FR1486289A - Dispositif permettant de polir chimiquement des plaques de semi-conducteur - Google Patents

Dispositif permettant de polir chimiquement des plaques de semi-conducteur

Info

Publication number
FR1486289A
FR1486289A FR7940A FR06007940A FR1486289A FR 1486289 A FR1486289 A FR 1486289A FR 7940 A FR7940 A FR 7940A FR 06007940 A FR06007940 A FR 06007940A FR 1486289 A FR1486289 A FR 1486289A
Authority
FR
France
Prior art keywords
semiconductor wafers
polishing semiconductor
chemically polishing
chemically
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7940A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1486289A publication Critical patent/FR1486289A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
FR7940A 1965-07-23 1966-07-05 Dispositif permettant de polir chimiquement des plaques de semi-conducteur Expired FR1486289A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEJ0028638 1965-07-23

Publications (1)

Publication Number Publication Date
FR1486289A true FR1486289A (fr) 1967-06-23

Family

ID=7203344

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7940A Expired FR1486289A (fr) 1965-07-23 1966-07-05 Dispositif permettant de polir chimiquement des plaques de semi-conducteur

Country Status (4)

Country Link
JP (1) JPS5016300B1 (fr)
DE (1) DE1521794A1 (fr)
FR (1) FR1486289A (fr)
GB (1) GB1087676A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524008A1 (fr) * 1982-03-29 1983-09-30 Shinetsu Handotai Kk Appareil et procede pour le decapage chimique d'un article en forme de rondelle
EP0226931A2 (fr) * 1985-12-17 1987-07-01 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Procédé de fabrication de substrats semi-conducteurs
FR2876610A1 (fr) * 2004-10-20 2006-04-21 Commissariat Energie Atomique Procede de polissage d'une surface de germanium et utilisation

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
JP4759298B2 (ja) * 2005-03-30 2011-08-31 株式会社フジミインコーポレーテッド 単結晶表面用の研磨剤及び研磨方法
CN112538631B (zh) * 2020-11-19 2023-02-10 贵溪市正鑫铜业有限公司 一种铜材抛光液的环保处理设备
CN113696019B (zh) * 2021-08-13 2023-03-21 山东宝乘电子有限公司 一种半导体材料的平面研磨装置及其使用方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825817A (fr) * 1971-08-11 1973-04-04

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524008A1 (fr) * 1982-03-29 1983-09-30 Shinetsu Handotai Kk Appareil et procede pour le decapage chimique d'un article en forme de rondelle
EP0226931A2 (fr) * 1985-12-17 1987-07-01 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Procédé de fabrication de substrats semi-conducteurs
EP0226931A3 (en) * 1985-12-17 1988-03-16 Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften E.V. A method of preparing semiconductor substrates
FR2876610A1 (fr) * 2004-10-20 2006-04-21 Commissariat Energie Atomique Procede de polissage d'une surface de germanium et utilisation

Also Published As

Publication number Publication date
JPS5016300B1 (fr) 1975-06-12
DE1521794A1 (de) 1969-10-23
GB1087676A (en) 1967-10-18

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