DK1309940T3 - Fremgangsmåde til at forbinde en chip til en antenne tilhörende en radiofrekvensidentifikationsindretning til kontaktlöse chipkort - Google Patents

Fremgangsmåde til at forbinde en chip til en antenne tilhörende en radiofrekvensidentifikationsindretning til kontaktlöse chipkort

Info

Publication number
DK1309940T3
DK1309940T3 DK02762487T DK02762487T DK1309940T3 DK 1309940 T3 DK1309940 T3 DK 1309940T3 DK 02762487 T DK02762487 T DK 02762487T DK 02762487 T DK02762487 T DK 02762487T DK 1309940 T3 DK1309940 T3 DK 1309940T3
Authority
DK
Denmark
Prior art keywords
chip
antenna
radio frequency
identification device
frequency identification
Prior art date
Application number
DK02762487T
Other languages
English (en)
Inventor
Fabien Zupanek
Christophe Halope
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8864298&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK1309940(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ask Sa filed Critical Ask Sa
Application granted granted Critical
Publication of DK1309940T3 publication Critical patent/DK1309940T3/da

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/645Inductive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6661High-frequency adaptations for passive devices
    • H01L2223/6677High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16238Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731Location prior to the connecting process
    • H01L2224/73101Location prior to the connecting process on the same surface
    • H01L2224/73103Bump and layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119Arrangement of the bump connectors prior to mounting
    • H01L2224/81191Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818Bonding techniques
    • H01L2224/81801Soldering or alloying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83194Lateral distribution of the layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0105Tin [Sn]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01057Lanthanum [La]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01058Cerium [Ce]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811Extrinsic, i.e. with electrical conductive fillers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Support Of Aerials (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
DK02762487T 2001-06-14 2002-06-12 Fremgangsmåde til at forbinde en chip til en antenne tilhörende en radiofrekvensidentifikationsindretning til kontaktlöse chipkort DK1309940T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0107779A FR2826153B1 (fr) 2001-06-14 2001-06-14 Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact
PCT/FR2002/002005 WO2002103627A1 (fr) 2001-06-14 2002-06-12 Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact

Publications (1)

Publication Number Publication Date
DK1309940T3 true DK1309940T3 (da) 2009-06-29

Family

ID=8864298

Family Applications (1)

Application Number Title Priority Date Filing Date
DK02762487T DK1309940T3 (da) 2001-06-14 2002-06-12 Fremgangsmåde til at forbinde en chip til en antenne tilhörende en radiofrekvensidentifikationsindretning til kontaktlöse chipkort

Country Status (22)

