ES2543024T3 - Aparato de impresión, sistema de impresión, procedimiento - Google Patents

Aparato de impresión, sistema de impresión, procedimiento Download PDF

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Publication number
ES2543024T3
ES2543024T3 ES13185382.2T ES13185382T ES2543024T3 ES 2543024 T3 ES2543024 T3 ES 2543024T3 ES 13185382 T ES13185382 T ES 13185382T ES 2543024 T3 ES2543024 T3 ES 2543024T3
Authority
ES
Spain
Prior art keywords
printing
support plate
substrates
adjustment device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES13185382.2T
Other languages
English (en)
Inventor
Ralf Brosi
Franz Plachy
Jacob Szekeresch
Torsten Vegelahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ekra Automatisierungssysteme GmbH
Original Assignee
Ekra Automatisierungssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ekra Automatisierungssysteme GmbH filed Critical Ekra Automatisierungssysteme GmbH
Application granted granted Critical
Publication of ES2543024T3 publication Critical patent/ES2543024T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0804—Machines for printing sheets
    • B41F15/0813—Machines for printing sheets with flat screens
    • B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/16—Printing tables
    • B41F15/18—Supports for workpieces
    • B41F15/26—Supports for workpieces for articles with flat surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Aparato de impresión (1) para la impresión simultánea de varios substratos (2), comprendiendo una placa de soporte (20) en particular intercambiable, sobre la cual los substratos (2) están/pueden ser posicionados uno al lado de otro, con un dispositivo de impresión (3) que comprende al menos una plantilla de impresión (4), y con un dispositivo de ajuste (27) para alinear los substratos (2) con respecto a la como mínimo una plantilla de impresión (4) previamente a un proceso de impresión, en el cual dicho dispositivo de ajuste (27) comprende un medio de detección (14) para detectar la posición de los substratos (2) con respecto a la plantilla de impresión (4), así como un dispositivo de agarre (15), que está concebido para agarrar respectivamente un substrato (2), de separarlo de la placa de soporte (20), y de volver a ponerlo sobre la placa de soporte (20) después de realizar la alineación, caracterizado por el hecho de que el dispositivo de ajuste (27) comprende un dispositivo de alineación (11) que está asociado a la placa de soporte (20) y desplaza y/o gira la placa de soporte (20) en un plano, con el fin de alinear el substrato (2) que ha sido separado respectivamente de la placa de soporte (20) por el dispositivo de agarre (15).

Description

imagen1
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imagen3
imagen4
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imagen6
E13185382
17-07-2015
configuradas para agarrar el respectivo substrato, en particular lateralmente o desde el lado, para separarlo de la placa de soporte 20. A este efecto, por ejemplo, pueden estar provistos unos llamados dedos de sujeción en cada una de las pinzas 29, que pueden ser introducidos por debajo del substrato o en las correspondientes escotaduras del respectivo substrato 2.
Evidentemente, las características mencionadas en los ejemplos de realización pueden ser combinadas las unas con las otras de manera discrecional.
8

Claims (1)

  1. imagen1
    imagen2
ES13185382.2T 2012-09-25 2013-09-20 Aparato de impresión, sistema de impresión, procedimiento Active ES2543024T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012019573.7A DE102012019573A1 (de) 2012-09-25 2012-09-25 Druckvorrichtung, Drucksystem, Verfahren
DE102012019573 2012-09-25

Publications (1)

Publication Number Publication Date
ES2543024T3 true ES2543024T3 (es) 2015-08-14

Family

ID=49230589

Family Applications (1)

Application Number Title Priority Date Filing Date
ES13185382.2T Active ES2543024T3 (es) 2012-09-25 2013-09-20 Aparato de impresión, sistema de impresión, procedimiento

Country Status (7)

