ES324264A1 - Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico. - Google Patents
Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico.Info
- Publication number
- ES324264A1 ES324264A1 ES0324264A ES324264A ES324264A1 ES 324264 A1 ES324264 A1 ES 324264A1 ES 0324264 A ES0324264 A ES 0324264A ES 324264 A ES324264 A ES 324264A ES 324264 A1 ES324264 A1 ES 324264A1
- Authority
- ES
- Spain
- Prior art keywords
- electrodes
- construction
- carrier body
- manufactured
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010276 construction Methods 0.000 title abstract 8
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 238000002844 melting Methods 0.000 abstract 3
- 230000008018 melting Effects 0.000 abstract 3
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 239000007787 solid Substances 0.000 abstract 2
- 229910001018 Cast iron Inorganic materials 0.000 abstract 1
- 238000005266 casting Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000005259 measurement Methods 0.000 abstract 1
- 230000000737 periodic effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0096025 | 1965-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES324264A1 true ES324264A1 (es) | 1967-02-01 |
Family
ID=7519772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES0324264A Expired ES324264A1 (es) | 1965-03-18 | 1966-03-16 | Procedimiento para la fabricacion en serie de elementos de construccion electricos, especialmente de microelementos de construccion semiconductores en cajas de material plastico. |
Country Status (7)
| Country | Link |
|---|---|
| BE (1) | BE678041A (enrdf_load_stackoverflow) |
| DE (1) | DE1514418A1 (enrdf_load_stackoverflow) |
| ES (1) | ES324264A1 (enrdf_load_stackoverflow) |
| FR (1) | FR1473478A (enrdf_load_stackoverflow) |
| GB (1) | GB1115105A (enrdf_load_stackoverflow) |
| NL (1) | NL6601942A (enrdf_load_stackoverflow) |
| SE (1) | SE318950B (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2549291B2 (fr) * | 1982-10-29 | 1986-05-09 | Radiotechnique Compelec | Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques |
| FR2535526B1 (fr) * | 1982-10-29 | 1986-03-28 | Radiotechnique Compelec | Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques |
| US10542978B2 (en) * | 2011-05-27 | 2020-01-28 | Covidien Lp | Method of internally potting or sealing a handheld medical device |
-
1965
- 1965-03-18 DE DE19651514418 patent/DE1514418A1/de active Pending
-
1966
- 1966-02-15 NL NL6601942A patent/NL6601942A/xx unknown
- 1966-03-16 ES ES0324264A patent/ES324264A1/es not_active Expired
- 1966-03-17 GB GB11634/66A patent/GB1115105A/en not_active Expired
- 1966-03-17 FR FR53893A patent/FR1473478A/fr not_active Expired
- 1966-03-18 SE SE3671/66A patent/SE318950B/xx unknown
- 1966-03-18 BE BE678041D patent/BE678041A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR1473478A (fr) | 1967-03-17 |
| BE678041A (enrdf_load_stackoverflow) | 1966-09-19 |
| DE1514418A1 (de) | 1969-06-26 |
| NL6601942A (enrdf_load_stackoverflow) | 1966-09-19 |
| GB1115105A (en) | 1968-05-29 |
| SE318950B (enrdf_load_stackoverflow) | 1969-12-22 |
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