CN102310602B - 铝塑复合结构及其制作方法 - Google Patents

铝塑复合结构及其制作方法 Download PDF

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CN102310602B
CN102310602B CN201010214877.2A CN201010214877A CN102310602B CN 102310602 B CN102310602 B CN 102310602B CN 201010214877 A CN201010214877 A CN 201010214877A CN 102310602 B CN102310602 B CN 102310602B
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CN102310602A (zh
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郭宪成
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hon Hai Precision Industry Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2551/00Optical elements
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4998Combined manufacture including applying or shaping of fluent material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4998Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982Coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4998Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982Coating
    • Y10T29/49984Coating and casting
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24537Parallel ribs and/or grooves
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

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Abstract

一种铝塑复合结构,其包括铝件与塑料部。铝件在其与塑料部的结合面上通过光蚀技术形成有多个微槽。塑料部的部分材料填充在多个微槽内。每个微槽的宽度在0.02毫米~0.05毫米之间,深度在0.2毫米~0.25毫米之间。上述铝塑复合结构通过在铝件结合面上形成微槽而将铝件与塑料部以类似于面结合的方式形成一体结构,不仅结构强度更高,而且可以减少铝塑复合结构的体积,有利于薄形化。本发明还提供了该铝塑复合结构的制作方法。

Description

铝塑复合结构及其制作方法
技术领域
本发明涉及一种铝塑复合结构及其制作方法。
背景技术
铝塑复合结构因其较好的耐水、耐腐蚀及机械性能广泛应用于电子产品中,但是由于铝件和塑料部很难仅利用面结合紧密固定在一起,一般需要在其中间设置粘接层以连接固定铝件和塑料部。但是,这种结构中铝件与塑料部的结合强度不高,而且长久使用后随着粘接层的老化,其结合强度会进一步降低。而且,粘接层的设置也增加了铝塑复合结构的厚度,难以适应电子产品薄形化的需求。
发明内容
鉴于上述内容,有必要提供一种结构强度高的铝塑复合结构及其制作方法。
一种铝塑复合结构,其包括铝件与塑料部。铝件在其与塑料部的结合面上通过光蚀技术形成有多个微槽。塑料部的部分材料填充在多个微槽内。每个微槽的宽度在0.02毫米~0.05毫米之间,深度在0.2毫米~0.25毫米之间。
一种铝塑复合结构的制作方法,其包括以下步骤:提供铝件,铝件包括用于与塑料部结合的结合面。利用光蚀技术在该结合面上形成有多个微槽,微槽的宽度在0.02毫米~0.05毫米之间,深度在0.2毫米~0.25毫米之间。将该铝件置于成型模具中,注入熔融塑料材料以成型塑料部,塑料部分填充在该微槽内。冷却后即形成铝塑复合结构。
上述铝塑复合结构通过在铝件结合面上形成微槽而将铝件与塑料部以类似于面结合的方式形成一体结构,不仅结构强度更高,而且可以减少铝塑复合结构的体积,有利于薄形化。
附图说明
图1是本发明的铝塑复合结构的剖视图。
图2是本发明铝塑复合结构制作方法的流程图。
主要元件符号说明
  铝塑复合结构   200
  铝件   21
  塑料部   23
  结合面   210
  微槽   211
  步骤   201、202、203、204
具体实施方式
下面结合附图及实施方式对本发明的铝塑复合结构及其制作方法作进一步的详细说明。
请参见图1,本发明的铝塑复合结构200是将铝件21固定在塑料部23上而形成的一体结构。可以根据实际应用将铝件21及与铝件21一体成型的塑料部23设计为不同的零件,如铝件21作为手机内的导电片,塑料部23为手机外壳等。铝件21在其与塑料部23的结合面210上通过光蚀技术形成的多个微槽211。微槽211的宽度在0.02mm~0.05mm之间,深度在0.2mm~0.25mm之间。在这个尺寸范围内的微槽211,能使塑料材料顺利注入其中,获得足够的结合力,使铝件21与塑料部23紧密结合。微槽211的深度与宽度比优选大于或者等于10,使得塑料材料能够快速且足够深入地注入微槽211内部,增强结合力。微槽211的尺寸也可以根据铝件21的厚度在上述范围内具体调整,一般铝件21为薄形板件,微槽211的深度以不超过铝件21厚度的80%为佳,既能够使塑料材料足够深入铝件21内部,获取足够的结合力,又能够防止塑料材料在铝件21相对于结合面210的另一个表面溢出。塑料部23的部分材料填充在微槽211内,从而将铝件21与塑料部23紧密固定结合在一起,形成一体结构。铝件21可以为铝件或者铝合金件,因为铝元素具有六面晶结构,容易形成数量较多的微槽211,获取足够的结合力。
请同时参见图2,本发明的铝塑复合结构200制作方法步骤如下:
在步骤201中,提供铝件21,铝件21具有结合面210;
在步骤202中,将铝件21的结合面210利用光蚀技术腐蚀形成多个微槽211,该微槽211的宽度在0.02mm~0.05mm之间,深度在0.2mm~0.25mm之间。利用光蚀技术形成微槽211的过程包括如下步骤:
(1)在铝件21的结合面210上涂覆曝光剂。
(2)在铝件21的结合面210上覆盖预制的点状掩膜薄膜,然后将铝件21放在曝光机中曝光。
(3)将曝光后的铝件21放在蚀槽内进行腐蚀,以形成微槽211,微槽211的尺寸可通过调节腐蚀液的浓度及/或腐蚀时间来控制。
在步骤203中,将铝件21置于成型模具内,注入熔融塑料,以形成与铝件的结合面及微槽211塑料部紧密结合的塑料部23,塑料部23的部分材料注入微槽211内,并与微槽211壁面相结合;
在步骤204中,冷却后即形成铝塑复合结构200。
本发明的铝塑复合结构200的铝件21用于与塑料部23的结合的结合面210上采用光蚀技术形成多个微槽211,便于控制微槽211的深度。注塑成型塑料部23时,熔融塑料就会填充在微槽211内,将塑料部23与铝件21紧密结合在一起,形成一体结构,结合强度更高,而且在长久使用后也不易受到外界影响而降低结合强度。塑料部23与铝件21的结合近似于面结合,因此,无需设置嵌入卡合结构,有利于薄形化,能够适应现在电子装置轻薄化的需求。
另外,本领域技术人员还可在本发明精神内做其它变化。当然,这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围内。

