FI853647L - Optoelektronisk anordning. - Google Patents

Optoelektronisk anordning.

Info

Publication number
FI853647L
FI853647L FI853647A FI853647A FI853647L FI 853647 L FI853647 L FI 853647L FI 853647 A FI853647 A FI 853647A FI 853647 A FI853647 A FI 853647A FI 853647 L FI853647 L FI 853647L
Authority
FI
Finland
Prior art keywords
optoelektronisk
anordning
optoelektronisk anordning
Prior art date
Application number
FI853647A
Other languages
English (en)
Other versions
FI79215B (fi
FI79215C (fi
FI853647A0 (fi
Inventor
Michael Langenwalter
Lothar Spaeter
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI853647A0 publication Critical patent/FI853647A0/fi
Publication of FI853647L publication Critical patent/FI853647L/fi
Publication of FI79215B publication Critical patent/FI79215B/fi
Application granted granted Critical
Publication of FI79215C publication Critical patent/FI79215C/fi

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
FI853647A 1984-09-24 1985-09-23 Optoelektronisk anordning. FI79215C (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3435013 1984-09-24
DE3435013 1984-09-24

Publications (4)

Publication Number Publication Date
FI853647A0 FI853647A0 (fi) 1985-09-23
FI853647L true FI853647L (fi) 1986-03-25
FI79215B FI79215B (fi) 1989-07-31
FI79215C FI79215C (fi) 1989-11-10

Family

ID=6246208

Family Applications (1)

Application Number Title Priority Date Filing Date
FI853647A FI79215C (fi) 1984-09-24 1985-09-23 Optoelektronisk anordning.

Country Status (4)

Country Link
US (1) US4656352A (fi)
EP (1) EP0175936B1 (fi)
DE (1) DE3566169D1 (fi)
FI (1) FI79215C (fi)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4867532A (en) * 1985-10-16 1989-09-19 British Telecommunications Public Limited Company Wavelength selection device having a diffraction grating mounted on a torsion member
JP2580142B2 (ja) * 1985-10-28 1997-02-12 アメリカン テレフォン アンド テレグラフ カムパニー 多層セラミックレ−ザパッケ−ジ
US4799210A (en) * 1986-11-05 1989-01-17 Unisys Corporation Fiber optic read/write head for an optical disk memory system
US4826272A (en) * 1987-08-27 1989-05-02 American Telephone And Telegraph Company At&T Bell Laboratories Means for coupling an optical fiber to an opto-electronic device
FR2640430B1 (fr) * 1988-12-09 1992-07-31 Cit Alcatel Composant opto-electronique comprenant, notamment un boitier dans lequel est decoupee une fenetre
US5730134A (en) * 1996-09-09 1998-03-24 General Electric Company System to monitor temperature near an invasive device during magnetic resonance procedures
JP2001059923A (ja) * 1999-06-16 2001-03-06 Seiko Epson Corp 光モジュール及びその製造方法、半導体装置並びに光伝達装置
DE10032796A1 (de) * 2000-06-28 2002-01-17 Infineon Technologies Ag Optomodul
DE10034865B4 (de) * 2000-07-18 2006-06-01 Infineon Technologies Ag Optoelektronisches oberflächenmontierbares Modul
DE10209047A1 (de) * 2002-03-01 2003-12-18 Siemens Ag Faseroptisches Kommunikationsmodul und Verfahren zum Betreiben eines solchen Moduls
JP2006030660A (ja) * 2004-07-16 2006-02-02 Shinko Electric Ind Co Ltd 基板、半導体装置、基板の製造方法、及び半導体装置の製造方法
US10071583B2 (en) * 2009-10-16 2018-09-11 Apple Inc. Marking of product housings
EP2860560B1 (en) * 2013-10-14 2019-07-24 ams AG Semiconductor device with optical and electrical vias

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2440563A1 (fr) * 1978-11-02 1980-05-30 Labo Electronique Physique Dispositif de liaison entre fibres optiques et/ou dispositifs electro-optiques, et procede pour assurer leur positionnement optimal
JPS6060043B2 (ja) * 1979-02-09 1985-12-27 富士通株式会社 光半導体パッケ−ジ
US4268113A (en) * 1979-04-16 1981-05-19 International Business Machines Corporation Signal coupling element for substrate-mounted optical transducers
JPS57102077A (en) * 1980-12-16 1982-06-24 Mitsubishi Electric Corp Photo coupling device by photo semiconductor element and optical fiber
US4355321A (en) * 1981-02-02 1982-10-19 Varian Associates, Inc. Optoelectronic assembly including light transmissive single crystal semiconductor window
DE3142918A1 (de) * 1981-10-29 1983-05-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Opto-elektrische koppelanordnung
DE3244882A1 (de) * 1982-12-03 1984-06-07 Siemens AG, 1000 Berlin und 8000 München Sende- oder empfangsvorrichtung mit einer mittels eines traegers gehalterten diode
DE3311038A1 (de) * 1983-03-25 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Optische sender- und empfaengervorrichtung
DE3429282A1 (de) * 1984-08-08 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Optoelektronisches modul

Also Published As

Publication number Publication date
EP0175936A1 (de) 1986-04-02
FI79215B (fi) 1989-07-31
FI79215C (fi) 1989-11-10
FI853647A0 (fi) 1985-09-23
DE3566169D1 (en) 1988-12-15
EP0175936B1 (de) 1988-11-09
US4656352A (en) 1987-04-07

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Legal Events

Date Code Title Description
MM Patent lapsed

Owner name: SIEMENS AKTIENGESELLSCHAFT