SU617489A1 - Copper etching solution - Google Patents

Copper etching solution

Info

Publication number
SU617489A1
SU617489A1 SU742065004A SU265004A SU617489A1 SU 617489 A1 SU617489 A1 SU 617489A1 SU 742065004 A SU742065004 A SU 742065004A SU 265004 A SU265004 A SU 265004A SU 617489 A1 SU617489 A1 SU 617489A1
Authority
SU
USSR - Soviet Union
Prior art keywords
etching solution
copper etching
copper
weight
sulfuric acid
Prior art date
Application number
SU742065004A
Other languages
Russian (ru)
Inventor
Людмила Дорофеевна Федотюк
Юрий Павлович Маслов
Original Assignee
Предприятие П/Я Х-5737
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Х-5737 filed Critical Предприятие П/Я Х-5737
Priority to SU742065004A priority Critical patent/SU617489A1/en
Application granted granted Critical
Publication of SU617489A1 publication Critical patent/SU617489A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Description

3434

чающийс  тем, что, с целью избира-Серна  кислота (уд. вес. 1,84) 33-41due to the fact that, for the purpose of election-sulfuric acid (sp. weight 1.84) 33-41

тельности травлени  меди при сохранении., .copper etching while maintaining.,.

качества олов нистых свлавов, он допол-Источники информации,qualities of tin slavs, he added-Sources of information,

нительно содержит серную кислоту приприн тые во внимание при экспертизеcontains sulfuric acid taken into account in the examination

следующем соотношении компонентов, г/л:5 1. Патент Японии № 39460, кл. 12А 62,the following ratio of components, g / l: 5 1. Japan patent No. 39460, cl. 12A 62,

Персульфат аммони  100-1201972.Ammonium persulfate 100-1201972.

Перекись водорода2. Авторское свидетельство СССРHydrogen peroxide2. USSR author's certificate

(уд. вес. 1,12) 336-560№ 432244, кл. С 23F 1/00, 1971.(sp. weight 1.12) 336-560№ 432244, cl. From 23F 1/00, 1971.

617489617489

SU742065004A 1974-10-01 1974-10-01 Copper etching solution SU617489A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU742065004A SU617489A1 (en) 1974-10-01 1974-10-01 Copper etching solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU742065004A SU617489A1 (en) 1974-10-01 1974-10-01 Copper etching solution

Publications (1)

Publication Number Publication Date
SU617489A1 true SU617489A1 (en) 1978-07-13

Family

ID=20436210

Family Applications (1)

Application Number Title Priority Date Filing Date
SU742065004A SU617489A1 (en) 1974-10-01 1974-10-01 Copper etching solution

Country Status (1)

Country Link
SU (1) SU617489A1 (en)

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