ES418485A1 - Disposicion de estructura de circuito integrado de aisla- miento de multiples capas. - Google Patents
Disposicion de estructura de circuito integrado de aisla- miento de multiples capas.Info
- Publication number
- ES418485A1 ES418485A1 ES418485A ES418485A ES418485A1 ES 418485 A1 ES418485 A1 ES 418485A1 ES 418485 A ES418485 A ES 418485A ES 418485 A ES418485 A ES 418485A ES 418485 A1 ES418485 A1 ES 418485A1
- Authority
- ES
- Spain
- Prior art keywords
- layer
- openings
- contacts
- regions
- translation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009413 insulation Methods 0.000 title abstract 2
- 238000001465 metallisation Methods 0.000 abstract 3
- 239000012535 impurity Substances 0.000 abstract 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US298729A US3877051A (en) | 1972-10-18 | 1972-10-18 | Multilayer insulation integrated circuit structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES418485A1 true ES418485A1 (es) | 1976-04-16 |
Family
ID=23151792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES418485A Expired ES418485A1 (es) | 1972-10-18 | 1973-09-05 | Disposicion de estructura de circuito integrado de aisla- miento de multiples capas. |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5428073B2 (cs) |
| DD (1) | DD109476A5 (cs) |
| ES (1) | ES418485A1 (cs) |
| IT (1) | IT1001545B (cs) |
| SE (1) | SE386308B (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519857A (en) * | 1978-07-28 | 1980-02-12 | Nec Corp | Semiconductor |
-
1973
- 1973-09-05 ES ES418485A patent/ES418485A1/es not_active Expired
- 1973-09-18 IT IT29049/73A patent/IT1001545B/it active
- 1973-09-20 SE SE7312846A patent/SE386308B/xx unknown
- 1973-09-21 DD DD173613A patent/DD109476A5/xx unknown
- 1973-10-05 JP JP11155873A patent/JPS5428073B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DD109476A5 (cs) | 1974-11-05 |
| IT1001545B (it) | 1976-04-30 |
| JPS5428073B2 (cs) | 1979-09-13 |
| JPS4975065A (cs) | 1974-07-19 |
| SE386308B (sv) | 1976-08-02 |
| SE7312846L (cs) | 1974-04-19 |
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