FR1389506A - Fabrication de circuits - Google Patents

Fabrication de circuits

Info

Publication number
FR1389506A
FR1389506A FR956268A FR956268A FR1389506A FR 1389506 A FR1389506 A FR 1389506A FR 956268 A FR956268 A FR 956268A FR 956268 A FR956268 A FR 956268A FR 1389506 A FR1389506 A FR 1389506A
Authority
FR
France
Prior art keywords
circuit manufacturing
manufacturing
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR956268A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1389506A publication Critical patent/FR1389506A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H10P50/693—
    • H10P50/695—
    • H10P50/71—
    • H10P76/4085—
    • H10P95/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/80—Material per se process of making same
    • Y10S505/815—Process of making per se
    • Y10S505/818—Coating
    • Y10S505/82—And etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemical Vapour Deposition (AREA)
FR956268A 1962-12-10 1963-12-06 Fabrication de circuits Expired FR1389506A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US243468A US3326717A (en) 1962-12-10 1962-12-10 Circuit fabrication

Publications (1)

Publication Number Publication Date
FR1389506A true FR1389506A (fr) 1965-02-19

Family

ID=22918882

Family Applications (1)

Application Number Title Priority Date Filing Date
FR956268A Expired FR1389506A (fr) 1962-12-10 1963-12-06 Fabrication de circuits

Country Status (5)

Country Link
US (1) US3326717A (show.php)
JP (1) JPS409727B1 (show.php)
DE (1) DE1244262B (show.php)
FR (1) FR1389506A (show.php)
GB (1) GB997642A (show.php)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0456479A3 (en) * 1990-05-09 1992-11-19 Canon Kabushiki Kaisha Pattern forming process, apparatus for forming said pattern and process for preparing semiconductor device utilizing said pattern forming process
US5714306A (en) * 1990-09-26 1998-02-03 Canon Kabushiki Kaisha Processing method and apparatus
US5863706A (en) * 1990-09-26 1999-01-26 Canon Kabushiki Kaisha Processing method for patterning a film

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3617375A (en) * 1969-08-11 1971-11-02 Texas Instruments Inc Electron beam evaporated quartz insulating material process
JPS5036127B1 (show.php) * 1971-05-27 1975-11-21
US4313783A (en) * 1980-05-19 1982-02-02 Branson International Plasma Corporation Computer controlled system for processing semiconductor wafers
US5658387A (en) * 1991-03-06 1997-08-19 Semitool, Inc. Semiconductor processing spray coating apparatus
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
FR2872502B1 (fr) * 2004-07-05 2006-11-10 Ecole Norm Superieure Lyon Dispositif de microstructuration de surface
CN102310602B (zh) * 2010-06-30 2014-03-26 鸿富锦精密工业（深圳）有限公司 铝塑复合结构及其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3114652A (en) * 1960-04-15 1963-12-17 Alloyd Corp Vapor deposition process
US3132046A (en) * 1960-09-28 1964-05-05 Space Technology Lab Inc Method for the deposition of thin films by electron bombardment
US3056881A (en) * 1961-06-07 1962-10-02 United Aircraft Corp Method of making electrical conductor device
US3095341A (en) * 1961-06-30 1963-06-25 Bell Telephone Labor Inc Photosensitive gas phase etching of semiconductors by selective radiation

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0456479A3 (en) * 1990-05-09 1992-11-19 Canon Kabushiki Kaisha Pattern forming process, apparatus for forming said pattern and process for preparing semiconductor device utilizing said pattern forming process
US5344522A (en) * 1990-05-09 1994-09-06 Canon Kabushiki Kaisha Pattern forming process and process for preparing semiconductor device utilizing said pattern forming process
US5413664A (en) * 1990-05-09 1995-05-09 Canon Kabushiki Kaisha Apparatus for preparing a semiconductor device, photo treatment apparatus, pattern forming apparatus and fabrication apparatus
US5490896A (en) * 1990-05-09 1996-02-13 Canon Kabushiki Kaisha Photomask or a light shielding member having a light transmitting portion and a light shielding portion
US5714306A (en) * 1990-09-26 1998-02-03 Canon Kabushiki Kaisha Processing method and apparatus
US5824455A (en) * 1990-09-26 1998-10-20 Canon Kabushiki Kaisha Processing method and apparatus
US5863706A (en) * 1990-09-26 1999-01-26 Canon Kabushiki Kaisha Processing method for patterning a film
US5962194A (en) * 1990-09-26 1999-10-05 Canon Kabushiki Kaisha Processing method and apparatus
US5981001A (en) * 1990-09-26 1999-11-09 Canon Kabushiki Kaisha Processing method for selectively irradiating a surface in presence of a reactive gas to cause etching
US6025115A (en) * 1990-09-26 2000-02-15 Canon Kabushiki Kaisha Processing method for etching a substrate

Also Published As

Publication number Publication date
JPS409727B1 (show.php) 1965-05-19
DE1244262B (de) 1967-07-13
US3326717A (en) 1967-06-20
GB997642A (en) 1965-07-07

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