ES517620A0 - Un procedimiento para la eliminacion quimica de soldantes de estano y de aleacion de estano-plomo de un substrato. - Google Patents
Un procedimiento para la eliminacion quimica de soldantes de estano y de aleacion de estano-plomo de un substrato.Info
- Publication number
- ES517620A0 ES517620A0 ES517620A ES517620A ES517620A0 ES 517620 A0 ES517620 A0 ES 517620A0 ES 517620 A ES517620 A ES 517620A ES 517620 A ES517620 A ES 517620A ES 517620 A0 ES517620 A0 ES 517620A0
- Authority
- ES
- Spain
- Prior art keywords
- stanum
- stanan
- soldering
- procedure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
- B23K35/3605—Fluorides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8135327 | 1981-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8404421A1 ES8404421A1 (es) | 1984-04-16 |
ES517620A0 true ES517620A0 (es) | 1984-04-16 |
Family
ID=10526092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES517620A Granted ES517620A0 (es) | 1981-11-24 | 1982-11-23 | Un procedimiento para la eliminacion quimica de soldantes de estano y de aleacion de estano-plomo de un substrato. |
Country Status (15)
Country | Link |
---|---|
US (1) | US4410396A (es) |
JP (1) | JPS6043436B2 (es) |
AU (1) | AU557227B2 (es) |
BE (1) | BE895126A (es) |
BR (1) | BR8206783A (es) |
CA (1) | CA1196560A (es) |
CH (1) | CH654597A5 (es) |
DE (1) | DE3242899C2 (es) |
DK (1) | DK521882A (es) |
ES (1) | ES517620A0 (es) |
FR (1) | FR2516930B1 (es) |
HK (1) | HK57988A (es) |
IT (1) | IT1197435B (es) |
NL (1) | NL8204579A (es) |
SE (1) | SE8206447L (es) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4536322A (en) * | 1983-10-28 | 1985-08-20 | Union Carbide Corporation | Fluorescent corrosive fluoride solution |
AT380493B (de) * | 1984-06-18 | 1986-05-26 | Kapsch Ag | Mittel zur chemischen oberflaechenbehandlung von metallen |
DE3623504A1 (de) * | 1986-07-09 | 1988-01-21 | Schering Ag | Kupferaetzloesungen |
CH674851A5 (es) * | 1987-12-01 | 1990-07-31 | Bbc Brown Boveri & Cie | |
JPH0260682U (es) * | 1988-10-27 | 1990-05-07 | ||
US5232619A (en) * | 1990-10-19 | 1993-08-03 | Praxair S.T. Technology, Inc. | Stripping solution for stripping compounds of titanium from base metals |
US5219484A (en) * | 1991-04-25 | 1993-06-15 | Applied Electroless Concepts Inc. | Solder and tin stripper compositions |
US5211807A (en) * | 1991-07-02 | 1993-05-18 | Microelectronics Computer & Technology | Titanium-tungsten etching solutions |
US5961736A (en) * | 1993-04-05 | 1999-10-05 | Active Environmental Technologies, Inc. | Method for removal of contaminants from surfaces |
US5421906A (en) * | 1993-04-05 | 1995-06-06 | Enclean Environmental Services Group, Inc. | Methods for removal of contaminants from surfaces |
US5728660A (en) * | 1993-04-05 | 1998-03-17 | Eet, Inc. | Extraction fluids for removal of contaminants from surfaces |
US5741432A (en) * | 1995-01-17 | 1998-04-21 | The Dexter Corporation | Stabilized nitric acid compositions |
US5512201A (en) * | 1995-02-13 | 1996-04-30 | Applied Chemical Technologies, Inc. | Solder and tin stripper composition |
US6248704B1 (en) | 1999-05-03 | 2001-06-19 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductors devices |
US6394114B1 (en) | 1999-11-22 | 2002-05-28 | Chartered Semiconductor Manufacturing Ltd. | Method for stripping copper in damascene interconnects |
JP2002114993A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄剤及び洗浄方法 |
