ES2323858T5 - Procedimiento de conexión de un chip a una antena de un dispositivo de identificación por radiofrecuencia del tipo de tarjeta con chip sin contacto - Google Patents
Procedimiento de conexión de un chip a una antena de un dispositivo de identificación por radiofrecuencia del tipo de tarjeta con chip sin contacto Download PDFInfo
- Publication number
- ES2323858T5 ES2323858T5 ES02762487T ES02762487T ES2323858T5 ES 2323858 T5 ES2323858 T5 ES 2323858T5 ES 02762487 T ES02762487 T ES 02762487T ES 02762487 T ES02762487 T ES 02762487T ES 2323858 T5 ES2323858 T5 ES 2323858T5
- Authority
- ES
- Spain
- Prior art keywords
- chip
- antenna
- connection terminals
- support
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
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- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
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- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
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- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
- Support Of Aerials (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
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- Wire Bonding (AREA)
Description
DESCRIPCIÓN
Procedimiento de conexión de un chip a una antena de un dispositivo de identificación por radiofrecuencia del tipo de tarjeta con chip sin contacto.
Campo técnico
La presente invención se refiere al campo que tiene relación con la identificación por radiofrecuencia (RFID) en particular utilizando unas tarjetas con chip y más particularmente a un procedimiento de conexión de un chip sobre la antena de un dispositivo RFID del tipo tarjeta sin contacto.
Estado de la técnica
Los dispositivos RFID que incluyen las tarjetas con chip sin contacto, los tiques sin contacto, las etiquetas inteligentes, han resultado actualmente ineludibles. Además su utilización como tarjetas de crédito, han resultado unas herramientas indispensables en numerosos campos. Este desarrollo se explica en particular por el hecho de que, además de la utilización clásica de la tarjeta por contacto con su lector asociado, tal como la tarjeta bancaria o la tarjeta de teléfono, las tarjetas pueden ser utilizadas desde ahora sin ningún contacto físico con el lector.
En efecto, el intercambio de informaciones entre una tarjeta sin contacto o híbrida contacto-sin contacto y el dispositivo de lectura asociado se efectúa por acoplamiento electromagnético a distancia entre una antena alojada en la tarjeta sin contacto y una segunda antena situada en el lector. Para elaborar, almacenar y tratar las informaciones, la tarjeta está provista de un chip que está conectado a la antena. La antena se encuentra generalmente sobre un soporte dieléctrico de material plástico. Esta facilidad de utilización ha permitido en gran manera el desarrollo de otras aplicaciones. Así, se ve aparecer el portamonedas electrónico. En el sector de los transportes, la tarjeta con chip ha sido desarrollada como medio de pago de autopistas y como tarjeta de abono. Para los viajeros ocasionales, también son posibles unos tiques del tipo RFID. En el campo del ocio, la misma es utilizada por los aficionados como tarjeta de abono a los estadios. En el campo de la seguridad, numerosas sociedades han colocado un sistema de identificación de su personal por tarjeta con chip ISO y sin contacto. Un límite importante al desarrollo de las tarjetas con chip y en particular de las tarjetas con chip sin contacto y de los tiques sin contacto es su precio de coste. En efecto, es crucial para que este soporte sea difundido de forma importante que el precio de coste sea el más bajo posible. La reducción de este precio pasa por una parte por la utilización de materiales que constituyen el cuerpo de tarjeta que sean menos costosos, y por otra parte por la reducción de los costes de producción, en particular simplificando los procedimientos de fabricación.
Los procedimientos de conexión de los chips sobre las antenas de un dispositivo RFID que incluyen un chip y una antena están basados en la técnica de ensamblaje “Flip Chip”. Esta técnica se caracteriza por una conexión directa de la cara activa del chip sobre la antena y su sustrato, contrariamente a la antigua técnica de cableado llamada “Wire Bonding” que consistía en pegar el chip sobre el sustrato por su cara pasiva y cablearlo a la antena.
La técnica de ensamblaje “Flip Chip” comprende cuatro etapas principales:
- realizar bornes de conexión del chip por polimerización o metalización,
- conectar el chip con antena de la tarjeta por contacto de los bornes de conexión del chip con los bornes de conexión de la antena,
- llenar el espacio vacío entre el chip y el soporte de la antena, con un material dieléctrico adhesivo.
