FI20021069A0 - Monikerrospiirilevyrakenteeseen muodostettu akustisesti aktiivinen elementti, menetelmä akustisesti aktiivisen elementin muodostamiseksi monikerrospiirilevyrakenteeseen sekä monikerrospiirilevyrakenne - Google Patents

Monikerrospiirilevyrakenteeseen muodostettu akustisesti aktiivinen elementti, menetelmä akustisesti aktiivisen elementin muodostamiseksi monikerrospiirilevyrakenteeseen sekä monikerrospiirilevyrakenne

Info

Publication number
FI20021069A0
FI20021069A0 FI20021069A FI20021069A FI20021069A0 FI 20021069 A0 FI20021069 A0 FI 20021069A0 FI 20021069 A FI20021069 A FI 20021069A FI 20021069 A FI20021069 A FI 20021069A FI 20021069 A0 FI20021069 A0 FI 20021069A0
Authority
FI
Finland
Prior art keywords
board structure
circuit board
multilayer circuit
active element
acoustically active
Prior art date
Application number
FI20021069A
Other languages
English (en)
Swedish (sv)
Other versions
FI118505B (fi
FI20021069A7 (fi
Inventor
Hannu Paeaerni
Terho Kutilainen
Matti Uusikartano
Auvo Penttinen
Original Assignee
Asperation Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asperation Oy filed Critical Asperation Oy
Publication of FI20021069A0 publication Critical patent/FI20021069A0/fi
Priority to FI20021069A priority Critical patent/FI118505B/fi
Priority to DE60331314T priority patent/DE60331314D1/de
Priority to MXPA04012164A priority patent/MXPA04012164A/es
Priority to EP03727545A priority patent/EP1520446B1/en
Priority to AU2003233833A priority patent/AU2003233833A1/en
Priority to US10/516,502 priority patent/US20050213788A1/en
Priority to BR0304934-5A priority patent/BR0304934A/pt
Priority to RU2004137792/28A priority patent/RU2004137792A/ru
Priority to AT03727545T priority patent/ATE458360T1/de
Priority to JP2004510281A priority patent/JP2005530384A/ja
Priority to PCT/FI2003/000423 priority patent/WO2003103334A1/en
Priority to CN038127822A priority patent/CN1659925A/zh
Publication of FI20021069A7 publication Critical patent/FI20021069A7/fi
Priority to NO20040463A priority patent/NO20040463L/no
Application granted granted Critical
Publication of FI118505B publication Critical patent/FI118505B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Micromachines (AREA)
  • Calculators And Similar Devices (AREA)
  • Mobile Radio Communication Systems (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
FI20021069A 2002-06-04 2002-06-04 Monikerrospiirilevyrakenteeseen muodostettu akustisesti aktiivinen elementti, menetelmä akustisesti aktiivisen elementin muodostamiseksi monikerrospiirilevyrakenteeseen sekä monikerrospiirilevyrakenne FI118505B (fi)

Priority Applications (13)

Application Number Priority Date Filing Date Title
FI20021069A FI118505B (fi) 2002-06-04 2002-06-04 Monikerrospiirilevyrakenteeseen muodostettu akustisesti aktiivinen elementti, menetelmä akustisesti aktiivisen elementin muodostamiseksi monikerrospiirilevyrakenteeseen sekä monikerrospiirilevyrakenne
BR0304934-5A BR0304934A (pt) 2002-06-04 2003-05-28 Elemento acusticamente ativo formado em uma estrutura de placa de circuito de múltiplas camadas, método de formar um elemento acusticamente ativo em uma estrutura de placa de circuito de múltiplas camadas, e estrutura de placa de circuito de múltiplas camadas
AT03727545T ATE458360T1 (de) 2002-06-04 2003-05-28 Methode zur herstellung eines akustisch aktiven elementes in der struktur einer multischichtschaltplatte und die struktur einer multischichtschaltplatte
EP03727545A EP1520446B1 (en) 2002-06-04 2003-05-28 Method for forming acoustically active element in a multi-layer circuit-board structure and a multi-layer circuit-board structure
AU2003233833A AU2003233833A1 (en) 2002-06-04 2003-05-28 An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure
US10/516,502 US20050213788A1 (en) 2002-06-04 2003-05-28 Acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure
DE60331314T DE60331314D1 (de) 2002-06-04 2003-05-28 Ementes in der struktur einer multischichtschaltplatte und die struktur einer multischichtschaltplatte
RU2004137792/28A RU2004137792A (ru) 2002-06-04 2003-05-28 Акустически активный элемент, сформированный в многослойной печатной плате, способ формирования акустически активного элемента в многослойной печатной плате и многослойная печатная плата
MXPA04012164A MXPA04012164A (es) 2002-06-04 2003-05-28 Un elemento acusticamente activo formado en una estructura de tarjeta de circuito de capas multiples, un metodo para formar un elemento acusticamente activo en una estructura de tarjeta de circuito de capas capas multiples, y una estructura de tarjet
JP2004510281A JP2005530384A (ja) 2002-06-04 2003-05-28 多層回路基板構造内に形成された音響活性素子、多層回路基板構造内への音響活性素子の形成方法、及び多層回路基板構造
PCT/FI2003/000423 WO2003103334A1 (en) 2002-06-04 2003-05-28 An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure
CN038127822A CN1659925A (zh) 2002-06-04 2003-05-28 在多层电路板结构中形成的声学有源元件、在多层电路板结构中形成声学有源元件的方法、及多层电路板结构
NO20040463A NO20040463L (no) 2002-06-04 2004-02-02 Et akustisk aktivt element tildannet i en flerlags kretskortstruktur, en fremgangsmåte for å tildanne et akustisk aktivt element i en flerlags kretskortstruktur, og en flerlags kretskortstruktur.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20021069 2002-06-04
FI20021069A FI118505B (fi) 2002-06-04 2002-06-04 Monikerrospiirilevyrakenteeseen muodostettu akustisesti aktiivinen elementti, menetelmä akustisesti aktiivisen elementin muodostamiseksi monikerrospiirilevyrakenteeseen sekä monikerrospiirilevyrakenne

