundation Method of mining rock with an electron beam
US4328411A (en) * 1980-04-28 1982-05-04 General Electric Company Cutting amorphous metal by crystallization with a laser or electron beam
US4401876A (en) 1980-05-20 1983-08-30 Martin Cooper Working gemstones
FR2557732B1 (fr) * 1983-12-28 1986-04-11 Lefevre Rene Procede de realisation de dispositifs piezoelectriques miniatures utilisant un usinage par laser et dispositifs obtenus par ce procede
NL8800334A (nl) * 1988-02-11 1989-09-01 Philips Nv Werkwijze voor het in tweeen delen van een voorwerp vervaardigd van een bros materiaal in het bijzonder een ringkern van ferromagnetisch materiaal voor een afbuigeenheid voor een beeldbuis en afbuigeenheid voor een beeldbuis voorzien van een ringkern gedeeld volgens zulk een werkwijze.
BG46808A1 (en) * 1988-05-27 1990-03-15 Univ Plovdivski Device for laser engraving
US5132505A (en) * 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5387776A (en) * 1993-05-11 1995-02-07 General Electric Company Method of separation of pieces from super hard material by partial laser cut and pressure cleavage
US5871134A (en) * 1994-12-27 1999-02-16 Asahi Glass Company Ltd. Method and apparatus for breaking and cutting a glass ribbon
KR970008386A (ko) * 1995-07-07 1997-02-24 하라 세이지 기판의 할단(割斷)방법 및 그 할단장치
US5641416A (en) * 1995-10-25 1997-06-24 Micron Display Technology, Inc. Method for particulate-free energy beam cutting of a wafer of die assemblies
US5932119A (en) 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system
JPH10128567A (ja) * 1996-10-30 1998-05-19 Nec Kansai Ltd レーザ割断方法
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6259058B1 (en) 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6420678B1 (en) 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
AU1227501A (en) * 1999-11-01 2001-05-14 P.T.G. Precision Technology Center Llc Laser driven glass cut-initiation
JP3895179B2 (ja) 1999-11-24 2007-03-22 アプライド・フォトニクス・インコーポレーテッド 非金属基板を分離する方法及び装置
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
FR2819505B1 (fr) † 2001-01-12 2003-02-28 Saint Gobain Procede de decoupe des bords d'un ruban continu de verre, dispositif de mise en oeuvre, plateau de verre decoupe selon ce procede
CN1328002C (zh) 2002-03-12 2007-07-25 浜松光子学株式会社 加工对象物切割方法
TWI326626B (en) * 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
CN101335235B (zh) 2002-03-12 2010-10-13 浜松光子学株式会社 基板的分割方法
US6919531B2 (en) * 2002-03-25 2005-07-19 Agilent Technologies, Inc. Methods for producing glass substrates for use in biopolymeric microarrays
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
TWI248244B (en) * 2003-02-19 2006-01-21 J P Sercel Associates Inc System and method for cutting using a variable astigmatic focal beam spot
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
DE60315515T2 (de) 2003-03-12 2007-12-13 Hamamatsu Photonics K.K., Hamamatsu Laserstrahlbearbeitungsverfahren
WO2005007335A1 (ja) * 2003-07-18 2005-01-27 Hamamatsu Photonics K.K. レーザ加工方法、レーザ加工装置、及び加工生産物
JP4563097B2 (ja) * 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP4598407B2 (ja) 2004-01-09 2010-12-15 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4601965B2 (ja) 2004-01-09 2010-12-22 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP4509578B2 (ja) 2004-01-09 2010-07-21 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
KR101043674B1 (ko) * 2004-05-11 2011-06-23 엘지디스플레이 주식회사 스크라이빙 장치 및 방법
US7087463B2 (en) * 2004-08-04 2006-08-08 Gelcore, Llc Laser separation of encapsulated submount
WO2006025994A2 (en) * 2004-08-31 2006-03-09 Gyrotron Technology, Inc. A method of separating non-metallic material using microwave radiation
JP2006108428A (ja) * 2004-10-06 2006-04-20 Disco Abrasive Syst Ltd ウェーハの分割方法
US20080236199A1 (en) * 2005-07-28 2008-10-02 Vladislav Sklyarevich Method of Separating Non-Metallic Material Using Microwave Radiation
WO2010064997A1 (en) * 2008-12-05 2010-06-10 Agency For Science, Technology And Research A wafer cutting method and a system thereof
US8269138B2 (en) 2009-05-21 2012-09-18 Corning Incorporated Method for separating a sheet of brittle material
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
CN102639280A (zh) * 2009-12-07 2012-08-15 Jp赛席尔联合股份有限公司 激光加工及切割系统与方法
US20130256286A1 (en) * 2009-12-07 2013-10-03 Ipg Microsystems Llc Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
JP2012089709A (ja) * 2010-10-20 2012-05-10 Disco Abrasive Syst Ltd ワークの分割方法
US8584490B2 (en) 2011-02-18 2013-11-19 Corning Incorporated Laser cutting method
US9034458B2 (en) 2011-05-27 2015-05-19 Corning Incorporated Edge-protected product and finishing method
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
DE102012111698A1 (de) 2012-12-03 2014-03-20 Solarworld Innovations Gmbh Verfahren und Vorrichtung zum Bearbeiten mindestens eines kristallinen Silizium-Wafers oder eines Solarzellen-Wafers
DE102015000449A1 (de) 2015-01-15 2016-07-21 Siltectra Gmbh Festkörperteilung mittels Stoffumwandlung
EP3050890A1 (de) 2015-01-27 2016-08-03 LANXESS Deutschland GmbH Hydroxylgruppen-haltige Poly(alkylenphosphate)
CN109732198B (zh) * 2019-01-31 2020-05-19 华中科技大学 一种硬脆材料双光束热裂加工装置及方法
CN111844478B (zh) * 2020-06-29 2022-03-18 深圳市鸿昇自动化设备有限公司 一种手机屏幕切割加工设备及手机屏幕切割加工方法

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NL299821A (enExample) * 1962-10-31 1900-01-01
US3293652A (en) * 1964-02-20 1966-12-20 Ibm Selective piercing of sheet material
US3369101A (en) * 1964-04-30 1968-02-13 United Aircraft Corp Laser micro-processer
US3410979A (en) * 1964-05-28 1968-11-12 Burroughs Corp Method and apparatus for drilling holes by means of a focused laser beam
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2081018A1 (enExample) * 1970-02-19 1971-11-26 Western Electric Co

Also Published As

Publication number Publication date
NL157455B (nl) 1978-07-17
NL6818043A (enExample) 1969-06-23
GB1254120A (en) 1971-11-17
DE1815129A1 (de) 1969-08-14
BE725595A (enExample) 1969-05-29
US3629545A (en) 1971-12-21
SE350921B (enExample) 1972-11-13

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Legal Events

Date Code Title Description
ST Notification of lapse