ES361829A1 - Un procedimiento para fabricar un articulo semiconductor. - Google Patents

Un procedimiento para fabricar un articulo semiconductor.

Info

Publication number
ES361829A1
ES361829A1 ES361829A ES361829A ES361829A1 ES 361829 A1 ES361829 A1 ES 361829A1 ES 361829 A ES361829 A ES 361829A ES 361829 A ES361829 A ES 361829A ES 361829 A1 ES361829 A1 ES 361829A1
Authority
ES
Spain
Prior art keywords
die
fingers
lands
nickel
bronze
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES361829A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Publication of ES361829A1 publication Critical patent/ES361829A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
ES361829A 1967-12-27 1968-12-24 Un procedimiento para fabricar un articulo semiconductor. Expired ES361829A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69383367A 1967-12-27 1967-12-27

Publications (1)

Publication Number Publication Date
ES361829A1 true ES361829A1 (es) 1970-11-16

Family

ID=24786305

Family Applications (1)

Application Number Title Priority Date Filing Date
ES361829A Expired ES361829A1 (es) 1967-12-27 1968-12-24 Un procedimiento para fabricar un articulo semiconductor.

Country Status (5)

Country Link
JP (1) JPS4822382B1 (enrdf_load_stackoverflow)
DE (1) DE1816199A1 (enrdf_load_stackoverflow)
ES (1) ES361829A1 (enrdf_load_stackoverflow)
FR (1) FR1599983A (enrdf_load_stackoverflow)
GB (1) GB1184319A (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4848568U (enrdf_load_stackoverflow) * 1971-10-08 1973-06-26
JPS5165491U (enrdf_load_stackoverflow) * 1974-11-19 1976-05-24
US3984620A (en) * 1975-06-04 1976-10-05 Raytheon Company Integrated circuit chip test and assembly package
DE2658532C2 (de) * 1976-12-23 1984-02-16 Siemens AG, 1000 Berlin und 8000 München Zwischenträger zur Halterung und Kontaktierung eines Halbleiterkörpers und Verfahren zu dessen Herstellung
DE2727319A1 (de) * 1977-06-16 1979-01-04 Nippon Electric Co Halbleiteranordnung mit einer hoeckerfoermigen anschlusselektrode
JPS57174412U (enrdf_load_stackoverflow) * 1981-04-18 1982-11-04
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
JPH0328111U (enrdf_load_stackoverflow) * 1989-07-27 1991-03-20
DE102007014337B4 (de) * 2007-03-26 2017-07-06 Robert Bosch Gmbh Verfahren zum Bestücken eines Kontaktierungselementes mit einem elektrischen Bauelement sowie ein Kontaktierungselement mit einem elektrischen Bauelement

Also Published As

Publication number Publication date
JPS4822382B1 (enrdf_load_stackoverflow) 1973-07-05
GB1184319A (en) 1970-03-11
DE1816199A1 (de) 1969-07-24
FR1599983A (enrdf_load_stackoverflow) 1970-07-20

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