Country Link
EP (1) EP2711183B1 (es)
DE (1) DE102012019573A1 (es)
DK (1) DK2711183T3 (es)
ES (1) ES2543024T3 (es)
PL (1) PL2711183T3 (es)
PT (1) PT2711183E (es)
SI (1) SI2711183T1 (es)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014215022B3 (de) 2014-07-30 2015-09-03 Ekra Automatisierungssysteme Gmbh Drucksystem und Verfahren zum Bedrucken von Substraten
CN104354453B (zh) * 2014-10-21 2017-02-08 苏州迈为科技股份有限公司 一种太阳能电池片的高效印刷方法及其装置
ITUB20161142A1 (it) 2016-02-29 2017-08-29 Vismunda Srl Metodo e impianto produttivo automatico per la stampa su celle fotovoltaiche.
WO2018193773A1 (ja) * 2017-04-19 2018-10-25 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP6961444B2 (ja) * 2017-10-02 2021-11-05 ヤマハ発動機株式会社 印刷装置および印刷方法
JP7029587B2 (ja) * 2017-10-19 2022-03-04 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置およびスクリーン印刷方法
CN109729652B (zh) * 2017-10-31 2021-06-01 华为机器有限公司 吸附回拉装置及电路板加工设备
DE102018205157A1 (de) 2018-04-05 2019-10-10 Ekra Automatisierungssysteme Gmbh Druckvorrichtung
DE102018205944A1 (de) 2018-04-18 2019-10-24 Ekra Automatisierungssysteme Gmbh Drucksystem zum Bedrucken von Substraten, Verfahren zum Betreiben des Drucksystems
JP7203307B2 (ja) * 2018-07-04 2023-01-13 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP6803527B2 (ja) * 2018-10-11 2020-12-23 パナソニックＩｐマネジメント株式会社 スクリーン印刷方法、スクリーン印刷装置及び部品実装ライン
WO2020147358A1 (zh) * 2019-01-14 2020-07-23 东莞市凯格精密机械有限公司 一种多基板对位印刷方法及对位印刷机
EP3725525B1 (de) * 2019-04-18 2024-02-28 Exentis Knowledge GmbH Vorrichtung und verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken
PT3725522T (pt) * 2019-04-18 2024-02-19 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças de serigrafia tridimensionais
PT3725523T (pt) * 2019-04-18 2024-05-02 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
EP3725526B1 (de) * 2019-04-18 2024-07-31 Exentis Knowledge GmbH Verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken
PT3725524T (pt) * 2019-04-18 2024-09-30 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças serigrafadas tridimensionais
JP7326052B2 (ja) * 2019-07-11 2023-08-15 株式会社Fuji マスク印刷機、ずれ取得方法
WO2022174904A1 (en) * 2021-02-18 2022-08-25 Applied Materials Italia S.R.L. Transportation system for transporting two or more substrates, printing apparatus for printing on two or more substrates, and methods for performing same
CN113147163A (zh) * 2021-04-30 2021-07-23 广州诚鼎机器人有限公司 一种承印物和椭圆印花机
CN114828416B (zh) * 2022-04-18 2024-06-28 佛山市南海野枫电子有限公司 一种pcb线路板固定加工设备
CN114867209B (zh) * 2022-05-17 2024-02-23 广德瓯科达电子有限公司 一种多层电路板的表面处理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1310557B1 (it) * 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronicimultistrato
JP2004351624A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Ind Co Ltd クリーム半田のスクリーン印刷装置およびスクリーン印刷方法
DE102006051558A1 (de) * 2006-11-02 2008-05-08 Manz Automation Ag Siebdruckanlage
JP4356769B2 (ja) * 2007-05-22 2009-11-04 パナソニック株式会社 スクリーン印刷装置およびスクリーン印刷方法
DE102007053059B3 (de) * 2007-10-18 2009-03-05 I-Mation Gmbh Verfahren zum Ausrichten von einem zu bedruckenden Trägermaterial
JP5053913B2 (ja) * 2008-04-11 2012-10-24 ミナミ株式会社 スクリーン印刷機における基板の位置及び角度補正装置
JP2011031588A (ja) * 2009-08-06 2011-02-17 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
JP5310864B2 (ja) * 2009-11-06 2013-10-09 パナソニック株式会社 スクリーン印刷用のマスクとそれを用いたスクリーン印刷装置およびスクリーン印刷方法

Also Published As

Publication number Publication date
DK2711183T3 (en) 2015-07-27
SI2711183T1 (sl) 2015-08-31
DE102012019573A1 (de) 2014-03-27
PT2711183E (pt) 2015-09-14
EP2711183A1 (de) 2014-03-26
PL2711183T3 (pl) 2015-10-30
EP2711183B1 (de) 2015-04-22

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