ES358071A1 - Perfeccionamientos en la construccion de elementos semi- conductores. - Google Patents

Perfeccionamientos en la construccion de elementos semi- conductores.

Info

Publication number
ES358071A1
ES358071A1 ES358071A ES358071A ES358071A1 ES 358071 A1 ES358071 A1 ES 358071A1 ES 358071 A ES358071 A ES 358071A ES 358071 A ES358071 A ES 358071A ES 358071 A1 ES358071 A1 ES 358071A1
Authority
ES
Spain
Prior art keywords
semi
solder
section
conductor body
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES358071A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of ES358071A1 publication Critical patent/ES358071A1/es
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Wire Processing (AREA)
  • Die Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
ES358071A 1967-09-12 1968-09-12 Perfeccionamientos en la construccion de elementos semi- conductores. Expired ES358071A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1967B0094403 DE1589543B2 (de) 1967-09-12 1967-09-12 Halbleiterbauelement und verfahren zu seiner weichlotkontaktierung
DE1589543 1967-09-12

Publications (1)

Publication Number Publication Date
ES358071A1 true ES358071A1 (es) 1970-04-16

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ES358071A Expired ES358071A1 (es) 1967-09-12 1968-09-12 Perfeccionamientos en la construccion de elementos semi- conductores.

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US (1) US3584265A (es)
BR (1) BR6802214D0 (es)
DE (1) DE1589543B2 (es)
ES (1) ES358071A1 (es)
FR (1) FR1580674A (es)
GB (1) GB1181198A (es)
NL (1) NL6812965A (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3715633A (en) * 1971-07-15 1973-02-06 J Nier Semiconductor unit with integrated circuit
US3789274A (en) * 1972-07-24 1974-01-29 Sprague Electric Co Solid electrolytic capacitors having hard solder cathode coating
DE2514922C2 (de) * 1975-04-05 1983-01-27 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Gegen thermische Wechselbelastung beständiges Halbleiterbauelement
JPS5756527Y2 (es) * 1977-02-25 1982-12-04
US4151544A (en) * 1977-12-27 1979-04-24 Motorola, Inc. Lead terminal for button diode
JPS5946434B2 (ja) * 1978-01-10 1984-11-12 キヤノン株式会社 半導体レ−ザ装置
DE3401404A1 (de) * 1984-01-17 1985-07-25 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
JPH0241794A (ja) * 1988-07-29 1990-02-09 Hitachi Ltd はんだ合金およびこれを用いた電子回路装置
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
CN102581410B (zh) * 2012-02-29 2016-04-27 扬州虹扬科技发展有限公司 一种二极管芯片的焊接工艺
DE102019103140A1 (de) * 2019-02-08 2020-08-13 Jenoptik Optical Systems Gmbh Verfahren zum Löten eines oder mehrerer Bauteile

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2595497A (en) * 1949-01-22 1952-05-06 Rca Corp Semiconductor device for two-stage amplifiers
US3065525A (en) * 1957-09-13 1962-11-27 Sylvania Electric Prod Method and device for making connections in transistors
US3161811A (en) * 1960-02-15 1964-12-15 Clevite Corp Semiconductor device mount
BE630360A (es) * 1962-03-30
BE672186A (es) * 1964-11-12
US3381081A (en) * 1965-04-16 1968-04-30 Cts Corp Electrical connection and method of making the same
US3413145A (en) * 1965-11-29 1968-11-26 Rca Corp Method of forming a crystalline semiconductor layer on an alumina substrate
US3429980A (en) * 1966-02-17 1969-02-25 Wolf Guttmann Electronic component package and cover
US3390450A (en) * 1966-06-09 1968-07-02 Rca Corp Method of fabricating semiconductor devices

Also Published As

Publication number Publication date
GB1181198A (en) 1970-02-11
NL6812965A (es) 1969-03-14
FR1580674A (es) 1969-09-05
DE1589543A1 (de) 1970-04-30
DE1589543B2 (de) 1972-08-24
BR6802214D0 (pt) 1973-02-27
US3584265A (en) 1971-06-08

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