FR1486289A - Dispositif permettant de polir chimiquement des plaques de semi-conducteur - Google Patents
Dispositif permettant de polir chimiquement des plaques de semi-conducteurInfo
- Publication number
- FR1486289A FR1486289A FR7940A FR06007940A FR1486289A FR 1486289 A FR1486289 A FR 1486289A FR 7940 A FR7940 A FR 7940A FR 06007940 A FR06007940 A FR 06007940A FR 1486289 A FR1486289 A FR 1486289A
- Authority
- FR
- France
- Prior art keywords
- semiconductor wafers
- polishing semiconductor
- chemically polishing
- chemically
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEJ0028638 | 1965-07-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1486289A true FR1486289A (fr) | 1967-06-23 |
Family
ID=7203344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7940A Expired FR1486289A (fr) | 1965-07-23 | 1966-07-05 | Dispositif permettant de polir chimiquement des plaques de semi-conducteur |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5016300B1 (fr) |
DE (1) | DE1521794A1 (fr) |
FR (1) | FR1486289A (fr) |
GB (1) | GB1087676A (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2524008A1 (fr) * | 1982-03-29 | 1983-09-30 | Shinetsu Handotai Kk | Appareil et procede pour le decapage chimique d'un article en forme de rondelle |
EP0226931A2 (fr) * | 1985-12-17 | 1987-07-01 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Procédé de fabrication de substrats semi-conducteurs |
FR2876610A1 (fr) * | 2004-10-20 | 2006-04-21 | Commissariat Energie Atomique | Procede de polissage d'une surface de germanium et utilisation |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5783497A (en) * | 1994-08-02 | 1998-07-21 | Sematech, Inc. | Forced-flow wafer polisher |
JP4759298B2 (ja) * | 2005-03-30 | 2011-08-31 | 株式会社フジミインコーポレーテッド | 単結晶表面用の研磨剤及び研磨方法 |
CN112538631B (zh) * | 2020-11-19 | 2023-02-10 | 贵溪市正鑫铜业有限公司 | 一种铜材抛光液的环保处理设备 |
CN113696019B (zh) * | 2021-08-13 | 2023-03-21 | 山东宝乘电子有限公司 | 一种半导体材料的平面研磨装置及其使用方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4825817A (fr) * | 1971-08-11 | 1973-04-04 |
-
1965
- 1965-07-23 DE DE19651521794 patent/DE1521794A1/de active Pending
-
1966
- 1966-07-05 FR FR7940A patent/FR1486289A/fr not_active Expired
- 1966-07-11 JP JP41044880A patent/JPS5016300B1/ja active Pending
- 1966-07-14 GB GB3158266A patent/GB1087676A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2524008A1 (fr) * | 1982-03-29 | 1983-09-30 | Shinetsu Handotai Kk | Appareil et procede pour le decapage chimique d'un article en forme de rondelle |
EP0226931A2 (fr) * | 1985-12-17 | 1987-07-01 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Procédé de fabrication de substrats semi-conducteurs |
EP0226931A3 (en) * | 1985-12-17 | 1988-03-16 | Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften E.V. | A method of preparing semiconductor substrates |
FR2876610A1 (fr) * | 2004-10-20 | 2006-04-21 | Commissariat Energie Atomique | Procede de polissage d'une surface de germanium et utilisation |
Also Published As
Publication number | Publication date |
---|---|
JPS5016300B1 (fr) | 1975-06-12 |
DE1521794A1 (de) | 1969-10-23 |
GB1087676A (en) | 1967-10-18 |
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