FI20125633A - Rullalta rullalle -massavalmistukseen soveltuva laserprosessien rekisterikontrolli - Google Patents

Rullalta rullalle -massavalmistukseen soveltuva laserprosessien rekisterikontrolli Download PDF

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Publication number
FI20125633A
FI20125633A FI20125633A FI20125633A FI20125633A FI 20125633 A FI20125633 A FI 20125633A FI 20125633 A FI20125633 A FI 20125633A FI 20125633 A FI20125633 A FI 20125633A FI 20125633 A FI20125633 A FI 20125633A
Authority
FI
Finland
Prior art keywords
roll
laser process
laser
printing ink
mark
Prior art date
Application number
FI20125633A
Other languages
English (en)
Swedish (sv)
Other versions
FI124325B (fi
Inventor
Tom Marttila
Original Assignee
Tecnomar Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tecnomar Oy filed Critical Tecnomar Oy
Priority to FI20125633A priority Critical patent/FI124325B/fi
Publication of FI20125633A publication Critical patent/FI20125633A/fi
Priority to JP2013091390A priority patent/JP6013967B2/ja
Priority to PL13397514T priority patent/PL2671664T3/pl
Priority to ES13397514T priority patent/ES2777004T3/es
Priority to EP13397514.4A priority patent/EP2671664B1/en
Priority to BR102013012776-0A priority patent/BR102013012776B1/pt
Priority to RU2013125608/12A priority patent/RU2552906C2/ru
Priority to US13/910,852 priority patent/US9030512B2/en
Priority to CN201310220534.0A priority patent/CN103481662B/zh
Application granted granted Critical
Publication of FI124325B publication Critical patent/FI124325B/fi

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F33/00—Indicating, counting, warning, control or safety devices
    • B41F33/0081—Devices for scanning register marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04505—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/36—Blanking or long feeds; Feeding to a particular line, e.g. by rotation of platen or feed roller
    • B41J11/42—Controlling printing material conveyance for accurate alignment of the printing material with the printhead; Print registering
    • B41J11/46—Controlling printing material conveyance for accurate alignment of the printing material with the printhead; Print registering by marks or formations on the paper being fed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
  • Laser Beam Printer (AREA)
  • Laser Beam Processing (AREA)
  • Labeling Devices (AREA)
FI20125633A 2012-06-08 2012-06-08 Laserprosessin kohdistuksen mittausmenetelmä FI124325B (fi)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20125633A FI124325B (fi) 2012-06-08 2012-06-08 Laserprosessin kohdistuksen mittausmenetelmä
JP2013091390A JP6013967B2 (ja) 2012-06-08 2013-04-24 レーザプロセスアライメント測定方法
EP13397514.4A EP2671664B1 (en) 2012-06-08 2013-05-22 Laser process alignment measuring method
ES13397514T ES2777004T3 (es) 2012-06-08 2013-05-22 Procedimiento de medición de la alineación del procedimiento láser
PL13397514T PL2671664T3 (pl) 2012-06-08 2013-05-22 Sposób pomiaru dopasowania procesu laserowego
BR102013012776-0A BR102013012776B1 (pt) 2012-06-08 2013-05-23 Método de medição de alinhamento de processo a laser
RU2013125608/12A RU2552906C2 (ru) 2012-06-08 2013-06-04 Способ измерения согласования лазерной обработки
US13/910,852 US9030512B2 (en) 2012-06-08 2013-06-05 Laser process alignment measuring method
CN201310220534.0A CN103481662B (zh) 2012-06-08 2013-06-05 激光工艺对准测量方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20125633A FI124325B (fi) 2012-06-08 2012-06-08 Laserprosessin kohdistuksen mittausmenetelmä
FI20125633 2012-06-08

Publications (2)

Publication Number Publication Date
FI20125633A true FI20125633A (fi) 2013-03-19
FI124325B FI124325B (fi) 2014-06-30

Family

ID=48224715

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20125633A FI124325B (fi) 2012-06-08 2012-06-08 Laserprosessin kohdistuksen mittausmenetelmä

Country Status (9)

Country Link
US (1) US9030512B2 (fi)
EP (1) EP2671664B1 (fi)
JP (1) JP6013967B2 (fi)
CN (1) CN103481662B (fi)
BR (1) BR102013012776B1 (fi)
ES (1) ES2777004T3 (fi)
FI (1) FI124325B (fi)
PL (1) PL2671664T3 (fi)
RU (1) RU2552906C2 (fi)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI594893B (zh) * 2014-12-24 2017-08-11 Komori Corp Electronic circuit printing method and device
KR101787013B1 (ko) * 2015-08-27 2017-10-19 한밭대학교 산학협력단 롤투롤 인쇄전자 공정 기술을 이용한 미세패턴 형성 장치 및 제조 방법
US11113010B2 (en) 2016-05-16 2021-09-07 Hewlett-Packard Development Company, L.P. Printing using fiducial marks
JP6696641B2 (ja) * 2016-06-24 2020-05-20 アイマー・プランニング株式会社 印刷装置における印刷ズレ修正方法
CN109396695B (zh) * 2016-06-26 2021-09-03 何强 用于mig钎焊和火焰钎焊的紧固件和工件及其制作方法
CN107328359B (zh) * 2017-07-03 2021-12-03 京东方科技集团股份有限公司 用于检测墨滴的装置和方法
CN111815503B (zh) * 2020-06-03 2022-08-23 上海交通大学 一种基于线激光扫描的螺柱特征参数测量方法

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Also Published As

Publication number Publication date
US9030512B2 (en) 2015-05-12
RU2552906C2 (ru) 2015-06-10
JP6013967B2 (ja) 2016-10-25
BR102013012776B1 (pt) 2021-08-31
RU2013125608A (ru) 2014-12-10
US20130328994A1 (en) 2013-12-12
CN103481662A (zh) 2014-01-01
EP2671664A2 (en) 2013-12-11
BR102013012776A2 (pt) 2016-09-13
PL2671664T3 (pl) 2020-10-19
EP2671664A3 (en) 2017-02-01
ES2777004T3 (es) 2020-08-03
BR102013012776A8 (pt) 2021-04-13
FI124325B (fi) 2014-06-30
JP2013257309A (ja) 2013-12-26
CN103481662B (zh) 2017-04-12
EP2671664B1 (en) 2020-02-26

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