Existen unas variantes según el tipo de los bornes de conexión utilizados.
Para los bornes de conexión a base de aleación (estaño-plomo), el chip es colocado sobre los bornes de la antena y el ensamblaje es realizado por calentamiento para obtener unas conexiones soldadas.
En lo que se refiere a los bornes de conexión de oro, depositados según la técnica modificada del cableado ”Wire Bonding”, el chip es conectado a la antena por conexión termoiónica oro/oro.
Para los bornes de conexión a base de polímero adhesivo conductor, el chip es colocado sobre los bornes de conexión de la antena sobre los cuales ha sido previamente aplicado un adhesivo conductor frente a los bornes de conexión del chip. El conjunto es calentado a continuación con el fin de polimerizar el adhesivo conductor.
Cualquiera que sea la variante utilizada, la técnica “Flip Chip” necesita una etapa suplementaria indispensable que consiste en depositar una cola conductora sobre los bornes de la antena antes de posicionar el chip. Se trata generalmente de una cola conductora epoxi/plata. Esta cola facilita la conexión eléctrica entre el chip y la antena. Sin embargo, cuando se utiliza dicha cola, es necesario proceder a la reticulación de la mezcla polimerizable. Esta reticulación se realiza por calentamiento o por radiación U.V.
La utilización de una cola de este tipo adolece de varios inconvenientes. El primero de estos inconvenientes es de orden energético. En efecto, la necesidad de polimerizar la cola provoca un gasto energético debido al calentamiento o a la radiación U.V. y necesita además unas instalaciones adecuadas.
Otro inconveniente es que algunos materiales utilizados para la fabricación de los soportes de antena sufren unas deformaciones cuando son calentados. Estas deformaciones pueden ser el origen de cortes sobre la antena.
Otro inconveniente aún es que cuando la cola conductora es depositada sobre los bornes de la antena y que el chip es posicionado, la cola tiene tendencia a formar unas rebabas que pueden generar unos cortocircuitos. Estos dos últimos inconvenientes son el origen de una pérdida importante de rendimiento, que aumenta considerablemente el precio de coste de las tarjetas con chip sin contacto, de los tiques sin contacto y de los dispositivos RFID en general.
Es por lo que otra técnica descrita en la solicitud de patente francesa 2.778.308 consiste en hundir los bornes de conexión del chip en la tinta conductora que no está seca aún de los bornes de conexión de la antena. Desgraciadamente, esta técnica impide aplicar en continuo el procedimiento de fabricación de la tarjeta en la medida en que la utilización de una tinta húmeda obliga a realizar la operación de aplicación de la tinta serigrafiada en línea y casi simultáneamente con la conexión del chip sobre la tarjeta.
Exposición de la invención
El objetivo de la invención es evitar estos inconvenientes proporcionando un procedimiento simplificado de conexión de los chips sobre las antenas de los dispositivos RFID, en particular de las tarjetas sin contacto, que no necesita aportación de energía y que permite obtener buenos rendimientos de fabricación.
La invención se refiere por tanto a un procedimiento según la reivindicación 1.
Según un modo preferido de realización, el procedimiento comprende una etapa suplementaria que consiste en depositar un material dieléctrico adhesivo sobre el soporte de antena entre los bornes de conexión de dicha antena, antes de la etapa de posicionado del chip, de manera que se mantenga el chip en posición fija con respecto al soporte.
Breve descripción de las figuras
Los objetivos, objetos y características se pondrán más claramente de manifiesto a partir de la lectura de la descripción siguiente haciendo referencia a los planos adjuntos, en los que:
La figura 1 representa una vista frontal del chip después de la etapa de depósito de los bornes de conexión del chip.
La figura 2 representa una vista frontal del soporte de antena y de la antena después de la etapa de depósito del material dieléctrico.
La figura 3 representa una vista frontal del soporte de antena después de la etapa de posicionado del chip.
