ES2562005T3 - Electrolito libre de cianuro para la deposición galvánica de aleaciones de oro - Google Patents

Electrolito libre de cianuro para la deposición galvánica de aleaciones de oro Download PDF

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Publication number
ES2562005T3
ES2562005T3 ES10724310.7T ES10724310T ES2562005T3 ES 2562005 T3 ES2562005 T3 ES 2562005T3 ES 10724310 T ES10724310 T ES 10724310T ES 2562005 T3 ES2562005 T3 ES 2562005T3
Authority
ES
Spain
Prior art keywords
cyanide
mercapto
galvanic deposition
gold alloys
free electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES10724310.7T
Other languages
English (en)
Spanish (es)
Inventor
Hubert Schmidbaur
Jean-Jacques Duprat
Davide Rossi
Ester Falletta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coventya SpA
Original Assignee
Coventya SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Coventya SpA filed Critical Coventya SpA
Application granted granted Critical
Publication of ES2562005T3 publication Critical patent/ES2562005T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
ES10724310.7T 2009-06-09 2010-06-09 Electrolito libre de cianuro para la deposición galvánica de aleaciones de oro Active ES2562005T3 (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009024396 2009-06-09
DE102009024396A DE102009024396A1 (de) 2009-06-09 2009-06-09 Cyanid-freier Elektrolyt zur galvanischen Abscheidung von Gold oder dessen Legierungen
US18578909P 2009-06-10 2009-06-10
US185789P 2009-06-10
PCT/EP2010/003465 WO2010142437A1 (fr) 2009-06-09 2010-06-09 Électrolyte exempt de cyanure pour dépôt galvanique d'or ou d'alliages de celui-ci

Publications (1)

Publication Number Publication Date
ES2562005T3 true ES2562005T3 (es) 2016-03-02

Family

ID=43069719

Family Applications (1)

Application Number Title Priority Date Filing Date
ES10724310.7T Active ES2562005T3 (es) 2009-06-09 2010-06-09 Electrolito libre de cianuro para la deposición galvánica de aleaciones de oro

Country Status (4)

Country Link
EP (1) EP2313541B1 (fr)
DE (1) DE102009024396A1 (fr)
ES (1) ES2562005T3 (fr)
WO (1) WO2010142437A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2978765A1 (fr) * 2011-08-04 2013-02-08 Commissariat Energie Atomique Nouveaux liquides ioniques utilisables pour entrer dans la composition d'electrolyte pour dispositifs a stockage d'energie
CN103122471B (zh) * 2013-03-01 2015-10-28 沈阳师范大学 一种无氰镀铟的电镀液
CN103741180B (zh) * 2014-01-10 2015-11-25 哈尔滨工业大学 无氰光亮电镀金添加剂及其应用
CN105499560B (zh) * 2015-11-25 2017-11-28 国家纳米科学中心 一种促进银在金纳米球表面再生长的方法及其应用
CN106932511A (zh) * 2017-02-14 2017-07-07 中国环境科学研究院 一种环境水体中不同价态锑的检测方法
ES2773771T3 (es) 2017-05-23 2020-07-14 Saxonia Edelmetalle Gmbh Preparación de sal de metal noble, un método para la preparación de la misma, y uso para electrochapado
CN108950617B (zh) * 2018-07-11 2020-11-24 广州传福化学技术有限公司 一种含碲的锌镍合金电镀液及其电镀工艺
EP3604626A1 (fr) * 2018-08-03 2020-02-05 COVENTYA S.p.A. Bain électrolytique pour déposer un alliage noire, procédé pour le dépôt électrochimique d'un alliage noir sur un substrat, alliage noir et article recouvert d'un tel alliage noir
DE102019202899B3 (de) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber
CN109881223B (zh) * 2019-03-11 2020-02-14 深圳市联合蓝海科技开发有限公司 无氰镀金液及其制备方法和应用
CN111411376A (zh) * 2020-03-09 2020-07-14 中国工程物理研究院激光聚变研究中心 无氰亚硫酸盐体系电镀金液及电镀方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3238112A (en) * 1962-07-03 1966-03-01 Du Pont Electroplating of metals using mercapto-metal complex salts
US4435253A (en) 1983-01-28 1984-03-06 Omi International Corporation Gold sulphite electroplating solutions and methods
US5302278A (en) 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
DE19629658C2 (de) * 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
DE19924895B4 (de) * 1999-06-01 2004-03-25 W. C. Heraeus Gmbh & Co. Kg Verfahren zur Herstellung einer cyanidfreien, für galvanische Gold-Bäder geeigneten Goldverbindungslösung
US6911068B2 (en) * 2001-10-02 2005-06-28 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
JP3985220B2 (ja) * 2001-12-06 2007-10-03 石原薬品株式会社 非シアン系の金−スズ合金メッキ浴
JP2004176171A (ja) * 2002-09-30 2004-06-24 Shinko Electric Ind Co Ltd 非シアン電解金めっき液

Also Published As

Publication number Publication date
DE102009024396A1 (de) 2010-12-16
EP2313541A1 (fr) 2011-04-27
EP2313541B1 (fr) 2016-01-13
WO2010142437A1 (fr) 2010-12-16

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