FI20045216A0 - Jäähdytyselementti - Google Patents
JäähdytyselementtiInfo
- Publication number
- FI20045216A0 FI20045216A0 FI20045216A FI20045216A FI20045216A0 FI 20045216 A0 FI20045216 A0 FI 20045216A0 FI 20045216 A FI20045216 A FI 20045216A FI 20045216 A FI20045216 A FI 20045216A FI 20045216 A0 FI20045216 A0 FI 20045216A0
- Authority
- FI
- Finland
- Prior art keywords
- flow channel
- heat sink
- pressure
- cooling element
- tail end
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
- Resistance Heating (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20045216A FI117590B (fi) | 2004-06-11 | 2004-06-11 | Jäähdytyselementti |
DE602005003058T DE602005003058T2 (de) | 2004-06-11 | 2005-05-03 | Kühlkörper |
US11/120,192 US7059390B2 (en) | 2004-06-11 | 2005-05-03 | Cooling element |
AT05103688T ATE377349T1 (de) | 2004-06-11 | 2005-05-03 | Kühlkörper |
EP05103688A EP1605741B1 (en) | 2004-06-11 | 2005-05-03 | Cooling element |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20045216 | 2004-06-11 | ||
FI20045216A FI117590B (fi) | 2004-06-11 | 2004-06-11 | Jäähdytyselementti |
Publications (3)
Publication Number | Publication Date |
---|---|
FI20045216A0 true FI20045216A0 (fi) | 2004-06-11 |
FI20045216A FI20045216A (fi) | 2005-12-12 |
FI117590B FI117590B (fi) | 2006-11-30 |
Family
ID=32524590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20045216A FI117590B (fi) | 2004-06-11 | 2004-06-11 | Jäähdytyselementti |
Country Status (5)
Country | Link |
---|---|
US (1) | US7059390B2 (fi) |
EP (1) | EP1605741B1 (fi) |
AT (1) | ATE377349T1 (fi) |
DE (1) | DE602005003058T2 (fi) |
FI (1) | FI117590B (fi) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7450384B2 (en) | 2006-07-06 | 2008-11-11 | Hybricon Corporation | Card cage with parallel flow paths having substantially similar lengths |
US7802636B2 (en) | 2007-02-23 | 2010-09-28 | Atwood Oceanics, Inc. | Simultaneous tubular handling system and method |
DE102007038510B4 (de) | 2007-08-14 | 2020-01-16 | Rauch Landmaschinenfabrik Gmbh | Vorrichtung zum Dosieren und Verteilen von landwirtschaftlichen und kommunalen Schüttgütern |
FI121863B (fi) * | 2007-09-07 | 2011-05-13 | Abb Oy | Elektroniikkalaitteen kuristin |
EP2131641A1 (en) * | 2008-06-04 | 2009-12-09 | ABB Oy | Cooling element for an electrical circuit |
SE533224C2 (sv) * | 2008-09-16 | 2010-07-27 | Sapa Profiler Ab | Kylkropp för kretskortkomponenter |
IT1401386B1 (it) * | 2010-07-30 | 2013-07-18 | Eurotech S P A | Dispositivo di raffreddamento a liquido per schede elettroniche, in particolare per unita' di elaborazione ad elevate prestazioni |
US8869877B2 (en) * | 2010-10-11 | 2014-10-28 | Hamilton Sundstrand Space Systems International, Inc. | Monolithic cold plate configuration |
US20120138281A1 (en) * | 2010-12-06 | 2012-06-07 | Transistor Devices, Inc. D/B/A Tdi Power | Heat Exchanger for Electronic Assemblies |
EP2629594A1 (en) * | 2012-02-14 | 2013-08-21 | ABB Oy | Electronic apparatus |
GB2527338B (en) * | 2014-06-19 | 2018-11-07 | ECONOTHERM UK Ltd | Heat transfer apparatus |
US20180328285A1 (en) * | 2017-05-11 | 2018-11-15 | Unison Industries, Llc | Heat exchanger |
DE102018129160B4 (de) * | 2018-11-20 | 2022-11-24 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Verfahren zur Herstellung eines Kühlkörpers |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1905653A (en) * | 1931-05-08 | 1933-04-25 | Walter Wood | Plug for steam platens and other metallic articles |
NL298883A (fi) * | 1963-09-06 | |||
US3327776A (en) * | 1965-10-24 | 1967-06-27 | Trane Co | Heat exchanger |
US3437132A (en) * | 1967-08-30 | 1969-04-08 | Vemaline Products Co Inc | Water cooled heat sink |
US3887004A (en) * | 1972-06-19 | 1975-06-03 | Hayden Trans Cooler Inc | Heat exchange apparatus |
JPS5271625A (en) * | 1975-12-10 | 1977-06-15 | Semikron Gleichrichterbau | Semiconductor rectifier device |
US4268850A (en) * | 1979-05-11 | 1981-05-19 | Electric Power Research Institute | Forced vaporization heat sink for semiconductor devices |
JPS61222242A (ja) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | 冷却装置 |
DE3717649A1 (de) * | 1987-05-26 | 1988-12-15 | Held Kurt | Doppelbandpresse mit erwaerm- oder kuehlbaren teilen und verfahren zu deren herstellung |
FR2729044B1 (fr) * | 1994-12-30 | 1997-01-24 | Atherm | Element refroisisseur et connecteur pour un composant electronique de puissance refroidi par un fluide electriquement isole du composant |
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US6058010A (en) * | 1998-11-06 | 2000-05-02 | International Business Machines Corporation | Enhanced test head liquid cooled cold plate |
EP1056323A1 (en) | 1999-05-25 | 2000-11-29 | Lucent Technologies Inc. | Cooling unit using pressure differential |
GB2354062A (en) * | 1999-09-13 | 2001-03-14 | British Broadcasting Corp | Cooling system for use in cooling electronic equipment |
US6796372B2 (en) * | 2001-06-12 | 2004-09-28 | Liebert Corporation | Single or dual buss thermal transfer system |
US6615911B1 (en) * | 2002-03-07 | 2003-09-09 | Delphi Technologies, Inc. | High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling |
DE10227008B4 (de) * | 2002-06-18 | 2012-10-18 | Robert Bosch Gmbh | Kühlvorrichtung für Halbleitermodule und Elektronikanordnung |
-
2004
- 2004-06-11 FI FI20045216A patent/FI117590B/fi not_active IP Right Cessation
-
2005
- 2005-05-03 US US11/120,192 patent/US7059390B2/en active Active
- 2005-05-03 AT AT05103688T patent/ATE377349T1/de not_active IP Right Cessation
- 2005-05-03 EP EP05103688A patent/EP1605741B1/en active Active
- 2005-05-03 DE DE602005003058T patent/DE602005003058T2/de active Active
Also Published As
Publication number | Publication date |
---|---|
US7059390B2 (en) | 2006-06-13 |
US20050274505A1 (en) | 2005-12-15 |
FI117590B (fi) | 2006-11-30 |
EP1605741A1 (en) | 2005-12-14 |
DE602005003058D1 (de) | 2007-12-13 |
EP1605741B1 (en) | 2007-10-31 |
FI20045216A (fi) | 2005-12-12 |
DE602005003058T2 (de) | 2008-02-28 |
ATE377349T1 (de) | 2007-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Patent granted |
Ref document number: 117590 Country of ref document: FI |
|
PC | Transfer of assignment of patent |
Owner name: ABB SCHWEIZ AG |
|
MM | Patent lapsed |