Claims (7)

1.一种铝塑复合结构,其包括铝件及与铝件一体成型的塑料部,其特征在于:该铝件在其与塑料部的结合面上通过光蚀技术形成有多个微槽,形成该塑料部的部分材料填充在该多个微槽内,每个微槽的宽度在0.02毫米~0.05毫米之间,深度在0.2毫米~0.25毫米之间。
2.如权利要求1所述的铝塑复合结构,其特征在于:每个微槽的深宽比大于或者等于10。
3.如权利要求1所述的铝塑复合结构,其特征在于:每个微槽的深度小于或者等于铝件形成该微槽位置处厚度的80%。
4.一种铝塑复合结构的制作方法,其包括以下步骤:
提供铝件,该铝件包括结合面;
利用光蚀技术在该结合面上形成有多个微槽,每个微槽的宽度在0.02毫米~0.05毫米之间,深度在0.2毫米~0.25毫米之间;
将该铝件置于成型模具中,注入熔融塑料材料以成型塑料部,该塑料材料部分填充在该微槽内;
冷却后即形成铝塑复合结构。
5.如权利要求4所述的铝塑复合结构的制作方法,其特征在于:该微槽的深度小于或者等于铝件形成该微槽位置处厚度的80%。
6.如权利要求4所述的铝塑复合结构的制作方法,其特征在于:每个微槽的深宽比大于或者等于10。
7.如权利要求4所述的铝塑复合结构的制作方法,其特征在于:利用光蚀技术在该结合面上形成有多个微槽的过程包括在该结合面上涂覆曝光剂的步骤、在结合面上覆盖点状掩膜薄膜并曝光的步骤及腐蚀步骤。
CN201010214877.2A 2010-06-30 2010-06-30 铝塑复合结构及其制作方法 Expired - Fee Related CN102310602B (zh)

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US13/074,134 US8429807B2 (en) 2010-06-30 2011-03-29 Aluminum-plastic composite structure
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140272430A1 (en) * 2013-03-15 2014-09-18 Sabic Innovative Plastics Ip B.V. Process of making dispersed polyetherimide micronized particles and process of coating and further forming of these particles products made therefrom
WO2017131681A1 (en) * 2016-01-28 2017-08-03 Hewlett-Packard Development Company, L.P. Metal-plastic composite structure for electronic devices
JP6562866B2 (ja) * 2016-03-31 2019-08-21 日本碍子株式会社 ハニカム構造体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6930256B1 (en) * 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
CN101578018A (zh) * 2008-05-09 2009-11-11 富准精密工业(深圳)有限公司 金属与塑料的结合件及其制造方法
CN101631671A (zh) * 2007-03-12 2010-01-20 大成普拉斯株式会社 铝合金复合体及其接合方法
US8070797B2 (en) * 2007-03-01 2011-12-06 Boston Scientific Scimed, Inc. Medical device with a porous surface for delivery of a therapeutic agent

