DE69521543D1 - Leiterrahmen Material - Google Patents

Leiterrahmen Material

Info

Publication number
DE69521543D1
DE69521543D1 DE69521543T DE69521543T DE69521543D1 DE 69521543 D1 DE69521543 D1 DE 69521543D1 DE 69521543 T DE69521543 T DE 69521543T DE 69521543 T DE69521543 T DE 69521543T DE 69521543 D1 DE69521543 D1 DE 69521543D1
Authority
DE
Germany
Prior art keywords
lead frame
frame material
lead
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69521543T
Other languages
English (en)
Other versions
DE69521543T2 (de
Inventor
Yasuhito Naruse
Kiyoshi Kamitani
Akio Uesugi
Tsutomu Kakei
Gouichi Morohoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Application granted granted Critical
Publication of DE69521543D1 publication Critical patent/DE69521543D1/de
Publication of DE69521543T2 publication Critical patent/DE69521543T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31688—Next to aldehyde or ketone condensation product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31699—Ester, halide or nitrile of addition polymer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
DE69521543T 1994-03-14 1995-03-13 Leiterrahmen Material Expired - Fee Related DE69521543T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4267294A JP3262448B2 (ja) 1994-03-14 1994-03-14 リード・フレーム形成材料

Publications (2)

Publication Number Publication Date
DE69521543D1 true DE69521543D1 (de) 2001-08-09
DE69521543T2 DE69521543T2 (de) 2001-10-18

Family

ID=12642528

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69521543T Expired - Fee Related DE69521543T2 (de) 1994-03-14 1995-03-13 Leiterrahmen Material

Country Status (4)

Country Link
US (1) US5641577A (de)
EP (1) EP0672951B1 (de)
JP (1) JP3262448B2 (de)
DE (1) DE69521543T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3810510B2 (ja) * 1997-03-26 2006-08-16 富士写真フイルム株式会社 ネガ型画像記録材料及び平版印刷版原版
JP3978255B2 (ja) * 1997-06-24 2007-09-19 Ａｚエレクトロニックマテリアルズ株式会社 リソグラフィー用洗浄剤
JP4029556B2 (ja) * 2000-11-01 2008-01-09 Ｊｓｒ株式会社 感光性絶縁樹脂組成物およびその硬化物
US7820323B1 (en) 2006-09-07 2010-10-26 The United States Of America As Represented By The Secretary Of The Army Metal borate synthesis process
US7833660B1 (en) 2006-09-07 2010-11-16 The United States Of America As Represented By The Secretary Of The Army Fluorohaloborate salts, synthesis and use thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698620A (en) * 1970-03-25 1972-10-17 Motorola Inc Apparatus for connecting lead portions of a lead frame to respective pads on a chip
GB1576008A (en) * 1976-02-17 1980-10-01 Vickers Ltd Radiation sensitive plates
US4342151A (en) * 1979-06-18 1982-08-03 Eastman Kodak Company Blank and process for the formation of beam leads for IC chip bonding
JPS62154766A (ja) * 1985-12-27 1987-07-09 Nec Corp 半導体装置用リ−ドフレ−ムの製造方法
US4795694A (en) * 1986-06-20 1989-01-03 Siemens Aktiengesellschaft Manufacture of fine structures for semiconductor contacting
US4827118A (en) * 1986-07-10 1989-05-02 Minolta Camera Kabushiki Kaisha Light-sensitive device having color filter and manufacturing method thereof
JPS63279256A (ja) * 1987-05-11 1988-11-16 Sumitomo Metal Mining Co Ltd 写真エツチング方法
US4865950A (en) * 1988-01-21 1989-09-12 Eastman Kodak Co. Laminate for the formation of beam leads for IC chip bonding featuring improved positive-working resist
US5098814A (en) * 1990-04-26 1992-03-24 Eastman Kodak Company Laminate for the formation of beam leads for IC chip bonding
JP2926364B2 (ja) * 1990-11-30 1999-07-28 冨士薬品工業株式会社 ネガ型感光性組成物及びそれを用いたカラーフィルターの作成方法
US5183724A (en) * 1990-12-18 1993-02-02 Amkor Electronics, Inc. Method of producing a strip of lead frames for integrated circuit dies in a continuous system
JP3156945B2 (ja) * 1993-03-24 2001-04-16 富士写真フイルム株式会社 リード・フレーム形成用材の作製方法

Also Published As

Publication number Publication date
DE69521543T2 (de) 2001-10-18
EP0672951B1 (de) 2001-07-04
EP0672951A2 (de) 1995-09-20
US5641577A (en) 1997-06-24
EP0672951A3 (de) 1995-12-13
JP3262448B2 (ja) 2002-03-04
JPH07248617A (ja) 1995-09-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: FUJIFILM CORP., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee