FI874260A0 - Foerfarande foer oekning av gaas-filmer pao si- och gaas-substrater. - Google Patents
Foerfarande foer oekning av gaas-filmer pao si- och gaas-substrater.Info
- Publication number
- FI874260A0 FI874260A0 FI874260A FI874260A FI874260A0 FI 874260 A0 FI874260 A0 FI 874260A0 FI 874260 A FI874260 A FI 874260A FI 874260 A FI874260 A FI 874260A FI 874260 A0 FI874260 A0 FI 874260A0
- Authority
- FI
- Finland
- Prior art keywords
- gaas
- substrater
- filmer
- pao
- och
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02395—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/035—Diffusion through a layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/072—Heterojunctions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/097—Lattice strain and defects
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/169—Vacuum deposition, e.g. including molecular beam epitaxy
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI874260A FI81926C (fi) | 1987-09-29 | 1987-09-29 | Foerfarande foer uppbyggning av gaas-filmer pao si- och gaas-substrater. |
US07/248,845 US4876218A (en) | 1987-09-29 | 1988-09-26 | Method of growing GaAs films on Si or GaAs substrates using ale |
GB8822689A GB2210502B (en) | 1987-09-29 | 1988-09-27 | Method of growing gaas films on si or gaas substrates |
DE3832902A DE3832902A1 (de) | 1987-09-29 | 1988-09-28 | Verfahren zum aufwachsen von gaas-filmen auf si- oder gaas-substrate |
FR888812701A FR2621171B1 (fr) | 1987-09-29 | 1988-09-28 | Procede permettant de faire croitre des films de gaas sur des substrats de si ou de gaas |
JP63245853A JPH01122997A (ja) | 1987-09-29 | 1988-09-29 | GaAsフイルムの分子ビームエピタキシャル成長法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI874260 | 1987-09-29 | ||
FI874260A FI81926C (fi) | 1987-09-29 | 1987-09-29 | Foerfarande foer uppbyggning av gaas-filmer pao si- och gaas-substrater. |
Publications (4)
Publication Number | Publication Date |
---|---|
FI874260A0 true FI874260A0 (fi) | 1987-09-29 |
FI874260A FI874260A (fi) | 1989-03-30 |
FI81926B FI81926B (fi) | 1990-08-31 |
FI81926C FI81926C (fi) | 1990-12-10 |
Family
ID=8525143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI874260A FI81926C (fi) | 1987-09-29 | 1987-09-29 | Foerfarande foer uppbyggning av gaas-filmer pao si- och gaas-substrater. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4876218A (fi) |
JP (1) | JPH01122997A (fi) |
DE (1) | DE3832902A1 (fi) |
FI (1) | FI81926C (fi) |
FR (1) | FR2621171B1 (fi) |
GB (1) | GB2210502B (fi) |
Families Citing this family (89)
Publication number | Priority date | Publication date | Assignee | Title |
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US5264389A (en) * | 1988-09-29 | 1993-11-23 | Sanyo Electric Co., Ltd. | Method of manufacturing a semiconductor laser device |
JP2947816B2 (ja) * | 1989-05-19 | 1999-09-13 | 三菱電機株式会社 | 半導体装置の製造方法 |
US5256594A (en) * | 1989-06-16 | 1993-10-26 | Intel Corporation | Masking technique for depositing gallium arsenide on silicon |
EP0435639A3 (en) * | 1989-12-28 | 1991-12-27 | Shimadzu Corporation | Method of thin film formation |
JP2706369B2 (ja) * | 1990-11-26 | 1998-01-28 | シャープ株式会社 | 化合物半導体の成長方法及び半導体レーザの製造方法 |
US5183779A (en) * | 1991-05-03 | 1993-02-02 | The United States Of America As Represented By The Secretary Of The Navy | Method for doping GaAs with high vapor pressure elements |
US5170226A (en) * | 1991-05-17 | 1992-12-08 | International Business Machines Corporation | Fabrication of quantum devices in compound semiconductor layers and resulting structures |
