FI954837L - Pintaepäpuhtauksien poistaminen sädettämällä - Google Patents

Pintaepäpuhtauksien poistaminen sädettämällä Download PDF

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Publication number
FI954837L
FI954837L FI954837A FI954837A FI954837L FI 954837 L FI954837 L FI 954837L FI 954837 A FI954837 A FI 954837A FI 954837 A FI954837 A FI 954837A FI 954837 L FI954837 L FI 954837L
Authority
FI
Finland
Prior art keywords
blasting
removal
surface impurities
impurities
Prior art date
Application number
FI954837A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI954837A7 (fi
FI954837A0 (fi
Inventor
Audrey C Engelsberg
Original Assignee
Cauldron Lp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21936355&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FI954837(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cauldron Lp filed Critical Cauldron Lp
Publication of FI954837A7 publication Critical patent/FI954837A7/fi
Publication of FI954837A0 publication Critical patent/FI954837A0/fi
Publication of FI954837L publication Critical patent/FI954837L/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1436—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for pressure control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1437—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for flow rate control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
    • H10P14/412—
    • H10P70/12—
    • H10P72/0406—
    • H10P95/00—
    • H10W20/092—

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Drying Of Semiconductors (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Steering Controls (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Processing Of Solid Wastes (AREA)
  • Cultivation Of Plants (AREA)
FI954837A 1993-04-12 1994-04-11 Pintaepäpuhtauksien poistaminen sädettämällä FI954837L (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4516593A 1993-04-12 1993-04-12
PCT/US1994/003907 WO1994023854A1 (en) 1993-04-12 1994-04-11 Removal of surface contaminants by irradiation

Publications (3)

Publication Number Publication Date
FI954837A7 FI954837A7 (fi) 1995-10-11
FI954837A0 FI954837A0 (fi) 1995-10-11
FI954837L true FI954837L (fi) 1995-10-11

Family

ID=21936355

Family Applications (1)

Application Number Title Priority Date Filing Date
FI954837A FI954837L (fi) 1993-04-12 1994-04-11 Pintaepäpuhtauksien poistaminen sädettämällä

Country Status (17)

Country Link
EP (1) EP0693978B1 (cg-RX-API-DMAC10.html)
JP (1) JP2820534B2 (cg-RX-API-DMAC10.html)
CN (1) CN1066644C (cg-RX-API-DMAC10.html)
AT (1) ATE186859T1 (cg-RX-API-DMAC10.html)
AU (1) AU684772B2 (cg-RX-API-DMAC10.html)
BR (1) BR9405973A (cg-RX-API-DMAC10.html)
CA (1) CA2160255A1 (cg-RX-API-DMAC10.html)
CZ (1) CZ267195A3 (cg-RX-API-DMAC10.html)
DE (1) DE69421806D1 (cg-RX-API-DMAC10.html)
FI (1) FI954837L (cg-RX-API-DMAC10.html)
HU (1) HUT73857A (cg-RX-API-DMAC10.html)
LV (1) LV11288B (cg-RX-API-DMAC10.html)
NO (1) NO954027L (cg-RX-API-DMAC10.html)
RU (1) RU2136467C1 (cg-RX-API-DMAC10.html)
SG (1) SG41949A1 (cg-RX-API-DMAC10.html)
TW (1) TW252211B (cg-RX-API-DMAC10.html)
WO (1) WO1994023854A1 (cg-RX-API-DMAC10.html)