Descripción detallada de la invención
La primera etapa del procedimiento según la invención consiste en realizar los bornes de conexión del chip. Así, en la figura 1 está representado un chip 10. Este chip puede ser un chip de tarjeta ISO. Sin embargo, puede tratarse de un chip de menor dimensión para unos objetos portátiles sin contacto del tipo tique. Los bornes de conexión 12 son de material no deformable y están realizados sobre la cara activa 14 del chip. Son preferentemente de forma cónica. Estos bornes de conexión pueden ser realizados por metalización. Se trata, en este caso, de bornes de conexión a base de aleación, que puede ser una aleación estaño/plomo. Estos bornes de conexión pueden ser también de oro. Según otro modo de realización, los bornes de conexión pueden ser obtenidos por polimerización. Se trata entonces de bornes de conexión de polímero conductor.
El soporte de antena está representado en la figura 2. Este soporte 16 es de material deformable no elástico. Se trata de papel que es un material fibroso apto para la deformación y que conserva esta deformación. Según un modo de realización preferido, el soporte de antena es de papel. La antena es obtenida por impresión de una tinta conductora. El procedimiento de impresión es preferentemente la serigrafía. Dos bornes de conexión 18 están también realizados a fin de conectar el chip y la antena. La tinta conductora utilizada es preferentemente una tinta polímera cargada de elementos conductores tales como la plata, el cobre o el carbono. Un material dieléctrico adhesivo 20 es depositado sobre el soporte de antena 16, entre los dos bornes de conexión 18 de la antena. Este material adhesivo es depositado antes de colocar el chip sobre el soporte, contrariamente al procedimiento “Flip Chip” clásico en el cual el adhesivo es depositado una vez conectado el chip. Esta etapa es por tanto mucho más fácil de realizar y los rendimientos obtenidos son mucho mejores. El adhesivo es una resina epoxi o una cola cianoacrilato.
Una vez que la tinta que constituye los bornes de conexión 18 está seca y que el material adhesivo ha sido depositado, el chip es posicionado sobre el soporte de antena de manera que los bornes de conexión del chip estén frente a los bornes de conexión de la antena. Se ejerce una presión sobre el chip 10 de manera que los bornes de conexión 12 del chip creen una deformación del soporte 16 y de los bornes de conexión 18 de la antena como se ha ilustrado en la figura 3. Esta deformación está en forma de una cavidad cuya superficie interior encaja exactamente con la superficie exterior de los bornes 12. Hay así un contacto íntimo entre los bornes 12 de conexión del chip y la tinta conductora de los bornes 18 sobre una superficie de contacto máxima. Siendo el material que forma el soporte 16 deformable y no elástico así como la tinta conductora de los bornes 18, estos dos materiales no tienen tendencia a recuperar su forma de origen incluso cuando se deja ejercer presión. Esto es particularmente verdadero ya que el material del soporte 16 es papel.
Bajo el efecto de la presión ejercida, el material dieléctrico adhesivo 20 se extiende y pasa a recubrir toda la superficie del chip entre los bornes de conexión. El mismo permite entonces reforzar el ensamblaje mecánico entre el chip 10 y el soporte de antena 16, y por ello, el contacto eléctrico entre el chip y la antena.
Este procedimiento permite por tanto liberarse del empleo de una cola conductora para mejorar el contacto eléctrico entre el chip y la antena. Permite liberarse también de la utilización de energía y en particular de calor para polimerizar esta cola.
Gracias al procedimiento según la invención, es posible utilizar unos soportes de antena de papel que son habitualmente desechados a causa de su falta de comportamiento ante el calor.
Además, la conexión entre el chip y la antena está reforzada. El ensamblaje íntimo entre el chip y el soporte de antena y la superficie de contacto importante limitan el riesgo de ruptura de la conexión chip-antena. La calidad de la tarjeta se encuentra por ello mejorada.
Claims (7)
1. Procedimiento de conexión de un chip (10) sobre una antena de un dispositivo de identificación por radiofrecuencia del tipo tarjeta con chip sin contacto que comprende un chip y una antena dispuestos sobre un soporte (16) de papel, comprendiendo dicha antena unos bornes de conexión (18) también deformares y no elásticos y siendo obtenida por impresión de una tinta conductora sobre dicho soporte, comprendiendo dicho procedimiento las etapas siguientes:
- posicionar el chip (10) provisto de bornes de conexión (12) de material no deformable sobre dicho soporte de manera que dichos bornes de conexión del chip estén frente a los bornes de conexión (18) de la antena, y
- ejercer una presión sobre dicho chip de manera que dichos bornes de conexión deformen dicho soporte y dichos bornes de conexión de la antena bajo el efecto de la presión, conservando dicho soporte y dichos bornes de conexión de la antena su deformación después de que se deje ejercer la presión, permitiendo así obtener una superficie de contacto máxima entre los bornes de conexión del chip y los bornes de la antena.
