ES316094A1 - Procedimiento para metalizar materiales basicos de aislamiento - Google Patents

Procedimiento para metalizar materiales basicos de aislamiento

Info

Publication number
ES316094A1
ES316094A1 ES0316094A ES316094A ES316094A1 ES 316094 A1 ES316094 A1 ES 316094A1 ES 0316094 A ES0316094 A ES 0316094A ES 316094 A ES316094 A ES 316094A ES 316094 A1 ES316094 A1 ES 316094A1
Authority
ES
Spain
Prior art keywords
translation
machine
legally binding
google translate
insulation materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0316094A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES316094A1 publication Critical patent/ES316094A1/es
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1605Process or apparatus coating on selected surface areas by masking
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1635Composition of the substrate
    • C23C18/1639Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641Organic substrates, e.g. resin, plastic
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Catalysts (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ES0316094A 1964-08-03 1965-08-03 Procedimiento para metalizar materiales basicos de aislamiento Expired ES316094A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US39298764A 1964-08-03 1964-08-03

Publications (1)

Publication Number Publication Date
ES316094A1 true ES316094A1 (es) 1966-02-01

Family

ID=23552835

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0316094A Expired ES316094A1 (es) 1964-08-03 1965-08-03 Procedimiento para metalizar materiales basicos de aislamiento

Country Status (4)

Country Link
BE (1) BE667829A (enrdf_load_stackoverflow)
DK (1) DK136840B (enrdf_load_stackoverflow)
ES (1) ES316094A1 (enrdf_load_stackoverflow)
FR (1) FR1442063A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
DK136840B (da) 1977-11-28
DK136840C (enrdf_load_stackoverflow) 1978-05-08
BE667829A (enrdf_load_stackoverflow) 1965-12-01
FR1442063A (fr) 1966-06-10

Similar Documents

Publication Publication Date Title
GB924049A (en) Electroless plating of copper
GB1056814A (en) Improvements in making printed circuits
SE8201309L (sv) Vattenhaltig komposition for stromfri pletering av guld
GB1302674A (enrdf_load_stackoverflow)
GB2164063B (en) Selective electroless deposition on insulating substrates
ES8200930A1 (es) Un procedimiento para obtener una capa adherente no electro-litica de metal sobre un sustrato vitreo o ceramico
ES340230A1 (es) Procedimiento para el revestimiento de superficies con co- bre por reaccion quimica.
GB1143899A (en) Improvements relating to the manufacture of printed circuits
ES441164A1 (es) Un metodo de depositar un metal desde un bano de deposicion no electrolitica de metales.
ES375193A1 (es) Procedimiento de cobreado por reduccion quimica.
SE8302798L (sv) Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet
ES316094A1 (es) Procedimiento para metalizar materiales basicos de aislamiento
SE7501792L (enrdf_load_stackoverflow)
EP0909838A4 (en) SOLUTION FOR ELECTRIC COPPER PLATING AND METHOD FOR ELECTRIC COPPER PLATING
GB1348793A (en) Method of electroless deposition of metals with improved sensitizer
ES383869A1 (es) Un procedimiento para el recubrimiento no electrolitico de una resina de acrilonitrilo - butadieno - estireno con un metal.
DE1900442B2 (de) Alkalisches bad zum stromlosen reduktiven verkupfern von katalytisch wirkenden oberflaechen
ES356040A1 (es) Procedimiento para pestanado sobre niquel.
ES405960A2 (es) Perfeccionamientos en la preparacion de soluciones acuosas para cobreado quimico.
GB1139613A (en) Process for the production of multi-layer offset printing plates
ES386925A1 (es) Procedimiento para cobrear quimicamente superficies ferro- sas.
ES315147A1 (es) Metodo de depositar electroliticamente un chapeado de una aleacion de estaƱo y bismuto.
GB1518301A (en) Deposition of copper
JPS54100931A (en) Electroless nickel plating
GB1101848A (en) Process and solution for sensitizing substrates for electroless plating