FR1551296A - - Google Patents

Info

Publication number
FR1551296A
FR1551296A FR1551296DA FR1551296A FR 1551296 A FR1551296 A FR 1551296A FR 1551296D A FR1551296D A FR 1551296DA FR 1551296 A FR1551296 A FR 1551296A
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FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1551296A publication Critical patent/FR1551296A/fr
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/32—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head
    • G03G15/321—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by charge transfer onto the recording material in accordance with the image
    • G03G15/323—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by charge transfer onto the recording material in accordance with the image by modulating charged particles through holes or a slit
FR1551296D 1966-12-19 1967-12-19 Expired FR1551296A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60278766A 1966-12-19 1966-12-19

Publications (1)

Publication Number Publication Date
FR1551296A true FR1551296A (fr) 1968-12-27

Family

ID=24412807

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1551296D Expired FR1551296A (fr) 1966-12-19 1967-12-19

Country Status (9)

Country Link
US (1) US3495269A (fr)
AT (1) AT309208B (fr)
BE (1) BE707986A (fr)
DE (1) DE1597899A1 (fr)
ES (1) ES348328A1 (fr)
FR (1) FR1551296A (fr)
GB (1) GB1205790A (fr)
NL (1) NL153686B (fr)
SE (1) SE346867B (fr)

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US3725951A (en) * 1971-06-16 1973-04-03 Ibm Electro-ionic printing
US3978492A (en) * 1971-09-25 1976-08-31 Agfa-Gevaert, A.G. Process for the electrographic recording of charge images in a low electron affinity case
US3742516A (en) * 1972-03-16 1973-06-26 Ibm Electro-ionic printing apparatus
US4245272A (en) * 1979-04-30 1981-01-13 Eastman Kodak Company Apparatus and method for low sensitivity corona charging of a moving photoconductor
US4463363A (en) * 1982-07-06 1984-07-31 Xerox Corporation Fluid assisted ion projection printing
US4762997A (en) * 1983-11-30 1988-08-09 Xerox Corporation Fluid jet assisted ion projection charging method
US4734721A (en) * 1985-10-04 1988-03-29 Markem Corporation Electrostatic printer utilizing dehumidified air
US4772901A (en) * 1986-07-29 1988-09-20 Markem Corporation Electrostatic printing utilizing dehumidified air
US4809027A (en) * 1986-07-29 1989-02-28 Markem Corporation Offset electrostatic printing utilizing a heated air flow
US4809026A (en) * 1986-07-29 1989-02-28 Markem Corporation Electrostatic printing utilizing a heated air flow
US6759255B2 (en) 2000-05-10 2004-07-06 Kla-Tencor Technologies Corp. Method and system for detecting metal contamination on a semiconductor wafer
US7012438B1 (en) 2002-07-10 2006-03-14 Kla-Tencor Technologies Corp. Methods and systems for determining a property of an insulating film
US7064565B1 (en) 2002-10-31 2006-06-20 Kla-Tencor Technologies Corp. Methods and systems for determining an electrical property of an insulating film
US7248062B1 (en) 2002-11-04 2007-07-24 Kla-Tencor Technologies Corp. Contactless charge measurement of product wafers and control of corona generation and deposition
US7103484B1 (en) 2003-10-31 2006-09-05 Kla-Tencor Technologies Corp. Non-contact methods for measuring electrical thickness and determining nitrogen content of insulating films
KR101056142B1 (ko) * 2004-01-29 2011-08-10 케이엘에이-텐코 코포레이션 레티클 설계 데이터의 결함을 검출하기 위한 컴퓨터로구현되는 방법
JP4904034B2 (ja) * 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
DE102005032601A1 (de) * 2005-01-07 2006-07-20 Heidelberger Druckmaschinen Ag Druckmaschine
US7769225B2 (en) 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
US7893703B2 (en) * 2005-08-19 2011-02-22 Kla-Tencor Technologies Corp. Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
WO2008077100A2 (fr) 2006-12-19 2008-06-26 Kla-Tencor Corporation Systèmes et procédés de création de procédures de contrôle
WO2008086282A2 (fr) * 2007-01-05 2008-07-17 Kla-Tencor Corporation Procédés et systèmes pour utiliser des informations électriques dans le cadre de la fabrication d'un dispositif sur une tranche afin d'accomplir une ou plusieurs fonctions liées à des défauts
US7962863B2 (en) * 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US7738093B2 (en) * 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US8213704B2 (en) * 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) * 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
CN101785009B (zh) * 2007-08-20 2012-10-10 恪纳腾公司 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法
US8139844B2 (en) * 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
KR101841897B1 (ko) * 2008-07-28 2018-03-23 케이엘에이-텐코어 코오포레이션 웨이퍼 상의 메모리 디바이스 영역에서 검출된 결함들을 분류하기 위한 컴퓨터-구현 방법들, 컴퓨터-판독 가능 매체, 및 시스템들
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) * 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
KR102019534B1 (ko) 2013-02-01 2019-09-09 케이엘에이 코포레이션 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1926406A (en) * 1930-09-30 1933-09-12 Sound Lab Corp Ltd System for recording impulses
US1969143A (en) * 1931-07-14 1934-08-07 Sound Lab Corp Ltd Sound recording apparatus
US2931688A (en) * 1954-12-30 1960-04-05 Burroughs Corp Electrographic printer
US3023070A (en) * 1957-05-20 1962-02-27 Burroughs Corp Atmosphere for electrographic printing
US3130411A (en) * 1958-12-05 1964-04-21 Xerox Corp Electronic recorder
US3321768A (en) * 1960-05-12 1967-05-23 Burroughs Corp Electrostatic recording with interchangeable stencils
NL301263A (fr) * 1962-12-03
US3358289A (en) * 1963-05-23 1967-12-12 Burroughs Corp Electrostatic transducer apparatus

Also Published As

Publication number Publication date
DE1597899A1 (de) 1970-08-27
AT309208B (de) 1973-06-15
BE707986A (fr) 1968-06-14
GB1205790A (en) 1970-09-16
SE346867B (fr) 1972-07-17
NL6717222A (fr) 1968-06-20
NL153686B (nl) 1977-06-15
ES348328A1 (es) 1969-06-16
US3495269A (en) 1970-02-10

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