BE707986A - - Google Patents

Info

Publication number
BE707986A
BE707986A BE707986DA BE707986A BE 707986 A BE707986 A BE 707986A BE 707986D A BE707986D A BE 707986DA BE 707986 A BE707986 A BE 707986A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE707986A publication Critical patent/BE707986A/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/32—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head
    • G03G15/321—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by charge transfer onto the recording material in accordance with the image
    • G03G15/323—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 in which the charge pattern is formed dotwise, e.g. by a thermal head by charge transfer onto the recording material in accordance with the image by modulating charged particles through holes or a slit

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Electrophotography Using Other Than Carlson'S Method (AREA)
BE707986D 1966-12-19 1967-12-14 BE707986A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60278766A 1966-12-19 1966-12-19

Publications (1)

Publication Number Publication Date
BE707986A true BE707986A (xx) 1968-06-14

Family

ID=24412807

Family Applications (1)

Application Number Title Priority Date Filing Date
BE707986D BE707986A (xx) 1966-12-19 1967-12-14

Country Status (9)

Country Link
US (1) US3495269A (xx)
AT (1) AT309208B (xx)
BE (1) BE707986A (xx)
DE (1) DE1597899A1 (xx)
ES (1) ES348328A1 (xx)
FR (1) FR1551296A (xx)
GB (1) GB1205790A (xx)
NL (1) NL153686B (xx)
SE (1) SE346867B (xx)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725951A (en) * 1971-06-16 1973-04-03 Ibm Electro-ionic printing
US3978492A (en) * 1971-09-25 1976-08-31 Agfa-Gevaert, A.G. Process for the electrographic recording of charge images in a low electron affinity case
US3742516A (en) * 1972-03-16 1973-06-26 Ibm Electro-ionic printing apparatus
US4245272A (en) * 1979-04-30 1981-01-13 Eastman Kodak Company Apparatus and method for low sensitivity corona charging of a moving photoconductor
US4463363A (en) * 1982-07-06 1984-07-31 Xerox Corporation Fluid assisted ion projection printing
US4762997A (en) * 1983-11-30 1988-08-09 Xerox Corporation Fluid jet assisted ion projection charging method
US4734721A (en) * 1985-10-04 1988-03-29 Markem Corporation Electrostatic printer utilizing dehumidified air
US4809026A (en) * 1986-07-29 1989-02-28 Markem Corporation Electrostatic printing utilizing a heated air flow
US4809027A (en) * 1986-07-29 1989-02-28 Markem Corporation Offset electrostatic printing utilizing a heated air flow
US4772901A (en) * 1986-07-29 1988-09-20 Markem Corporation Electrostatic printing utilizing dehumidified air
US6759255B2 (en) 2000-05-10 2004-07-06 Kla-Tencor Technologies Corp. Method and system for detecting metal contamination on a semiconductor wafer
US7012438B1 (en) 2002-07-10 2006-03-14 Kla-Tencor Technologies Corp. Methods and systems for determining a property of an insulating film
US7064565B1 (en) 2002-10-31 2006-06-20 Kla-Tencor Technologies Corp. Methods and systems for determining an electrical property of an insulating film
US7248062B1 (en) 2002-11-04 2007-07-24 Kla-Tencor Technologies Corp. Contactless charge measurement of product wafers and control of corona generation and deposition
US7103484B1 (en) 2003-10-31 2006-09-05 Kla-Tencor Technologies Corp. Non-contact methods for measuring electrical thickness and determining nitrogen content of insulating films
JP4758358B2 (ja) * 2004-01-29 2011-08-24 ケーエルエー−テンカー コーポレイション レチクル設計データにおける欠陥を検出するためのコンピュータに実装される方法
JP4904034B2 (ja) * 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション レチクル・レイアウト・データを評価するための方法、システム及び搬送媒体
DE102005032601A1 (de) * 2005-01-07 2006-07-20 Heidelberger Druckmaschinen Ag Druckmaschine
US7769225B2 (en) 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
US7893703B2 (en) * 2005-08-19 2011-02-22 Kla-Tencor Technologies Corp. Systems and methods for controlling deposition of a charge on a wafer for measurement of one or more electrical properties of the wafer
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US7570796B2 (en) * 2005-11-18 2009-08-04 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
WO2008077100A2 (en) 2006-12-19 2008-06-26 Kla-Tencor Corporation Systems and methods for creating inspection recipes
US8194968B2 (en) * 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7962863B2 (en) * 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US7738093B2 (en) * 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US8213704B2 (en) * 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) * 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
US7975245B2 (en) * 2007-08-20 2011-07-05 Kla-Tencor Corp. Computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects
US8139844B2 (en) * 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
US9659670B2 (en) * 2008-07-28 2017-05-23 Kla-Tencor Corp. Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) * 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
KR102019534B1 (ko) 2013-02-01 2019-09-09 케이엘에이 코포레이션 결함 특유의, 다중 채널 정보를 이용한 웨이퍼 상의 결함 검출
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1926406A (en) * 1930-09-30 1933-09-12 Sound Lab Corp Ltd System for recording impulses
US1969143A (en) * 1931-07-14 1934-08-07 Sound Lab Corp Ltd Sound recording apparatus
US2931688A (en) * 1954-12-30 1960-04-05 Burroughs Corp Electrographic printer
US3023070A (en) * 1957-05-20 1962-02-27 Burroughs Corp Atmosphere for electrographic printing
US3130411A (en) * 1958-12-05 1964-04-21 Xerox Corp Electronic recorder
US3321768A (en) * 1960-05-12 1967-05-23 Burroughs Corp Electrostatic recording with interchangeable stencils
NL301263A (xx) * 1962-12-03
US3358289A (en) * 1963-05-23 1967-12-12 Burroughs Corp Electrostatic transducer apparatus

Also Published As

Publication number Publication date
ES348328A1 (es) 1969-06-16
GB1205790A (en) 1970-09-16
FR1551296A (xx) 1968-12-27
NL6717222A (xx) 1968-06-20
US3495269A (en) 1970-02-10
NL153686B (nl) 1977-06-15
SE346867B (xx) 1972-07-17
AT309208B (de) 1973-06-15
DE1597899A1 (de) 1970-08-27

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