US6001669A (en) * | 1991-09-09 | 1999-12-14 | Philips Electronics North America Corporation | Method for producing II-VI compound semiconductor epitaxial layers having low defects |
US5356509A (en) * | 1992-10-16 | 1994-10-18 | Astropower, Inc. | Hetero-epitaxial growth of non-lattice matched semiconductors |
JP2576766B2 (ja) * | 1993-07-08 | 1997-01-29 | 日本電気株式会社 | 半導体基板の製造方法 |
JP3274246B2 (ja) * | 1993-08-23 | 2002-04-15 | コマツ電子金属株式会社 | エピタキシャルウェーハの製造方法 |
JP3272532B2 (ja) * | 1993-12-27 | 2002-04-08 | 富士通株式会社 | 半導体装置の製造方法 |
US5491114A (en) * | 1994-03-24 | 1996-02-13 | Starfire Electronic Development & Marketing, Ltd. | Method of making large-area semiconductor thin films formed at low temperature using nanocrystal presursors |
FI100409B (fi) | 1994-11-28 | 1997-11-28 | Asm Int | Menetelmä ja laitteisto ohutkalvojen valmistamiseksi |
US5456206A (en) * | 1994-12-07 | 1995-10-10 | Electronics And Telecommunications Research Institute | Method for two-dimensional epitaxial growth of III-V compound semiconductors |
GB2313606A (en) * | 1996-06-01 | 1997-12-03 | Sharp Kk | Forming a compound semiconductor film |
US6342277B1 (en) * | 1996-08-16 | 2002-01-29 | Licensee For Microelectronics: Asm America, Inc. | Sequential chemical vapor deposition |
US5916365A (en) * | 1996-08-16 | 1999-06-29 | Sherman; Arthur | Sequential chemical vapor deposition |
US6152074A (en) * | 1996-10-30 | 2000-11-28 | Applied Materials, Inc. | Deposition of a thin film on a substrate using a multi-beam source |
US5940723A (en) * | 1998-02-03 | 1999-08-17 | Lucent Technologies Inc. | Heteroepitaxial growth of III-V materials |
US20030219917A1 (en) * | 1998-12-21 | 2003-11-27 | Johnson Ralph H. | System and method using migration enhanced epitaxy for flattening active layers and the mechanical stabilization of quantum wells associated with vertical cavity surface emitting lasers |
US6563143B2 (en) | 1999-07-29 | 2003-05-13 | Stmicroelectronics, Inc. | CMOS circuit of GaAs/Ge on Si substrate |
US6392257B1 (en) | 2000-02-10 | 2002-05-21 | Motorola Inc. | Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same |
KR20030011083A (ko) | 2000-05-31 | 2003-02-06 | 모토로라 인코포레이티드 | 반도체 디바이스 및 이를 제조하기 위한 방법 |
US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7964505B2 (en) | 2005-01-19 | 2011-06-21 | Applied Materials, Inc. | Atomic layer deposition of tungsten materials |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US7732327B2 (en) | 2000-06-28 | 2010-06-08 | Applied Materials, Inc. | Vapor deposition of tungsten materials |
US7101795B1 (en) | 2000-06-28 | 2006-09-05 | Applied Materials, Inc. | Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer |
US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
AU2001277001A1 (en) | 2000-07-24 | 2002-02-05 | Motorola, Inc. | Heterojunction tunneling diodes and process for fabricating same |
US6825447B2 (en) | 2000-12-29 | 2004-11-30 | Applied Materials, Inc. | Apparatus and method for uniform substrate heating and contaminate collection |
US6998579B2 (en) | 2000-12-29 | 2006-02-14 | Applied Materials, Inc. | Chamber for uniform substrate heating |
US6765178B2 (en) | 2000-12-29 | 2004-07-20 | Applied Materials, Inc. | Chamber for uniform substrate heating |
US6811814B2 (en) | 2001-01-16 | 2004-11-02 | Applied Materials, Inc. | Method for growing thin films by catalytic enhancement |
US20020127336A1 (en) * | 2001-01-16 | 2002-09-12 | Applied Materials, Inc. | Method for growing thin films by catalytic enhancement |
US20020096683A1 (en) | 2001-01-19 | 2002-07-25 | Motorola, Inc. | Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US6660126B2 (en) | 2001-03-02 | 2003-12-09 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US6734020B2 (en) | 2001-03-07 | 2004-05-11 | Applied Materials, Inc. | Valve control system for atomic layer deposition chamber |
WO2002082551A1 (en) | 2001-04-02 | 2002-10-17 | Motorola, Inc. | A semiconductor structure exhibiting reduced leakage current |
US20020158245A1 (en) * | 2001-04-26 | 2002-10-31 | Motorola, Inc. | Structure and method for fabricating semiconductor structures and devices utilizing binary metal oxide layers |
US7060131B2 (en) * | 2001-05-09 | 2006-06-13 | Hrl Laboratories, Llc | Epitaxy with compliant layers of group-V species |
US6849545B2 (en) | 2001-06-20 | 2005-02-01 | Applied Materials, Inc. | System and method to form a composite film stack utilizing sequential deposition techniques |
US7211144B2 (en) | 2001-07-13 | 2007-05-01 | Applied Materials, Inc. | Pulsed nucleation deposition of tungsten layers |
US6992321B2 (en) | 2001-07-13 | 2006-01-31 | Motorola, Inc. | Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials |
US7019332B2 (en) * | 2001-07-20 | 2006-03-28 | Freescale Semiconductor, Inc. | Fabrication of a wavelength locker within a semiconductor structure |
US6855992B2 (en) | 2001-07-24 | 2005-02-15 | Motorola Inc. | Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same |
US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US20030034491A1 (en) | 2001-08-14 | 2003-02-20 | Motorola, Inc. | Structure and method for fabricating semiconductor structures and devices for detecting an object |
US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
US20030071327A1 (en) | 2001-10-17 | 2003-04-17 | Motorola, Inc. | Method and apparatus utilizing monocrystalline insulator |
US6916398B2 (en) | 2001-10-26 | 2005-07-12 | Applied Materials, Inc. | Gas delivery apparatus and method for atomic layer deposition |
US20030106487A1 (en) * | 2001-12-10 | 2003-06-12 | Wen-Chiang Huang | Photonic crystals and method for producing same |
US6729824B2 (en) | 2001-12-14 | 2004-05-04 | Applied Materials, Inc. | Dual robot processing system |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6998014B2 (en) | 2002-01-26 | 2006-02-14 | Applied Materials, Inc. | Apparatus and method for plasma assisted deposition |
US6827978B2 (en) | 2002-02-11 | 2004-12-07 | Applied Materials, Inc. | Deposition of tungsten films |
US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
US7439191B2 (en) | 2002-04-05 | 2008-10-21 | Applied Materials, Inc. | Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications |
US6720027B2 (en) | 2002-04-08 | 2004-04-13 | Applied Materials, Inc. | Cyclical deposition of a variable content titanium silicon nitride layer |
US6846516B2 (en) | 2002-04-08 | 2005-01-25 | Applied Materials, Inc. | Multiple precursor cyclical deposition system |
US6869838B2 (en) | 2002-04-09 | 2005-03-22 | Applied Materials, Inc. | Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications |
US6875271B2 (en) | 2002-04-09 | 2005-04-05 | Applied Materials, Inc. | Simultaneous cyclical deposition in different processing regions |
US7279432B2 (en) | 2002-04-16 | 2007-10-09 | Applied Materials, Inc. | System and method for forming an integrated barrier layer |
US6916717B2 (en) | 2002-05-03 | 2005-07-12 | Motorola, Inc. | Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate |
US6821563B2 (en) | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
US20040079285A1 (en) * | 2002-10-24 | 2004-04-29 | Motorola, Inc. | Automation of oxide material growth in molecular beam epitaxy systems |
US7169619B2 (en) | 2002-11-19 | 2007-01-30 | Freescale Semiconductor, Inc. | Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process |
US6885065B2 (en) * | 2002-11-20 | 2005-04-26 | Freescale Semiconductor, Inc. | Ferromagnetic semiconductor structure and method for forming the same |
US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
US6963090B2 (en) * | 2003-01-09 | 2005-11-08 | Freescale Semiconductor, Inc. | Enhancement mode metal-oxide-semiconductor field effect transistor |
US6965128B2 (en) | 2003-02-03 | 2005-11-15 | Freescale Semiconductor, Inc. | Structure and method for fabricating semiconductor microresonator devices |
US7020374B2 (en) | 2003-02-03 | 2006-03-28 | Freescale Semiconductor, Inc. | Optical waveguide structure and method for fabricating the same |
JP2007523994A (ja) | 2003-06-18 | 2007-08-23 | アプライド マテリアルズ インコーポレイテッド | バリヤ物質の原子層堆積 |
CN101432936B (zh) * | 2004-10-01 | 2011-02-02 | 菲尼萨公司 | 具有多顶侧接触的垂直腔面发射激光器 |
US7860137B2 (en) | 2004-10-01 | 2010-12-28 | Finisar Corporation | Vertical cavity surface emitting laser with undoped top mirror |
EP2025015A2 (en) * | 2006-06-02 | 2009-02-18 | Innovalight, Inc. | Photoactive materials containing group iv nanostructures and optoelectronic devices made therefrom |
EP2089897A2 (en) | 2006-12-07 | 2009-08-19 | Innovalight, Inc. | Methods for creating a densified group iv semiconductor nanoparticle thin film |
US7718707B2 (en) * | 2006-12-21 | 2010-05-18 | Innovalight, Inc. | Method for preparing nanoparticle thin films |
WO2008124400A1 (en) * | 2007-04-04 | 2008-10-16 | Innovalight, Inc. | Methods for optimizing thin film formation with reactive gases |
US7851336B2 (en) | 2008-03-13 | 2010-12-14 | Innovalight, Inc. | Method of forming a passivated densified nanoparticle thin film on a substrate |
US8247312B2 (en) | 2008-04-24 | 2012-08-21 | Innovalight, Inc. | Methods for printing an ink on a textured wafer surface |
CN102618922A (zh) * | 2012-04-06 | 2012-08-01 | 中国科学院合肥物质科学研究院 | 一种在Si基片上外延生长GaAs薄膜的方法 |
CN103147038B (zh) * | 2012-12-19 | 2014-10-29 | 常州星海电子有限公司 | 一种制备GaAs薄膜材料的方法 |
US9368670B2 (en) | 2014-04-21 | 2016-06-14 | University Of Oregon | GaAs thin films and methods of making and using the same |
CN105632965B (zh) * | 2016-03-24 | 2018-05-08 | 中国科学院上海微系统与信息技术研究所 | GaAs分子束外延生长过程中As原子最高结合率的测量方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE393967B (sv) * | 1974-11-29 | 1977-05-31 | Sateko Oy | Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket |
GB2130716A (en) * | 1982-11-26 | 1984-06-06 | Philips Electronic Associated | Method of determining the composition of an alloy film grown by a layer-by layer process |
JPS62219614A (ja) * | 1986-03-20 | 1987-09-26 | Oki Electric Ind Co Ltd | 化合物半導体の成長方法 |
US4767494A (en) * | 1986-07-04 | 1988-08-30 | Nippon Telegraph & Telephone Corporation | Preparation process of compound semiconductor |
-
1987
- 1987-09-29 FI FI874260A patent/FI81926C/fi not_active IP Right Cessation
-
1988
- 1988-09-26 US US07/248,845 patent/US4876218A/en not_active Expired - Fee Related
- 1988-09-27 GB GB8822689A patent/GB2210502B/en not_active Expired
- 1988-09-28 FR FR888812701A patent/FR2621171B1/fr not_active Expired - Fee Related
- 1988-09-28 DE DE3832902A patent/DE3832902A1/de active Granted
- 1988-09-29 JP JP63245853A patent/JPH01122997A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US4876218A (en) | 1989-10-24 |
FI81926B (fi) | 1990-08-31 |
DE3832902A1 (de) | 1989-04-13 |
GB2210502A (en) | 1989-06-07 |
GB8822689D0 (en) | 1988-11-02 |
FR2621171A1 (fr) | 1989-03-31 |
FI81926C (fi) | 1990-12-10 |
FI874260A (fi) | 1989-03-30 |
FR2621171B1 (fr) | 1994-03-04 |
JPH01122997A (ja) | 1989-05-16 |
GB2210502B (en) | 1990-08-29 |
DE3832902C2 (fi) | 1991-10-24 |
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