FI971658A0 - Johdinkehys kapseloitua optokomponenttia varten - Google Patents

Johdinkehys kapseloitua optokomponenttia varten

Info

Publication number
FI971658A0
FI971658A0 FI971658A FI971658A FI971658A0 FI 971658 A0 FI971658 A0 FI 971658A0 FI 971658 A FI971658 A FI 971658A FI 971658 A FI971658 A FI 971658A FI 971658 A0 FI971658 A0 FI 971658A0
Authority
FI
Finland
Prior art keywords
conductor frame
encapsulated optocomponent
optocomponent
encapsulated
conductor
Prior art date
Application number
FI971658A
Other languages
English (en)
Swedish (sv)
Other versions
FI971658A (fi
Inventor
Odd Steijer
Paul Eriksen
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of FI971658A0 publication Critical patent/FI971658A0/fi
Publication of FI971658A publication Critical patent/FI971658A/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)
FI971658A 1994-10-19 1997-04-18 Johdinkehys kapseloitua optokomponenttia varten FI971658A (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9403575A SE9403575L (sv) 1994-10-19 1994-10-19 Benram för kapslad optokomponent
PCT/SE1995/001234 WO1996013065A1 (en) 1994-10-19 1995-10-19 Leadframe for an encapsulated optocomponent

Publications (2)

Publication Number Publication Date
FI971658A0 true FI971658A0 (fi) 1997-04-18
FI971658A FI971658A (fi) 1997-06-19

Family

ID=20395669

Family Applications (1)

Application Number Title Priority Date Filing Date
FI971658A FI971658A (fi) 1994-10-19 1997-04-18 Johdinkehys kapseloitua optokomponenttia varten

Country Status (12)

Country Link
US (2) US6072229A (fi)
EP (1) EP0792521B1 (fi)
JP (1) JP3703839B2 (fi)
KR (1) KR100265478B1 (fi)
CN (1) CN1149670C (fi)
AU (1) AU3820195A (fi)
CA (1) CA2203113C (fi)
DE (1) DE69520073T2 (fi)
ES (1) ES2153903T3 (fi)
FI (1) FI971658A (fi)
SE (1) SE9403575L (fi)
WO (1) WO1996013065A1 (fi)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9403575L (sv) 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent
SE514116C2 (sv) * 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
EP0826997B1 (en) * 1996-08-26 2003-07-23 Sumitomo Electric Industries, Ltd. Optoelectronic module and method of manufacturing the same
US6354747B1 (en) 1996-08-26 2002-03-12 Sumitomo Electric Industries, Ltd. Optical module
DE60304390T2 (de) * 2002-05-15 2007-02-01 Tyco Electronics Amp Gmbh Elektronikmodul
US7371616B2 (en) * 2006-01-05 2008-05-13 Fairchild Semiconductor Corporation Clipless and wireless semiconductor die package and method for making the same
JP4740765B2 (ja) * 2006-02-24 2011-08-03 エルピーダメモリ株式会社 半導体装置及びその製造方法
US9008766B2 (en) 2008-06-02 2015-04-14 Physio-Control, Inc. Medical device adjusting operation when used with non-authenticated patient parameter collecting accessory
US7728548B2 (en) * 2008-06-02 2010-06-01 Physio-Control, Inc. Defibrillator battery authentication system
US9916436B2 (en) 2014-10-24 2018-03-13 Physio-Control, Inc. Intelligent accessories for medical devices

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes
DE3617302A1 (de) 1986-05-23 1987-11-26 Amazonen Werke Dreyer H Schleuderstreuer mit vorratsbehaelter
US4803540A (en) * 1986-11-24 1989-02-07 American Telephone And Telegraph Co., At&T Bell Labs Semiconductor integrated circuit packages
JPS63148670A (ja) * 1986-12-12 1988-06-21 Texas Instr Japan Ltd リ−ドフレ−ム材
US5150193A (en) * 1987-05-27 1992-09-22 Hitachi, Ltd. Resin-encapsulated semiconductor device having a particular mounting structure
JPH0294657A (ja) * 1988-09-30 1990-04-05 Nec Corp リードフレーム
IT1239644B (it) * 1990-02-22 1993-11-11 Sgs Thomson Microelectronics Struttura di supporto degli adduttori perfezionata per contenitori di dispositivi integrati di potenza
EP0446410B1 (en) * 1990-03-13 1999-12-22 Sumitomo Electric Industries, Ltd. Optical module and process of producing the same
EP0452634B1 (en) * 1990-03-16 1997-05-02 Sumitomo Electric Industries, Ltd. Lead frame for semiconductor device
CA2079964C (en) * 1992-01-22 1997-12-16 Mitsutoshi Kamakura Apparatus and method for manufacturing optical module
EP0582992B1 (en) * 1992-08-11 1998-06-03 Sumitomo Electric Industries, Ltd Optical module with improved grounding of an optical element
SE513183C2 (sv) 1994-03-18 2000-07-24 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt kapslad optokomponent
SE9403574L (sv) * 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Optokomponentkapsel med optiskt gränssnitt
SE9403575L (sv) 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Benram för kapslad optokomponent

Also Published As

Publication number Publication date
ES2153903T3 (es) 2001-03-16
US6072229A (en) 2000-06-06
EP0792521B1 (en) 2001-02-07
AU3820195A (en) 1996-05-15
SE9403575L (sv) 1996-04-20
SE9403575D0 (sv) 1994-10-19
EP0792521A1 (en) 1997-09-03
DE69520073D1 (de) 2001-03-15
CN1149670C (zh) 2004-05-12
CA2203113C (en) 2005-03-22
FI971658A (fi) 1997-06-19
JP3703839B2 (ja) 2005-10-05
CA2203113A1 (en) 1996-05-02
WO1996013065A1 (en) 1996-05-02
JPH10507874A (ja) 1998-07-28
DE69520073T2 (de) 2001-06-13
CN1169208A (zh) 1997-12-31
US6338983B1 (en) 2002-01-15
KR100265478B1 (ko) 2000-09-15

Similar Documents

Publication Publication Date Title
DE69520153T2 (de) Rahmenanordung
DE69427652T2 (de) Rahmenstruktur
FI971658A0 (fi) Johdinkehys kapseloitua optokomponenttia varten
DK61294A (da) Brillestel
FI98954B (fi) Runkorakenne
DE69521543D1 (de) Leiterrahmen Material
DE59707892D1 (de) Drahtrahmen
DE19581745T1 (de) Verkapselungsverfahren
KR950023966U (ko) 리드 프레임
KR960014910U (ko) 씽크대용 프레임 연결구
KR960025517U (ko) 리드 프레임
KR960019171U (ko) 리드 프레임
KR960015638U (ko) 리드 프레임
KR950025933U (ko) 리드 프레임
KR950025929U (ko) 크랙 방지용 리드 프레임
KR950025891U (ko) 리드프레임
KR980005510U (ko) 리드 프레임
KR960025503U (ko) 리드프레임구조
KR950029365U (ko) 액자틀
KR980005502U (ko) 리드 프레임 구조
KR980005385U (ko) 리드 프레임 구조
KR980005501U (ko) 리드 프레임 구조
KR950025931U (ko) 반도체용 리드 프레임
KR960009849U (ko) 조립용 액자
FI941471A0 (fi) Karmirakenne

Legal Events

Date Code Title Description
MA Patent expired