2. Procedimiento según la reivindicación 1, en el que un material dieléctrico adhesivo (20) es depositado sobre dicho soporte (16) entre los bornes de conexión (18) de dicha antena, antes de la etapa de posicionado del chip, de manera que dicho chip (10) se mantenga en posición fija con respecto al soporte.
3. Procedimiento según la reivindicación 1 o 2, en el que los bornes de conexión del chip (12) se obtienen por metalización.
4. Procedimiento según una de las reivindicaciones 1 a 3, en el que los bornes de conexión del chip (12) se obtienen por polimerización.
5. Procedimiento según una de las reivindicaciones anteriores, en el que los bornes de conexión del chip (12) son de forma cónica.
6. Procedimiento según una de las reivindicaciones anteriores, en el que dicha antena se obtiene por serigrafía de dicha tinta conductora.
7. Procedimiento según una de las reivindicaciones anteriores, en el que el material dieléctrico adhesivo (20), depositado sobre el soporte de antena (16) es una cola cianoacrilato.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0107779 | 2001-06-14 | ||
FR0107779A FR2826153B1 (fr) | 2001-06-14 | 2001-06-14 | Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact |
PCT/FR2002/002005 WO2002103627A1 (fr) | 2001-06-14 | 2002-06-12 | Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact |
Publications (2)
Publication Number | Publication Date |
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ES2323858T3 ES2323858T3 (es) | 2009-07-27 |
ES2323858T5 true ES2323858T5 (es) | 2019-03-05 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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ES02762487T Expired - Lifetime ES2323858T5 (es) | 2001-06-14 | 2002-06-12 | Procedimiento de conexión de un chip a una antena de un dispositivo de identificación por radiofrecuencia del tipo de tarjeta con chip sin contacto |
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US (1) | US6770509B2 (es) |
EP (1) | EP1309940B2 (es) |
JP (1) | JP4274320B2 (es) |
KR (1) | KR100961671B1 (es) |
CN (1) | CN1295646C (es) |
AT (1) | ATE424591T2 (es) |
AU (1) | AU2002327869B2 (es) |
BR (1) | BR0205601A (es) |
CA (1) | CA2418737C (es) |
CY (1) | CY1109116T1 (es) |
DE (1) | DE60231367D1 (es) |
DK (1) | DK1309940T3 (es) |
ES (1) | ES2323858T5 (es) |
FR (1) | FR2826153B1 (es) |
HK (1) | HK1061296A1 (es) |
IL (2) | IL154105A0 (es) |
MX (1) | MXPA03001309A (es) |
PT (1) | PT1309940E (es) |
RU (1) | RU2298254C2 (es) |
TW (1) | TWI230360B (es) |
WO (1) | WO2002103627A1 (es) |
ZA (1) | ZA200300984B (es) |
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Publication number | Priority date | Publication date | Assignee | Title |
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ES2149000T3 (es) | 1996-08-02 | 2000-10-16 | Schlumberger Systems & Service | Tarjeta de circuito integrado con conexion mixta. |
FR2753819B1 (fr) * | 1996-09-20 | 1998-11-27 | Carte a circuit integre a connexion mixte | |
US5861678A (en) * | 1997-12-23 | 1999-01-19 | Micron Technology, Inc. | Method and system for attaching semiconductor dice to substrates |
FR2775810B1 (fr) † | 1998-03-09 | 2000-04-28 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
FR2778308B1 (fr) † | 1998-04-30 | 2006-05-26 | Schlumberger Systems & Service | Procede de realisation d'un composant electronique et composant electronique |
