ES478286A1 - Un metodo de fabricacion de un conjunto de diodo emisor de luz. - Google Patents

Un metodo de fabricacion de un conjunto de diodo emisor de luz.

Info

Publication number
ES478286A1
ES478286A1 ES478286A ES478286A ES478286A1 ES 478286 A1 ES478286 A1 ES 478286A1 ES 478286 A ES478286 A ES 478286A ES 478286 A ES478286 A ES 478286A ES 478286 A1 ES478286 A1 ES 478286A1
Authority
ES
Spain
Prior art keywords
light emitting
emitting diode
diode assembly
pairs
transmitting material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES478286A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES478286A1 publication Critical patent/ES478286A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Un método de fabricación de un conjunto de diodo emisor de luz que comprende un DEL (LED) conectado entre un par de contactos y encapsulado dentro de un material transmisor de la luz, extendiendose partes de los contactos desde la encapsulación para conexión al circuito, caracterizado por formar una pluralidad de contactos idénticos enterizos con una tira portadora de chapa metálica, teniendo cada contacto una parte alargada en general plana que se extiende desde un borde lateral de la tira portadora, en forma coplanaria, perpendicular a la longitud de la tira, y un brazo de resorte doblado hacia arriba desde un lado de la parte alargada en un extremo de la misma distante de la tira, alrededor de un eje que se extienden en sentido longitudinal de la parte alargada y perpendicularmente a la tira, situar dos secciones de tira portadora en relación de coplanarias, espaciadas y paralelas, con los contactos de cada ttira extendiendose hacia la otra tira y con los extremos de los brazos d e resorte de una tira solapando a los extremos de los correspondientes brazos de resorte de la otra tira, en relación de cara con cara, ajustar las posiciones relativas de las tiras en sentido longitudinal, para reducir el espacio de separación entre cada par de extremos de brazo de resorte enfrentados a menos que la de un DEL que haya de ser cogido entre ellos, ejercer acción de resorte de los brazos en sentido de separarlos e introducir el diodo entre los extremos libres, aflojar los brazos, para aplicarse elásticamente y coger entre ellos al DEL, conectar eléctricamente los extremos libres a los respectivos lados del DEL, encapsular el diodo cogido y partes de los brazos dentro de material transmisor de la luz y cortar los contactos de las tiras.
ES478286A 1978-03-06 1979-03-05 Un metodo de fabricacion de un conjunto de diodo emisor de luz. Expired ES478286A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/883,559 US4247864A (en) 1978-03-06 1978-03-06 Light emitting diode assembly

Publications (1)

Publication Number Publication Date
ES478286A1 true ES478286A1 (es) 1979-11-01

Family

ID=25382836

Family Applications (1)

Application Number Title Priority Date Filing Date
ES478286A Expired ES478286A1 (es) 1978-03-06 1979-03-05 Un metodo de fabricacion de un conjunto de diodo emisor de luz.

Country Status (11)

Country Link
US (1) US4247864A (es)
JP (1) JPS54126490A (es)
BE (1) BE874462A (es)
CA (1) CA1132694A (es)
DE (1) DE2908460A1 (es)
ES (1) ES478286A1 (es)
FR (1) FR2419589A1 (es)
GB (1) GB2015387B (es)
IT (1) IT1110792B (es)
NL (1) NL7901166A (es)
SE (1) SE7902026L (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2940769A1 (de) * 1979-10-08 1981-04-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zur kontaktierung von leuchtdioden
US4404582A (en) * 1980-11-28 1983-09-13 Westinghouse Electric Corp. Mounting arrangement for disc mounted semiconductor devices
EP0079161A3 (en) * 1981-11-06 1985-04-24 AMP INCORPORATED (a New Jersey corporation) Led lamp and mounting base therefor
US4471158A (en) * 1981-12-11 1984-09-11 Advanced Circuit Technology, Inc. Programmable header
JPS5991764U (ja) * 1982-12-10 1984-06-21 ロ−ム株式会社 発光ダイオ−ドランプ
IT1212708B (it) * 1983-02-28 1989-11-30 Ates Componenti Elettron Dispositivo di potenza a semiconduttore costituito da una molteplicita' di elementi attivi uguali collegati in parallelo.
FR2565726B1 (fr) * 1984-06-08 1987-11-27 Radiotechnique Compelec Procede de realisation d'un panneau lumineux de signalisation a diodes electroluminescentes et panneau ainsi obtenu.
EP0273364B1 (en) * 1986-12-26 1992-03-25 Idec Izumi Corporation Electronic part carrying strip and method of manufacturing the same
DE19621124A1 (de) * 1996-05-24 1997-11-27 Siemens Ag Optoelektronischer Wandler und dessen Herstellungsverfahren
US6083768A (en) * 1996-09-06 2000-07-04 Micron Technology, Inc. Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
KR20020045694A (ko) * 2000-12-09 2002-06-20 이택렬 광 반도체 소자 및 그 제조방법
US7510400B2 (en) * 2007-03-14 2009-03-31 Visteon Global Technologies, Inc. LED interconnect spring clip assembly
US7621752B2 (en) * 2007-07-17 2009-11-24 Visteon Global Technologies, Inc. LED interconnection integrated connector holder package
JP4726882B2 (ja) * 2007-11-15 2011-07-20 株式会社阪村研究所 貼付式治療具に用いる刺激用粒体の製造方法
JP2009152227A (ja) * 2007-12-18 2009-07-09 Pearl Lighting Co Ltd 反射型発光ダイオード
US20090207617A1 (en) * 2008-02-20 2009-08-20 Merchant Viren B Light emitting diode (led) connector clip
DE102011087709B4 (de) * 2011-12-05 2022-03-03 Ledvance Gmbh Halbleiteranordnung und verfahren zum fertigen einer halbleiteranordnung
CN102496825B (zh) * 2011-12-14 2013-09-04 番禺得意精密电子工业有限公司 电连接器的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3702954A (en) * 1967-07-21 1972-11-14 Siemens Ag Semiconductor component and method of its production
US3500136A (en) * 1968-01-24 1970-03-10 Int Rectifier Corp Contact structure for small area contact devices
DE1907075B2 (de) * 1969-02-13 1974-07-04 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Verfahren zur Herstellung von Halbleiter-Kleingleichrichtern
DE1916554B2 (de) * 1969-04-01 1974-07-04 Semikron Gesellschaft Fuer Gleichrichterbau Und Elektronik Mbh, 8500 Nuernberg Verfahren zum Herstellen von Halbleitergleichrichteranordnungen
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes

Also Published As

Publication number Publication date
GB2015387B (en) 1982-02-03
GB2015387A (en) 1979-09-12
JPS54126490A (en) 1979-10-01
SE7902026L (sv) 1979-09-07
NL7901166A (nl) 1979-09-10
FR2419589B1 (es) 1981-01-09
IT1110792B (it) 1986-01-06
BE874462A (fr) 1979-08-27
DE2908460A1 (de) 1979-09-13
CA1132694A (en) 1982-09-28
FR2419589A1 (fr) 1979-10-05
IT7920359A0 (it) 1979-02-20
US4247864A (en) 1981-01-27

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