ES372831A1 - Process and apparatus for etching copper and copper alloys - Google Patents

Process and apparatus for etching copper and copper alloys

Info

Publication number
ES372831A1
ES372831A1 ES372831A ES372831A ES372831A1 ES 372831 A1 ES372831 A1 ES 372831A1 ES 372831 A ES372831 A ES 372831A ES 372831 A ES372831 A ES 372831A ES 372831 A1 ES372831 A1 ES 372831A1
Authority
ES
Spain
Prior art keywords
copper
etching
alloys
solution
copper alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES372831A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SABA GmbH
Original Assignee
SABA GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681807414 external-priority patent/DE1807414C3/en
Application filed by SABA GmbH filed Critical SABA GmbH
Publication of ES372831A1 publication Critical patent/ES372831A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Copper and copper alloys, in particular copper-coated laminates, are etched by immersing them in or spraying them with a solution of cupric chloride and regenerating the formed cuprous chloride during continuing operation by adding hydrogen peroxide and hydrochloric acid to the etching solution, the amount of the addition being controlled by measurements of the redox potential by means of a redox electrode and the control being adjusted to add predetermined amounts of the said two additives whenever the copper-I-ion concentration reaches a predetermined value, preferably 0.4 g/l so as to maintain a constant etching speed.
ES372831A 1968-11-07 1969-10-24 Process and apparatus for etching copper and copper alloys Expired ES372831A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681807414 DE1807414C3 (en) 1968-11-07 Process for etching copper and copper alloys, especially copper-clad laminates

Publications (1)

Publication Number Publication Date
ES372831A1 true ES372831A1 (en) 1971-11-01

Family

ID=5712562

Family Applications (1)

Application Number Title Priority Date Filing Date
ES372831A Expired ES372831A1 (en) 1968-11-07 1969-10-24 Process and apparatus for etching copper and copper alloys

Country Status (10)

Country Link
US (1) US3880685A (en)
JP (1) JPS5013223B1 (en)
AT (1) AT293812B (en)
BE (1) BE740609A (en)
CH (1) CH505213A (en)
ES (1) ES372831A1 (en)
FR (1) FR2022757A1 (en)
GB (1) GB1244415A (en)
LU (1) LU59712A1 (en)
NL (1) NL167477C (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964956A (en) * 1974-10-24 1976-06-22 General Dynamics Corporation System for maintaining uniform copper etching efficiency
US3951711A (en) * 1974-10-24 1976-04-20 General Dynamics Corporation System for maintaining uniform copper etching efficiency
US3962005A (en) * 1975-06-30 1976-06-08 Zenith Radio Corporation Method for etching shadow mask and regenerating etchant
US4190481A (en) * 1977-12-30 1980-02-26 Chemcut Corporation Apparatus for ion control of solutions
DE3035864A1 (en) * 1980-09-23 1982-05-06 Siemens AG, 1000 Berlin und 8000 München DEVICE FOR REGENERATING SALT ACID COPPER CHLORIDE ACET SOLUTIONS
EP0178347B1 (en) * 1984-10-19 1988-09-07 Ibm Deutschland Gmbh Process for automatically regenerating cupric chloride etching solutions
DE3539874A1 (en) * 1985-11-11 1987-05-14 Hoellmueller Maschbau H PLANT FOR ATTRIBUTING AT LEAST PARTLY OF METAL, PREFERABLY COPPER, EXISTING CORE
US5013395A (en) * 1987-08-28 1991-05-07 International Business Machines Corporation Continuous regeneration of acid solution
US5246023A (en) * 1990-04-24 1993-09-21 Electronic Controls Design, Inc. Method and apparatus to clean and cleanliness test printed circuit boards
US5227010A (en) * 1991-04-03 1993-07-13 International Business Machines Corporation Regeneration of ferric chloride etchants
US5259979A (en) * 1993-01-13 1993-11-09 Oliver Sales Company Process for regeneration of cleaning compounds
JP3074366B2 (en) * 1993-02-22 2000-08-07 東京エレクトロン株式会社 Processing equipment
TW256929B (en) * 1993-12-29 1995-09-11 Hirama Rika Kenkyusho Kk
US5534078A (en) * 1994-01-27 1996-07-09 Breunsbach; Rex Method for cleaning electronic assemblies
JPH09199467A (en) * 1996-01-17 1997-07-31 Mitsubishi Electric Corp Cleaner and its method
JP3093975B2 (en) * 1996-07-02 2000-10-03 株式会社平間理化研究所 Resist stripper management system
KR100652044B1 (en) * 2001-12-18 2006-11-30 엘지.필립스 엘시디 주식회사 Apparatus For Stripping
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
SE531697C2 (en) * 2007-07-11 2009-07-07 Sigma Engineering Ab Etching and recycling process
WO2010030505A1 (en) * 2008-09-10 2010-03-18 Austin American Technology Corporation Cleaning and testing ionic cleanliness of electronic assemblies
CN109811343B (en) * 2019-03-19 2020-11-17 惠州市瑞翔丰科技有限公司 Ammonia nitrogen-free environment-friendly etching solution and etching method
CN113046746B (en) * 2021-03-12 2023-03-10 合肥颀材科技有限公司 Precise etching control method for COF (chip on film) winding

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL96899C (en) * 1954-08-26
US2927871A (en) * 1956-03-26 1960-03-08 Bethlehem Steel Corp Control of pickling baths
US2977199A (en) * 1956-12-31 1961-03-28 Ind Rayon Corp Method for the continuous testing of flowing materials
US2908557A (en) * 1957-01-07 1959-10-13 Rca Corp Method of etching copper
US3000385A (en) * 1957-10-30 1961-09-19 Wean Engineering Co Inc Pickling apparatus
US3074277A (en) * 1958-03-20 1963-01-22 Inland Steel Co Method and apparatus for automatic control of acid concentration in pickling system
US3312189A (en) * 1963-12-24 1967-04-04 Hooker Chemical Corp Automatic solution control system

Also Published As

Publication number Publication date
FR2022757A1 (en) 1970-08-07
DE1807414A1 (en) 1970-06-18
LU59712A1 (en) 1970-01-12
GB1244415A (en) 1971-09-02
US3880685A (en) 1975-04-29
BE740609A (en) 1970-04-01
CH505213A (en) 1971-03-31
AT293812B (en) 1971-10-25
NL167477C (en) 1981-12-16
JPS5013223B1 (en) 1975-05-17
NL167477B (en) 1981-07-16
NL6916811A (en) 1970-05-11
DE1807414B2 (en) 1971-03-18

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