SI2711183T1 - Tiskarska naprava, tiskarski sistem, postopek - Google Patents

Tiskarska naprava, tiskarski sistem, postopek

Info

Publication number
SI2711183T1
SI2711183T1 SI201330051T SI201330051T SI2711183T1 SI 2711183 T1 SI2711183 T1 SI 2711183T1 SI 201330051 T SI201330051 T SI 201330051T SI 201330051 T SI201330051 T SI 201330051T SI 2711183 T1 SI2711183 T1 SI 2711183T1
Authority
SI
Slovenia
Prior art keywords
printing
printing apparatus
printing system
Prior art date
Application number
SI201330051T
Other languages
English (en)
Inventor
Ralf Brosi
Franz Plachy
Jacob Szekeresch
Torsten Vegelahn
Original Assignee
Ekra Automatisierungssysteme Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ekra Automatisierungssysteme Gmbh filed Critical Ekra Automatisierungssysteme Gmbh
Publication of SI2711183T1 publication Critical patent/SI2711183T1/sl

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/08Machines
    • B41F15/0804Machines for printing sheets
    • B41F15/0813Machines for printing sheets with flat screens
    • B41F15/0818Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41FPRINTING MACHINES OR PRESSES
    • B41F15/00Screen printers
    • B41F15/14Details
    • B41F15/16Printing tables
    • B41F15/18Supports for workpieces
    • B41F15/26Supports for workpieces for articles with flat surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0165Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/082Suction, e.g. for holding solder balls or components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1509Horizontally held PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/166Alignment or registration; Control of registration
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/167Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
SI201330051T 2012-09-25 2013-09-20 Tiskarska naprava, tiskarski sistem, postopek SI2711183T1 (sl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012019573.7A DE102012019573A1 (de) 2012-09-25 2012-09-25 Druckvorrichtung, Drucksystem, Verfahren
EP20130185382 EP2711183B1 (de) 2012-09-25 2013-09-20 Druckvorrichtung, Drucksystem, Verfahren

Publications (1)

Publication Number Publication Date
SI2711183T1 true SI2711183T1 (sl) 2015-08-31

Family

ID=49230589

Family Applications (1)

Application Number Title Priority Date Filing Date
SI201330051T SI2711183T1 (sl) 2012-09-25 2013-09-20 Tiskarska naprava, tiskarski sistem, postopek

Country Status (7)

Country Link
EP (1) EP2711183B1 (sl)
DE (1) DE102012019573A1 (sl)
DK (1) DK2711183T3 (sl)
ES (1) ES2543024T3 (sl)
PL (1) PL2711183T3 (sl)
PT (1) PT2711183E (sl)
SI (1) SI2711183T1 (sl)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014215022B3 (de) 2014-07-30 2015-09-03 Ekra Automatisierungssysteme Gmbh Drucksystem und Verfahren zum Bedrucken von Substraten
CN104354453B (zh) * 2014-10-21 2017-02-08 苏州迈为科技股份有限公司 一种太阳能电池片的高效印刷方法及其装置
ITUB20161142A1 (it) 2016-02-29 2017-08-29 Vismunda Srl Metodo e impianto produttivo automatico per la stampa su celle fotovoltaiche.
WO2018193773A1 (ja) * 2017-04-19 2018-10-25 パナソニックIpマネジメント株式会社 スクリーン印刷装置およびスクリーン印刷方法
JP6961444B2 (ja) * 2017-10-02 2021-11-05 ヤマハ発動機株式会社 印刷装置および印刷方法
JP7029587B2 (ja) * 2017-10-19 2022-03-04 パナソニックIpマネジメント株式会社 スクリーン印刷装置およびスクリーン印刷方法
CN109729652B (zh) * 2017-10-31 2021-06-01 华为机器有限公司 吸附回拉装置及电路板加工设备
DE102018205157A1 (de) 2018-04-05 2019-10-10 Ekra Automatisierungssysteme Gmbh Druckvorrichtung
DE102018205944A1 (de) * 2018-04-18 2019-10-24 Ekra Automatisierungssysteme Gmbh Drucksystem zum Bedrucken von Substraten, Verfahren zum Betreiben des Drucksystems
CN112334313B (zh) * 2018-07-04 2023-06-27 松下知识产权经营株式会社 丝网印刷装置以及丝网印刷方法
JP6803527B2 (ja) * 2018-10-11 2020-12-23 パナソニックIpマネジメント株式会社 スクリーン印刷方法、スクリーン印刷装置及び部品実装ライン
WO2020147358A1 (zh) * 2019-01-14 2020-07-23 东莞市凯格精密机械有限公司 一种多基板对位印刷方法及对位印刷机
EP3725524A1 (de) * 2019-04-18 2020-10-21 Exentis Knowledge GmbH Vorrichtung und verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken
EP3725525B1 (de) * 2019-04-18 2024-02-28 Exentis Knowledge GmbH Vorrichtung und verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken
EP3725526A1 (de) * 2019-04-18 2020-10-21 Exentis Knowledge GmbH Verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken
EP3725523B1 (de) * 2019-04-18 2024-02-28 Exentis Knowledge GmbH Vorrichtung und verfahren zur herstellung von dreidimensionalen siebdruckwerkstücken
PT3725522T (pt) * 2019-04-18 2024-02-19 Exentis Knowledge Gmbh Dispositivo e método para a produção de peças de serigrafia tridimensionais
JP7326052B2 (ja) * 2019-07-11 2023-08-15 株式会社Fuji マスク印刷機、ずれ取得方法
EP4295416A1 (en) * 2021-02-18 2023-12-27 Applied Materials Italia S.R.L. Transportation system for transporting two or more substrates, printing apparatus for printing on two or more substrates, and methods for performing same
CN113147163A (zh) * 2021-04-30 2021-07-23 广州诚鼎机器人有限公司 一种承印物和椭圆印花机
CN114828416A (zh) * 2022-04-18 2022-07-29 长鸿电子科技(惠州)有限公司 一种pcb线路板固定加工设备
CN114867209B (zh) * 2022-05-17 2024-02-23 广德瓯科达电子有限公司 一种多层电路板的表面处理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1310557B1 (it) * 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronicimultistrato
JP2004351624A (ja) * 2003-05-27 2004-12-16 Matsushita Electric Ind Co Ltd クリーム半田のスクリーン印刷装置およびスクリーン印刷方法
DE102006051558A1 (de) * 2006-11-02 2008-05-08 Manz Automation Ag Siebdruckanlage
JP4356769B2 (ja) * 2007-05-22 2009-11-04 パナソニック株式会社 スクリーン印刷装置およびスクリーン印刷方法
DE102007053059B3 (de) * 2007-10-18 2009-03-05 I-Mation Gmbh Verfahren zum Ausrichten von einem zu bedruckenden Trägermaterial
JP5053913B2 (ja) * 2008-04-11 2012-10-24 ミナミ株式会社 スクリーン印刷機における基板の位置及び角度補正装置
JP2011031588A (ja) * 2009-08-06 2011-02-17 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
US20120216690A1 (en) * 2009-11-06 2012-08-30 Panasonic Corporation Mask for screen printing, screen printing device and screen printing method employing same

Also Published As

Publication number Publication date
PL2711183T3 (pl) 2015-10-30
DE102012019573A1 (de) 2014-03-27
EP2711183B1 (de) 2015-04-22
ES2543024T3 (es) 2015-08-14
PT2711183E (pt) 2015-09-14
DK2711183T3 (en) 2015-07-27
EP2711183A1 (de) 2014-03-26

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