Country Link
US (1) US6770509B2 (da)
EP (1) EP1309940B2 (da)
JP (1) JP4274320B2 (da)
KR (1) KR100961671B1 (da)
CN (1) CN1295646C (da)
AT (1) ATE424591T2 (da)
AU (1) AU2002327869B2 (da)
BR (1) BR0205601A (da)
CA (1) CA2418737C (da)
CY (1) CY1109116T1 (da)
DE (1) DE60231367D1 (da)
DK (1) DK1309940T3 (da)
ES (1) ES2323858T5 (da)
FR (1) FR2826153B1 (da)
HK (1) HK1061296A1 (da)
IL (2) IL154105A0 (da)
MX (1) MXPA03001309A (da)
PT (1) PT1309940E (da)
RU (1) RU2298254C2 (da)
TW (1) TWI230360B (da)
WO (1) WO2002103627A1 (da)
ZA (1) ZA200300984B (da)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
US7239226B2 (en) 2001-07-10 2007-07-03 American Express Travel Related Services Company, Inc. System and method for payment using radio frequency identification in contact and contactless transactions
US7889052B2 (en) 2001-07-10 2011-02-15 Xatra Fund Mx, Llc Authorizing payment subsequent to RF transactions
US7627531B2 (en) 2000-03-07 2009-12-01 American Express Travel Related Services Company, Inc. System for facilitating a transaction
US7650314B1 (en) 2001-05-25 2010-01-19 American Express Travel Related Services Company, Inc. System and method for securing a recurrent billing transaction
US9031880B2 (en) 2001-07-10 2015-05-12 Iii Holdings 1, Llc Systems and methods for non-traditional payment using biometric data
US8294552B2 (en) 2001-07-10 2012-10-23 Xatra Fund Mx, Llc Facial scan biometrics on a payment device
US7746215B1 (en) 2001-07-10 2010-06-29 Fred Bishop RF transactions using a wireless reader grid
US7360689B2 (en) 2001-07-10 2008-04-22 American Express Travel Related Services Company, Inc. Method and system for proffering multiple biometrics for use with a FOB
US8001054B1 (en) 2001-07-10 2011-08-16 American Express Travel Related Services Company, Inc. System and method for generating an unpredictable number using a seeded algorithm
US7735725B1 (en) 2001-07-10 2010-06-15 Fred Bishop Processing an RF transaction using a routing number
US8284025B2 (en) 2001-07-10 2012-10-09 Xatra Fund Mx, Llc Method and system for auditory recognition biometrics on a FOB
US7249112B2 (en) 2002-07-09 2007-07-24 American Express Travel Related Services Company, Inc. System and method for assigning a funding source for a radio frequency identification device
US8548927B2 (en) 2001-07-10 2013-10-01 Xatra Fund Mx, Llc Biometric registration for facilitating an RF transaction
US7303120B2 (en) 2001-07-10 2007-12-04 American Express Travel Related Services Company, Inc. System for biometric security using a FOB
US9454752B2 (en) 2001-07-10 2016-09-27 Chartoleaux Kg Limited Liability Company Reload protocol at a transaction processing entity
US20040236699A1 (en) 2001-07-10 2004-11-25 American Express Travel Related Services Company, Inc. Method and system for hand geometry recognition biometrics on a fob
US7668750B2 (en) 2001-07-10 2010-02-23 David S Bonalle Securing RF transactions using a transactions counter
US9024719B1 (en) 2001-07-10 2015-05-05 Xatra Fund Mx, Llc RF transaction system and method for storing user personal data
US6805287B2 (en) 2002-09-12 2004-10-19 American Express Travel Related Services Company, Inc. System and method for converting a stored value card to a credit card
US7176900B2 (en) * 2002-10-18 2007-02-13 Pitney Bowes Inc. Method and apparatus for field programming radio frequency identification devices
WO2005073937A2 (en) * 2004-01-22 2005-08-11 Mikoh Corporation A modular radio frequency identification tagging method
JP4672384B2 (ja) * 2004-04-27 2011-04-20 大日本印刷株式会社 Icタグ付シートの製造方法、icタグ付シートの製造装置、icタグ付シート、icチップの固定方法、icチップの固定装置、およびicタグ
US7318550B2 (en) 2004-07-01 2008-01-15 American Express Travel Related Services Company, Inc. Biometric safeguard method for use with a smartcard
FR2875995B1 (fr) * 2004-09-24 2014-10-24 Oberthur Card Syst Sa Procede de montage d'un composant electronique sur un support, de preference mou, et entite electronique ainsi obtenue, telle q'un passeport
US7560813B2 (en) 2005-06-14 2009-07-14 John Trezza Chip-based thermo-stack
US8456015B2 (en) 2005-06-14 2013-06-04 Cufer Asset Ltd. L.L.C. Triaxial through-chip connection