DE19905886A1 (de) † | 1999-02-11 | 2000-08-17 | Meto International Gmbh | Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements |
US6686650B1 (en) † | 1999-10-08 | 2004-02-03 | Dai Nippon Printing Co., Ltd. | Non-contact data carrier and IC chip |
FR2801707B1 (fr) | 1999-11-29 | 2002-02-15 | A S K | Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux |
JP3822040B2 (ja) * | 2000-08-31 | 2006-09-13 | 株式会社ルネサステクノロジ | 電子装置及びその製造方法 |
-
2001
- 2001-06-14 FR FR0107779A patent/FR2826153B1/fr not_active Expired - Fee Related
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2002
- 2002-06-07 TW TW091112336A patent/TWI230360B/zh not_active IP Right Cessation
- 2002-06-12 DK DK02762487T patent/DK1309940T3/da active
- 2002-06-12 ES ES02762487T patent/ES2323858T5/es not_active Expired - Lifetime
- 2002-06-12 AU AU2002327869A patent/AU2002327869B2/en not_active Ceased
- 2002-06-12 KR KR1020037002052A patent/KR100961671B1/ko active IP Right Grant
- 2002-06-12 BR BR0205601-1A patent/BR0205601A/pt not_active Application Discontinuation
- 2002-06-12 PT PT02762487T patent/PT1309940E/pt unknown
- 2002-06-12 EP EP02762487.3A patent/EP1309940B2/fr not_active Expired - Lifetime
- 2002-06-12 AT AT02762487T patent/ATE424591T2/de active
- 2002-06-12 RU RU2003104516/28A patent/RU2298254C2/ru active
- 2002-06-12 DE DE60231367T patent/DE60231367D1/de not_active Expired - Lifetime
- 2002-06-12 CA CA2418737A patent/CA2418737C/fr not_active Expired - Lifetime
- 2002-06-12 WO PCT/FR2002/002005 patent/WO2002103627A1/fr active Application Filing
- 2002-06-12 MX MXPA03001309A patent/MXPA03001309A/es active IP Right Grant
- 2002-06-12 IL IL15410502A patent/IL154105A0/xx active IP Right Grant
- 2002-06-12 JP JP2003505872A patent/JP4274320B2/ja not_active Expired - Lifetime
- 2002-06-12 CN CNB028020723A patent/CN1295646C/zh not_active Expired - Lifetime
- 2002-06-14 US US10/170,445 patent/US6770509B2/en not_active Expired - Lifetime
-
2003
- 2003-01-23 IL IL154105A patent/IL154105A/en unknown
- 2003-02-05 ZA ZA200300984A patent/ZA200300984B/xx unknown
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2004
- 2004-06-16 HK HK04104354A patent/HK1061296A1/xx not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
AU2002327869B2 (en) | 2007-10-18 |
EP1309940A1 (fr) | 2003-05-14 |
BR0205601A (pt) | 2003-07-08 |
ES2323858T3 (es) | 2009-07-27 |
US6770509B2 (en) | 2004-08-03 |
FR2826153B1 (fr) | 2004-05-28 |
DE60231367D1 (de) | 2009-04-16 |
US20020192856A1 (en) | 2002-12-19 |
TWI230360B (en) | 2005-04-01 |
EP1309940B2 (fr) | 2018-09-19 |
KR20030025286A (ko) | 2003-03-28 |
EP1309940B1 (fr) | 2009-03-04 |
DK1309940T3 (da) | 2009-06-29 |
FR2826153A1 (fr) | 2002-12-20 |
ZA200300984B (en) | 2003-05-23 |
IL154105A0 (en) | 2003-07-31 |
PT1309940E (pt) | 2009-06-08 |
CN1295646C (zh) | 2007-01-17 |
RU2298254C2 (ru) | 2007-04-27 |
CA2418737A1 (fr) | 2002-12-27 |
JP2004521515A (ja) | 2004-07-15 |
HK1061296A1 (en) | 2004-09-10 |
ATE424591T2 (de) | 2009-03-15 |
MXPA03001309A (es) | 2003-10-06 |
JP4274320B2 (ja) | 2009-06-03 |
CN1463414A (zh) | 2003-12-24 |
KR100961671B1 (ko) | 2010-06-09 |
CY1109116T1 (el) | 2014-07-02 |
IL154105A (en) | 2006-12-10 |
WO2002103627A1 (fr) | 2002-12-27 |
CA2418737C (fr) | 2012-05-22 |
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