FI885114A - Silverglaspasta. - Google Patents

Silverglaspasta. Download PDF

Info

Publication number
FI885114A
FI885114A FI885114A FI885114A FI885114A FI 885114 A FI885114 A FI 885114A FI 885114 A FI885114 A FI 885114A FI 885114 A FI885114 A FI 885114A FI 885114 A FI885114 A FI 885114A
Authority
FI
Finland
Prior art keywords
silver
silverglaspasta
glass
thixotrope
solvent
Prior art date
Application number
FI885114A
Other languages
English (en)
Other versions
FI885114A0 (fi
Inventor
Thomas Herrington
Original Assignee
Johnson Matthey Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey Inc filed Critical Johnson Matthey Inc
Publication of FI885114A0 publication Critical patent/FI885114A0/fi
Publication of FI885114A publication Critical patent/FI885114A/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
  • Glass Compositions (AREA)
FI885114A 1987-11-05 1988-11-04 Silverglaspasta. FI885114A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/116,949 US4881974A (en) 1987-11-05 1987-11-05 Silver-glass paste

Publications (2)

Publication Number Publication Date
FI885114A0 FI885114A0 (fi) 1988-11-04
FI885114A true FI885114A (fi) 1989-05-06

Family

ID=22370213

Family Applications (1)

Application Number Title Priority Date Filing Date
FI885114A FI885114A (fi) 1987-11-05 1988-11-04 Silverglaspasta.

Country Status (5)

Country Link
US (1) US4881974A (fi)
EP (1) EP0315314A1 (fi)
JP (1) JPH01158790A (fi)
KR (1) KR890008915A (fi)
FI (1) FI885114A (fi)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8730196D0 (en) * 1987-12-24 1988-02-03 Johnson Matthey Plc Silver-filled glass
US5164119A (en) * 1988-09-23 1992-11-17 Johnson Matthey Inc. Silver-glass pastes
DE3905276C1 (fi) * 1989-02-21 1990-05-03 Demetron Gesellschaft Fuer Elektronik-Werkstoffe Mbh, 6450 Hanau, De
US5075262A (en) * 1990-02-21 1991-12-24 Johnson Matthey, Inc. Silver-glass pastes
JPH04270140A (ja) * 1990-06-21 1992-09-25 Johnson Matthey Inc シーリングガラス組成物および導電性成分を含む同組成物
US5084421A (en) * 1990-07-27 1992-01-28 Johnson Matthey, Inc. Silver-glass pastes
US5240884A (en) * 1991-09-05 1993-08-31 Johnson Matthey, Inc. Silver-glass die attach paste
US5510301A (en) * 1994-10-24 1996-04-23 Fink; Kimberly S. Sealing frit pastes
DE69807976T2 (de) * 1997-05-09 2003-06-05 Jsr Corp Zusammensetzung einer Glaspaste
US6244274B1 (en) 1999-07-30 2001-06-12 Opi Products, Inc. Thixotropic polymerizable nail sculpting compositions

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401767A (en) * 1981-08-03 1983-08-30 Johnson Matthey Inc. Silver-filled glass
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate
US4462827A (en) * 1982-11-19 1984-07-31 E. I. Du Pont De Nemours And Company Thick film silver metallization composition
US4532075A (en) * 1984-08-10 1985-07-30 E. I. Du Pont De Nemours And Company Thick film conductor composition
US4636254A (en) * 1985-07-23 1987-01-13 Quantum Materials, Inc. Silver-glass paste for attachment of silicon die to ceramic substrate
US4699888A (en) * 1985-09-16 1987-10-13 Technology Glass Corporation Die/attach composition

Also Published As

Publication number Publication date
EP0315314A1 (en) 1989-05-10
JPH01158790A (ja) 1989-06-21
US4881974A (en) 1989-11-21
KR890008915A (ko) 1989-07-13
FI885114A0 (fi) 1988-11-04

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Legal Events

Date Code Title Description
FD Application lapsed
MM Patent lapsed

Owner name: JOHNSON MATTHEY INC.