US7851348B2 (en) 2005-06-14 2010-12-14 Abhay Misra Routingless chip architecture
US7767493B2 (en) 2005-06-14 2010-08-03 John Trezza Post & penetration interconnection
US20060281303A1 (en) * 2005-06-14 2006-12-14 John Trezza Tack & fuse chip bonding
US7989958B2 (en) 2005-06-14 2011-08-02 Cufer Assett Ltd. L.L.C. Patterned contact
US7786592B2 (en) 2005-06-14 2010-08-31 John Trezza Chip capacitive coupling
US7838997B2 (en) 2005-06-14 2010-11-23 John Trezza Remote chip attachment
US7687400B2 (en) 2005-06-14 2010-03-30 John Trezza Side stacking apparatus and method
CN101156164B (zh) * 2005-09-26 2014-05-07 松下电器产业株式会社 非接触型信息存储介质及其制造方法
FR2891665A1 (fr) * 2005-09-30 2007-04-06 K Sa As Procede et dispositif d'extraction d'une puce electronique a partir d'une tranche de silicium et transport de la puce jusqu'a son montage sur un dispositif electronique
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
US20070131781A1 (en) 2005-12-08 2007-06-14 Ncr Corporation Radio frequency device
KR101037755B1 (ko) * 2006-01-11 2011-05-27 현대중공업 주식회사 고속철도 자동제어를 위한 전류통신장치
US7687397B2 (en) 2006-06-06 2010-03-30 John Trezza Front-end processed wafer having through-chip connections
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US7670874B2 (en) 2007-02-16 2010-03-02 John Trezza Plated pillar package formation
WO2008103870A1 (en) * 2007-02-23 2008-08-28 Newpage Wisconsin System Inc. Multifunctional paper identification label
HK1109708A2 (en) * 2007-04-24 2008-06-13 On Track Innovations Ltd Interface card and apparatus and process for the formation thereof
US20090014852A1 (en) * 2007-07-11 2009-01-15 Hsin-Hui Lee Flip-Chip Packaging with Stud Bumps
US7948384B1 (en) * 2007-08-14 2011-05-24 Mpt, Inc. Placard having embedded RFID device for tracking objects
FR2922342B1 (fr) * 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
CN101452537B (zh) * 2007-11-30 2011-11-16 深圳富泰宏精密工业有限公司 芯片卡固持装置及具有该固持装置的便携式电子装置
PT103998B (pt) * 2008-03-20 2011-03-10 Univ Nova De Lisboa Dispositivos electrónicos e optoelectrónicos de efeito de campo compreendendo camadas de fibras naturais, sintéticas ou mistas e respectivo processo de fabrico
FR2937165B1 (fr) * 2008-10-15 2011-04-08 Fasver Procede de connexion d'un microcircuit a des bornes d'une antenne imprimee sur un support
KR101596537B1 (ko) 2008-11-25 2016-02-22 씬 필름 일렉트로닉스 에이에스에이 인쇄형 안테나, 안테나 인쇄 방법, 및 인쇄형 안테나를 포함하는 디바이스
DE102009037627A1 (de) * 2009-08-14 2011-02-17 Giesecke & Devrient Gmbh Portabler Datenträger
FR2962579A1 (fr) 2010-07-12 2012-01-13 Ask Sa Dispositif d'identification radio frequence en polycarbonate et son procede de fabrication
US20130075476A1 (en) 2011-09-23 2013-03-28 Hid Global Ireland Teoranta Secure rfid device and method of production
DE102015120156B4 (de) * 2015-11-20 2019-07-04 Semikron Elektronik Gmbh & Co. Kg Vorrichtung zur materialschlüssigen Verbindung von Verbindungspartnern eines Leistungselekronik-Bauteils und Verwendung einer solchen Vorrichtung
CN109216293A (zh) * 2017-07-03 2019-01-15 葛兰菲安全有限公司 芯片和电子电路的粘接结构和粘接方法
WO2022065994A1 (en) 2020-09-28 2022-03-31 Samsung Electronics Co., Ltd. Non-galvanic interconnect for planar rf devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2149000T3 (es) 1996-08-02 2000-10-16 Schlumberger Systems & Service Tarjeta de circuito integrado con conexion mixta.
FR2753819B1 (fr) * 1996-09-20 1998-11-27 Carte a circuit integre a connexion mixte
US5861678A (en) * 1997-12-23 1999-01-19 Micron Technology, Inc. Method and system for attaching semiconductor dice to substrates
FR2775810B1 (fr) 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
FR2778308B1 (fr) 1998-04-30 2006-05-26 Schlumberger Systems & Service Procede de realisation d'un composant electronique et composant electronique
DE19905886A1 (de) 1999-02-11 2000-08-17 Meto International Gmbh Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements
US6686650B1 (en) 1999-10-08 2004-02-03 Dai Nippon Printing Co., Ltd. Non-contact data carrier and IC chip
FR2801707B1 (fr) 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
JP3822040B2 (ja) * 2000-08-31 2006-09-13 株式会社ルネサステクノロジ 電子装置及びその製造方法