Publications (3)

Publication Number Publication Date
FI20021069A0 true FI20021069A0 (fi) 2002-06-04
FI20021069A7 FI20021069A7 (fi) 2003-12-05
FI118505B FI118505B (fi) 2007-11-30

Family

ID=8564078

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20021069A FI118505B (fi) 2002-06-04 2002-06-04 Monikerrospiirilevyrakenteeseen muodostettu akustisesti aktiivinen elementti, menetelmä akustisesti aktiivisen elementin muodostamiseksi monikerrospiirilevyrakenteeseen sekä monikerrospiirilevyrakenne

Country Status (13)

Country Link
US (1) US20050213788A1 (fi)
EP (1) EP1520446B1 (fi)
JP (1) JP2005530384A (fi)
CN (1) CN1659925A (fi)
AT (1) ATE458360T1 (fi)
AU (1) AU2003233833A1 (fi)
BR (1) BR0304934A (fi)
DE (1) DE60331314D1 (fi)
FI (1) FI118505B (fi)
MX (1) MXPA04012164A (fi)
NO (1) NO20040463L (fi)
RU (1) RU2004137792A (fi)
WO (1) WO2003103334A1 (fi)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8483776B2 (en) 2005-07-27 2013-07-09 Sony Corporation Acoustic path for a wireless communications device
CN102970835B (zh) * 2011-09-02 2014-04-02 悦虎电路(苏州)有限公司 一种hdi线路板上盲孔的制作方法
CN109862500B (zh) * 2019-01-17 2021-01-15 江苏普诺威电子股份有限公司 多孔进音单孔传声的mems麦克风载板的制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3718018A1 (de) * 1987-05-27 1988-12-08 Diehl Gmbh & Co Elektronischer akustischer signalgeber
US5287084A (en) * 1991-02-01 1994-02-15 Star Micronics Co., Ltd. Thin buzzer
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
JPH0946794A (ja) * 1995-07-31 1997-02-14 Taiyo Yuden Co Ltd 圧電音響装置
JPH09200895A (ja) * 1996-01-16 1997-07-31 Star Micronics Co Ltd 電気音響変換器
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US6093144A (en) * 1997-12-16 2000-07-25 Symphonix Devices, Inc. Implantable microphone having improved sensitivity and frequency response
JP3373151B2 (ja) * 1998-04-24 2003-02-04 株式会社シチズン電子 電磁型発音体
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone

Also Published As

Publication number Publication date
AU2003233833A1 (en) 2003-12-19
US20050213788A1 (en) 2005-09-29
FI118505B (fi) 2007-11-30
NO20040463L (no) 2004-02-02
DE60331314D1 (de) 2010-04-01
EP1520446A1 (en) 2005-04-06
RU2004137792A (ru) 2005-07-10
JP2005530384A (ja) 2005-10-06
MXPA04012164A (es) 2005-09-21
BR0304934A (pt) 2004-09-28
CN1659925A (zh) 2005-08-24
ATE458360T1 (de) 2010-03-15
EP1520446B1 (en) 2010-02-17
WO2003103334A1 (en) 2003-12-11
FI20021069A7 (fi) 2003-12-05

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