DK136840B - Elektrisk byggeelement til anvendelse som bærerplade for trykte kredsløb. - Google Patents

Elektrisk byggeelement til anvendelse som bærerplade for trykte kredsløb.

Info

Publication number
DK136840B
DK136840B DK397365AA DK397365A DK136840B DK 136840 B DK136840 B DK 136840B DK 397365A A DK397365A A DK 397365AA DK 397365 A DK397365 A DK 397365A DK 136840 B DK136840 B DK 136840B
Authority
DK
Denmark
Prior art keywords
carrier plate
building element
printed circuits
electrical building
electrical
Prior art date
Application number
DK397365AA
Other languages
Danish (da)
English (en)
Other versions
DK136840C (enrdf_load_stackoverflow
Inventor
Frederick William Schneble Jr
John Francis Mccormack
Rudolf John Zeblisky
John Duff Williamson
Joseph Polichette
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of DK136840B publication Critical patent/DK136840B/da
Application granted granted Critical
Publication of DK136840C publication Critical patent/DK136840C/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Catalysts (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DK397365AA 1964-08-03 1965-08-02 Elektrisk byggeelement til anvendelse som bærerplade for trykte kredsløb. DK136840B (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US39298764A 1964-08-03 1964-08-03

Publications (2)

Publication Number Publication Date
DK136840B true DK136840B (da) 1977-11-28
DK136840C DK136840C (enrdf_load_stackoverflow) 1978-05-08

Family

ID=23552835

Family Applications (1)

Application Number Title Priority Date Filing Date
DK397365AA DK136840B (da) 1964-08-03 1965-08-02 Elektrisk byggeelement til anvendelse som bærerplade for trykte kredsløb.

Country Status (4)

Country Link
BE (1) BE667829A (enrdf_load_stackoverflow)
DK (1) DK136840B (enrdf_load_stackoverflow)
ES (1) ES316094A1 (enrdf_load_stackoverflow)
FR (1) FR1442063A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
DK136840C (enrdf_load_stackoverflow) 1978-05-08
ES316094A1 (es) 1966-02-01
BE667829A (enrdf_load_stackoverflow) 1965-12-01
FR1442063A (fr) 1966-06-10

Similar Documents

Publication Publication Date Title
NL146331B (nl) Elektronische inrichting.
DK117084B (da) Halvlederkomponent.
NL7413439A (nl) Elektronische schakelinrichting.
DK143527C (da) Fremfoeringsmekanisme,navnlig til et hulkortstanseapparat
DK105814C (da) Nummerskive.
DK127027B (da) Kontaktorgan fortrinsvis til impulskredsløb.
DK136840B (da) Elektrisk byggeelement til anvendelse som bærerplade for trykte kredsløb.
DK115662B (da) Loftsplade til et ventilationsloft.
DK118615B (da) Stencil.
DK119932B (da) Elektrisk komponent til trykte kredsløb.
FI47145C (fi) Painatuslaatta.
DE1917357U (de) Druckplatte.
DK125773B (da) 7α-methyl-Δ<5(10)>-østrener til anvendelse som svangerskabsforebyggende midler.
NL148735B (nl) Verdelerschakeling.
DK106950C (da) Apparat til hindring af fejlperforeringer.
ES108201Y (es) Un panel perfeccionado para lavabos.
NL151239B (nl) Schakeling voor een telecommunicatie-stelsel.
DK103189C (da) Fremgangsmåde til fremstilling af en trykkeplade.
ES108199Y (es) Un panel para lavabos.
ES107947Y (es) Un dispositivo de montaje para elementos de instalaciones electricas.
DK114985B (da) Bæreelement til trykte kredsløb.
ES109700Y (es) Un plafon para rotulos.
BR6573062D0 (pt) Composicoes herbicidas a base de tracil-3,4-dicloramilida
DK116003B (da) Stencil til duplikering.
ES106037Y (es) Un terminal perfeccionado para duchas.