Also Published As

Publication number Publication date
AU2002327869B2 (en) 2007-10-18
ES2323858T5 (es) 2019-03-05
EP1309940A1 (fr) 2003-05-14
BR0205601A (pt) 2003-07-08
ES2323858T3 (es) 2009-07-27
US6770509B2 (en) 2004-08-03
FR2826153B1 (fr) 2004-05-28
DE60231367D1 (de) 2009-04-16
US20020192856A1 (en) 2002-12-19
TWI230360B (en) 2005-04-01
EP1309940B2 (fr) 2018-09-19
KR20030025286A (ko) 2003-03-28
EP1309940B1 (fr) 2009-03-04
FR2826153A1 (fr) 2002-12-20
ZA200300984B (en) 2003-05-23
IL154105A0 (en) 2003-07-31
PT1309940E (pt) 2009-06-08
CN1295646C (zh) 2007-01-17
RU2298254C2 (ru) 2007-04-27
CA2418737A1 (fr) 2002-12-27
JP2004521515A (ja) 2004-07-15
HK1061296A1 (en) 2004-09-10
ATE424591T2 (de) 2009-03-15
MXPA03001309A (es) 2003-10-06
JP4274320B2 (ja) 2009-06-03
CN1463414A (zh) 2003-12-24
KR100961671B1 (ko) 2010-06-09
CY1109116T1 (el) 2014-07-02
IL154105A (en) 2006-12-10
WO2002103627A1 (fr) 2002-12-27
CA2418737C (fr) 2012-05-22

Similar Documents

Publication Publication Date Title
DK1309940T3 (da) Fremgangsmåde til at forbinde en chip til en antenne tilhörende en radiofrekvensidentifikationsindretning til kontaktlöse chipkort
RU2003104516A (ru) Способ подсоединения кристалла интегральной схемы к антенне в радиочастотном устройстве идентификации бесконтактной интеллектуальной карты
AU2002327869A1 (en) Method for connecting a chip to the antenna of a radio frequency identification device of a contactless chip card variety
TW200606729A (en) Radio frequency identification (RFID) tag and manufacturing method thereof
JP4837270B2 (ja) Rfidセンサシステムおよびrfid検知方法
SG120950A1 (en) Circuit chip connector and method of connecting a circuit chip
AU2002367764A1 (en) Enabling/enhancing a feature of an electronic device using radio frequency identification technology
EP1118960A3 (fr) Module électronique sans contact pour carte ou étiquette
CA2343397A1 (en) Radio frequency identification tag apparatus and related method
WO2006071371A3 (en) Radio frequency circuit with integrated on-chip radio frequency signal coupler
WO2004061753A3 (en) Rfid device and method of forming
CY1113091T1 (el) Συσκευη αναγνωσης rfid για ενα εγγραφο
EP1026832A4 (en) INFORMATION COMMUNICATION DEVICE
DE60119437D1 (de) Breitband Hochimpedanz-Transponder für elektronisches Identifizierungssystem
AU2002364324A1 (en) Smart card with extended surface module
TW200620050A (en) RFID tag and method of manufacturing the same
ATE550734T1 (de) Chipkarte
KR100774902B1 (ko) Rfid 태그
MXPA05005416A (es) Dispositivo de identificacion de radio frecuencia formado en una region no metalizada con una antena conectada a una region metalizada exterior, y metodo de fabricacion.
ATE306719T1 (de) Flaechig ausgebildeter traeger fuer halbleiter- chips sowie verfahren zu seiner herstellung
FR2845802B1 (fr) Circuit integre rfid-uhf
KR101450241B1 (ko) 태그 단말기 및 태그 단말기 제조 방법
WO2003050955A3 (fr) Circuit integre comprenant un generateur d'horloge, carte a puce comprenant un tel circuit integre et procede de generation d'horloge associe
AU5704499A (en) Radio frequency identification tag circuit chip having printed interconnection pads
JP2007122467A (ja) Rf−idメディア