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US5643472A (en) * 1988-07-08 1997-07-01 Cauldron Limited Partnership Selective removal of material by irradiation
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IL115934A0 (en) * 1995-11-09 1996-01-31 Oramir Semiconductor Ltd Laser processing chamber with cassette cell
IL115931A0 (en) 1995-11-09 1996-01-31 Oramir Semiconductor Ltd Laser stripping improvement by modified gas composition
EP0997761A4 (en) * 1997-06-10 2000-09-13 Nippon Kogaku Kk OPTICAL DEVICE, ITS CLEANING METHOD, PROJECTION ALIGNING DEVICE, AND ITS MANUFACTURING METHOD
US6325078B2 (en) * 1998-01-07 2001-12-04 Qc Solutions, Inc., Apparatus and method for rapid photo-thermal surface treatment
TW563002B (en) * 1999-11-05 2003-11-21 Asml Netherlands Bv Lithographic projection apparatus, method of manufacturing a device using a lithographic projection apparatus, and device manufactured by the method
RU2186667C2 (ru) * 2000-01-10 2002-08-10 Ковровская государственная технологическая академия Способ лазерной сварки металлов и сплавов
RU2206644C1 (ru) * 2001-11-22 2003-06-20 ГНЦ "Научно-исследовательский физико-химический институт им. Л.Я.Карпова" Устройство для обработки поверхности материалов лазерным лучом
DE10206687B4 (de) * 2002-02-18 2004-02-19 Infineon Technologies Ag Vorrichtung und Verfahren zur lichtinduzierten chemischen Behandlung eines Werkstücks
RU2243038C2 (ru) * 2002-11-28 2004-12-27 Общество с ограниченной ответственностью "Новые технологии и оборудование" Способ и устройство для мегазвуковой очистки подложек
CN102557313A (zh) 2004-04-15 2012-07-11 特洛伊人技术公司 水处理设备以及在流体处理系统中使用的处理筒
US7648581B2 (en) 2004-11-16 2010-01-19 Tokyo Electron Limited Substrate cleaning method, substrate cleaning apparatus, substrate processing system, substrate cleaning program and storage medium
JP4610308B2 (ja) * 2004-11-16 2011-01-12 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、基板処理システム、基板洗浄プログラム及び記憶媒体
RU2332285C2 (ru) * 2006-04-05 2008-08-27 Виктор Сергеевич Панус Способ сварки в защитном газе с газодинамическим удалением слоя загрязнений из зоны сварки
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GB2452941B (en) * 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process
DE102007051459A1 (de) * 2007-10-27 2009-05-14 Asml Netherlands B.V. Reinigung eines optischen Systems mittels Strahlungsenergie
ES2337860B8 (es) * 2007-12-19 2011-07-28 Airbus Operations, S.L. Procedimiento para la preparacion y limpieza de utiles de fabricacionde piezas de material compuesto, y dispositivo correspondiente.
CN101580222B (zh) * 2008-05-15 2011-11-16 原相科技股份有限公司 微机电元件与制作方法
US10493559B2 (en) 2008-07-09 2019-12-03 Fei Company Method and apparatus for laser machining
RU2445175C1 (ru) * 2010-06-28 2012-03-20 Общество с ограниченной ответственностью "Центр лазерных технологий" (ООО "ЦЛТ") Способ поверхностной лазерной обработки и устройство для его осуществления
DE102011079451A1 (de) 2011-07-20 2012-08-09 Carl Zeiss Smt Gmbh Optische Anordnung und Verfahren zur Verringerung von oxidischen Verunreinigungen
JP5453487B2 (ja) * 2012-05-24 2014-03-26 ジルトロニック アクチエンゲゼルシャフト 超音波洗浄方法および超音波洗浄装置
HU229953B1 (hu) * 2012-07-05 2015-03-02 Sld Enhanced Recovery, Inc Eljárás és berendezés elsősorban kitermelőcsövek alkáliföldfém-só lerakódásainak eltávolítására
RU2552296C2 (ru) * 2012-12-11 2015-06-10 Общество с ограниченной ответственностью "Медицинские нанотехнологии" Способ исследования нано- и микрообъектов методом зондовой микроскопии
DE102015011229B4 (de) * 2015-08-27 2020-07-23 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
US10014196B2 (en) * 2015-10-20 2018-07-03 Lam Research Corporation Wafer transport assembly with integrated buffers
CN106994453A (zh) * 2016-01-22 2017-08-01 台湾神户电池股份有限公司 电池极板板头清洁方法
CN107203094B (zh) * 2017-07-03 2020-07-24 京东方科技集团股份有限公司 掩膜版清理装置及方法
KR101987957B1 (ko) * 2017-09-05 2019-06-12 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN108145595B (zh) * 2017-12-22 2020-07-07 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种抛光液供给装置及系统
KR102573280B1 (ko) * 2018-03-21 2023-09-01 삼성전자주식회사 기판 세정 방법, 기판 세정 장치 및 그를 이용한 반도체 소자의 제조방법
KR102433558B1 (ko) 2019-07-11 2022-08-19 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR20220038811A (ko) * 2019-08-15 2022-03-29 에이비엠 컨설팅, 엘.엘.씨. 반도체 공작물의 재생 및 재활용
CN111943526A (zh) * 2020-07-06 2020-11-17 南方科技大学 抛光方法及应用、抛光装置、石英玻璃
CN112246782B (zh) * 2020-08-19 2022-04-12 厦门理工学院 一种激光清洗头
KR102504805B1 (ko) * 2021-03-15 2023-02-28 주식회사 지티아이코리아 웨이퍼 막질 제거 장치
EP4309809A1 (de) * 2022-07-19 2024-01-24 Müller, Axel Reinigungsverfahren mittels gasspülung
CN117960711A (zh) * 2024-03-07 2024-05-03 武汉锐科光纤激光技术股份有限公司 管道内壁激光清洗头及激光器清洗装置

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JPH05179447A (ja) * 1991-12-26 1993-07-20 Nissin High Voltage Co Ltd イオン注入装置
US5228206A (en) * 1992-01-15 1993-07-20 Submicron Systems, Inc. Cluster tool dry cleaning system

Also Published As

Publication number Publication date
BR9405973A (pt) 1995-12-12
HUT73857A (en) 1996-10-28
LV11288A (lv) 1996-06-20
CZ267195A3 (en) 1996-04-17
CN1066644C (zh) 2001-06-06
JPH08509652A (ja) 1996-10-15
FI954837A7 (fi) 1995-10-11
FI954837A0 (fi) 1995-10-11
JP2820534B2 (ja) 1998-11-05
WO1994023854A1 (en) 1994-10-27
LV11288B (en) 1996-12-20
HU9502907D0 (en) 1995-12-28
NO954027L (no) 1995-12-11
CA2160255A1 (en) 1994-10-27
EP0693978B1 (en) 1999-11-24
DE69421806D1 (de) 1999-12-30
AU6629794A (en) 1994-11-08
RU2136467C1 (ru) 1999-09-10
EP0693978A1 (en) 1996-01-31
CN1125917A (zh) 1996-07-03
NO954027D0 (no) 1995-10-10
AU684772B2 (en) 1998-01-08
TW252211B (cg-RX-API-DMAC10.html) 1995-07-21
SG41949A1 (en) 1997-08-15
ATE186859T1 (de) 1999-12-15

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