JP2002113431A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄方法 |
WO2003010271A1 (en) * | 2001-07-25 | 2003-02-06 | Cheon Young Chemical Co., Ltd. | Surface treatment composition and method for removing si component and reduced metal salt produced on the aluminum dicast material in etching process |
KR100464858B1 (ko) * | 2002-08-23 | 2005-01-05 | 삼성전자주식회사 | 유기 스트리핑 조성물 및 이를 사용한 산화물 식각 방법 |
US6960370B2 (en) | 2003-03-27 | 2005-11-01 | Scimed Life Systems, Inc. | Methods of forming medical devices |
US7867404B2 (en) * | 2005-11-15 | 2011-01-11 | Joel Allen Deutsch | Method for converting electrical components |
CN102234513A (zh) * | 2010-04-20 | 2011-11-09 | 深圳富泰宏精密工业有限公司 | 含钛膜层的退镀液及其使用方法 |
KR101868319B1 (ko) | 2010-10-06 | 2018-06-15 | 엔테그리스, 아이엔씨. | 질화 금속을 선택적으로 에칭하기 위한 조성물 및 방법 |
CN113984465A (zh) * | 2021-10-12 | 2022-01-28 | 江西洪都航空工业集团有限责任公司 | 一种用于溶解钎锡焊料的溶解液及溶解方法 |
CN114622211B (zh) * | 2022-03-23 | 2023-08-15 | 金盟科技(深圳)有限公司 | 基于拉白工艺的铝环保漂白处理剂复配物制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3597290A (en) * | 1968-03-25 | 1971-08-03 | Mitsubishi Edogawa Kagaku Kk | Method for chemically dissolving metal |
GB1446816A (en) * | 1973-05-02 | 1976-08-18 | Furukawa Electric Co Ltd | Chemical dissolution treatment of tin or alloys thereof |
US3990982A (en) * | 1974-12-18 | 1976-11-09 | Rbp Chemical Corporation | Composition for stripping lead-tin solder |
FR2297906A1 (fr) * | 1975-01-14 | 1976-08-13 | Ugine Kuhlmann | Stabilisation du peroxyde d'hydrogene dans les bains acides pour le decapage des metaux |
US4306933A (en) * | 1980-02-11 | 1981-12-22 | Chemline Industries | Tin/tin-lead stripping solutions |
-
1982
- 1982-11-12 CA CA000415427A patent/CA1196560A/en not_active Expired
- 1982-11-12 SE SE8206447A patent/SE8206447L/ not_active Application Discontinuation
- 1982-11-20 DE DE3242899A patent/DE3242899C2/de not_active Expired
- 1982-11-22 IT IT49544/82A patent/IT1197435B/it active
- 1982-11-23 BR BR8206783A patent/BR8206783A/pt not_active IP Right Cessation
- 1982-11-23 ES ES517620A patent/ES517620A0/es active Granted
- 1982-11-23 DK DK521882A patent/DK521882A/da unknown
- 1982-11-23 FR FR8219601A patent/FR2516930B1/fr not_active Expired
- 1982-11-23 US US06/443,977 patent/US4410396A/en not_active Expired - Fee Related
- 1982-11-24 AU AU90864/82A patent/AU557227B2/en not_active Ceased
- 1982-11-24 JP JP57205916A patent/JPS6043436B2/ja not_active Expired
- 1982-11-24 CH CH6855/82A patent/CH654597A5/de not_active IP Right Cessation
- 1982-11-24 NL NL8204579A patent/NL8204579A/nl unknown
- 1982-11-24 BE BE0/209557A patent/BE895126A/fr not_active IP Right Cessation
-
1988
- 1988-07-28 HK HK579/88A patent/HK57988A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
BR8206783A (pt) | 1983-10-04 |
FR2516930A1 (fr) | 1983-05-27 |
JPS6043436B2 (ja) | 1985-09-27 |
AU557227B2 (en) | 1986-12-11 |
NL8204579A (nl) | 1983-06-16 |
DE3242899C2 (de) | 1987-03-19 |
FR2516930B1 (fr) | 1985-10-04 |
CA1196560A (en) | 1985-11-12 |
ES8404421A1 (es) | 1984-04-16 |
US4410396A (en) | 1983-10-18 |
DK521882A (da) | 1983-05-25 |
IT1197435B (it) | 1988-11-30 |
DE3242899A1 (de) | 1983-06-01 |
JPS5896878A (ja) | 1983-06-09 |
AU9086482A (en) | 1983-06-02 |
IT8249544A0 (it) | 1982-11-22 |
BE895126A (fr) | 1983-05-24 |
HK57988A (en) | 1988-08-05 |
SE8206447D0 (sv) | 1982-11-12 |
SE8206447L (sv) | 1983-05-25 |
CH654597A5 (de) | 1986-02-28 |
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