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3257260A (en) * 1962-10-19 1966-06-21 Sherwood H Morgan Laminated structure with low density core
US3326717A (en) * 1962-12-10 1967-06-20 Ibm Circuit fabrication
US3388000A (en) * 1964-09-18 1968-06-11 Texas Instruments Inc Method of forming a metal contact on a semiconductor device
USB311264I5 (zh) * 1964-12-31 1900-01-01
US3702277A (en) * 1970-09-23 1972-11-07 Zenith Radio Corp Control system for mask etching apparatus
US3808067A (en) * 1972-11-24 1974-04-30 Western Electric Co Method of controlling an etching process
US4254544A (en) * 1978-06-21 1981-03-10 Barker Michael D Method of casting photographic representation having tonal and height contrasts and the article so cast
US4669416A (en) * 1986-06-25 1987-06-02 Metoramic Sciences, Inc. Composite carrier plate
US4902365A (en) * 1987-12-03 1990-02-20 Westlake Sr Edward F Method for making a composite sheet-like structure
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
US5499441A (en) * 1993-08-11 1996-03-19 General Electric Company Continuous extrusion impregnation molded article process
FR2716563B1 (fr) * 1994-02-21 1996-06-07 Digipress Sa Substrat préformaté, substrat préformaté comportant des informations à dupliquer, leurs procédés de fabrication et procédé de fabrication d'un disque maître et/ou d'un disque optique.
US5660380A (en) * 1995-08-15 1997-08-26 W. L. Gore & Associates, Inc. Vacuum fixture and method for dimensioning and manipulating materials
DE19709136A1 (de) * 1997-03-06 1998-09-10 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung und Magazinierung von Mikrobauteilen, Magazin und Montageverfahren für Mikrobauteile
TW527279B (en) * 1997-12-30 2003-04-11 Dung-Han Juang Superplastic alloy-containing conductive plastic article for shielding electromagnetic interference and process for manufacturing the same
US6242069B1 (en) * 1998-12-29 2001-06-05 Lek Technologies, Llc Aluminum-thermoplastic panel and method of manufacture
US20020100165A1 (en) * 2000-02-14 2002-08-01 Amkor Technology, Inc. Method of forming an integrated circuit device package using a temporary substrate
US6730452B2 (en) * 2001-01-26 2004-05-04 International Business Machines Corporation Lithographic photoresist composition and process for its use
US6790396B2 (en) * 2001-08-29 2004-09-14 Nokia Corporation Method of making illuminated covers
US6746890B2 (en) * 2002-07-17 2004-06-08 Tini Alloy Company Three dimensional thin film devices and methods of fabrication
JP4057399B2 (ja) * 2002-11-07 2008-03-05 株式会社フジクラ 微細孔への金属充填方法
WO2004086471A1 (en) * 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US7880258B2 (en) * 2003-05-05 2011-02-01 Udt Sensors, Inc. Thin wafer detectors with improved radiation damage and crosstalk characteristics
JP4082322B2 (ja) * 2003-09-18 2008-04-30 松下電器産業株式会社 回路基板の製造方法および回路基板
US7393699B2 (en) * 2006-06-12 2008-07-01 Tran Bao Q NANO-electronics
KR100846510B1 (ko) * 2006-12-22 2008-07-17 삼성전자주식회사 자구벽 이동을 이용한 정보 저장 장치 및 그 제조방법
US8388678B2 (en) * 2007-12-12 2013-03-05 Boston Scientific Scimed, Inc. Medical devices having porous component for controlled diffusion
JP4278007B1 (ja) * 2008-11-26 2009-06-10 有限会社ナプラ 微細空間への金属充填方法
US8518521B2 (en) * 2009-10-16 2013-08-27 Aisin Seiki Kabushiki Kaisha Composite molded article

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6930256B1 (en) * 2002-05-01 2005-08-16 Amkor Technology, Inc. Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US8070797B2 (en) * 2007-03-01 2011-12-06 Boston Scientific Scimed, Inc. Medical device with a porous surface for delivery of a therapeutic agent
CN101631671A (zh) * 2007-03-12 2010-01-20 大成普拉斯株式会社 铝合金复合体及其接合方法
CN101578018A (zh) * 2008-05-09 2009-11-11 富准精密工业(深圳)有限公司 金属与塑料的结合件及其制造方法

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