GB1087676A - Polishing apparatus - Google Patents

Polishing apparatus

Info

Publication number
GB1087676A
GB1087676A GB3158266A GB3158266A GB1087676A GB 1087676 A GB1087676 A GB 1087676A GB 3158266 A GB3158266 A GB 3158266A GB 3158266 A GB3158266 A GB 3158266A GB 1087676 A GB1087676 A GB 1087676A
Authority
GB
United Kingdom
Prior art keywords
holder
disc
bodies
polishing
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3158266A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1087676A publication Critical patent/GB1087676A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

1,087,676. Etching. INTERNATIONAL BUSINESS MACHINES CORPORATION. July 14, 1966 [July 23, 1965], No. 31582/66. Heading B6J. Apparatus for polishing by etching semiconductor material such as germanium or gallium arsenide comprises a polishing disc 1 having an upper polishing surface 5 of fibrous, felt-like material rotating about an axis inclined (e.g. 3 degrees) to the vertical, and a holder 6 for bodies to be etched rotating on the lower part of the surface 5. The holder is rotated by the disc through a pulley 14 at a faster peripheral speed than the drum and its lower surface is adapted to receive the bodies embedded in wax to protect their edges. Etching liquid is delivered from a container 28 on to the disc at a rate controlled by a device 30 and gravitated to the area below the holder, some being retained in a recess in the lower surface thereof. Excess liquid is drained away into a groove 22 and through ports 21. The pressure of the bodies against the disc is adjusted by a screw 12, and the pressure of the pulley against the holder by a screw 18. The etchant may be sodium hypochlorite; the time 100-130 minutes, and the wax glycol phthalate.
GB3158266A 1965-07-23 1966-07-14 Polishing apparatus Expired GB1087676A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEJ0028638 1965-07-23

Publications (1)

Publication Number Publication Date
GB1087676A true GB1087676A (en) 1967-10-18

Family

ID=7203344

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3158266A Expired GB1087676A (en) 1965-07-23 1966-07-14 Polishing apparatus

Country Status (4)

Country Link
JP (1) JPS5016300B1 (en)
DE (1) DE1521794A1 (en)
FR (1) FR1486289A (en)
GB (1) GB1087676A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112538631A (en) * 2020-11-19 2021-03-23 贵溪市正鑫铜业有限公司 Environment-friendly treatment equipment for copper material polishing solution
CN113696019A (en) * 2021-08-13 2021-11-26 山东宝乘电子有限公司 Plane grinding device for semiconductor material and using method thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58166726A (en) * 1982-03-29 1983-10-01 Shin Etsu Handotai Co Ltd Etching device for wafer
DE3677735D1 (en) * 1985-12-17 1991-04-04 Max Planck Gesellschaft METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATES.
US5783497A (en) * 1994-08-02 1998-07-21 Sematech, Inc. Forced-flow wafer polisher
FR2876610A1 (en) * 2004-10-20 2006-04-21 Commissariat Energie Atomique A method for polishing a germanium surface by means of a mild combined chemical and mechanical polishing action, for use in the fabrication of microelectronic components
JP4759298B2 (en) * 2005-03-30 2011-08-31 株式会社フジミインコーポレーテッド Abrasive for single crystal surface and polishing method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825817A (en) * 1971-08-11 1973-04-04

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112538631A (en) * 2020-11-19 2021-03-23 贵溪市正鑫铜业有限公司 Environment-friendly treatment equipment for copper material polishing solution
CN113696019A (en) * 2021-08-13 2021-11-26 山东宝乘电子有限公司 Plane grinding device for semiconductor material and using method thereof

Also Published As

Publication number Publication date
JPS5016300B1 (en) 1975-06-12
DE1521794A1 (en) 1969-10-23
FR1486289A (en) 1967-06-23

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