JP4274320B2 - 各種無接触チップカードの高周波識別装置のアンテナに対するチップ接続方法 - Google Patents

各種無接触チップカードの高周波識別装置のアンテナに対するチップ接続方法 Download PDF

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JP4274320B2
JP4274320B2 JP2003505872A JP2003505872A JP4274320B2 JP 4274320 B2 JP4274320 B2 JP 4274320B2 JP 2003505872 A JP2003505872 A JP 2003505872A JP 2003505872 A JP2003505872 A JP 2003505872A JP 4274320 B2 JP4274320 B2 JP 4274320B2
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antenna
support
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JP2004521515A (ja
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アロペ，クリストフ
ズパネク，ファビアン
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ASK SA
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ASK SA
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
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    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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  • Credit Cards Or The Like (AREA)
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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、高周波識別装置（ＲＦＩＤ）、特にスマートカードを使用するもの、更に明確にはコンタクトレス・スマートカード型のＲＦＩＤ装置のアンテナに対するチップの接続方法関連分野に関わる。
【従来の技術】
コンタクトレス・スマートカード、コンタクトレスチケット、及びスマートラベルを含むＲＦＩＤ装置は、最近極めて普及するに至った。クレジットカードとしてのその用途に加え、スマートカードは、多数の分野で不可欠の道具となった。この成長は、カードを適切な読取器と接触させる在来の用法（銀行カード及びテレフォンカード）に加え、新しいカードはその読取器と全く接触させないで使用することが出来るとの事実に負うところが大きい。
【０００２】
コンタクトレスカード又はコンタクト／コンタクトレスの混成カードと関連読取器との間の情報交換は、コンタクトレスカードと一体のアンテナと読取器内設置の第２アンテナとの間の遠隔電磁結合を用いて達成される。情報の作成、記憶、及び処理のため、カードにはアンテナに接続されたチップが装備されている。そのアンテナは一般的にプラスチック材料製の誘電支持体上に配置される。この使い易さにより他に多くの用途の開発が可能になった。例えば、電子財布の開発などを挙げることが出来る。運輸部門において、スマートカードは高速道路料金支払い手段及び加入者カードとして開発されて来た。たまにしか旅行しない人のためにもまた、ＲＦＩＤ型チケットは可能である。催し事の際に、会場への定期入場券としてサポータが使用することが出来る。警備保障用途に関しては、多数の会社がＩＳＯコンタクトレス・スマートカードに基づく職員識別システムを設定している。
【０００３】
スマートカード特にコンタクトレス・スマートカード及びコンタクトレスチケットの発展には無視できない限界は、それらの原価である。この補助具が広く普及するためには、原価が出来るだけ低くなければならない。この価格低減のためには、カード本体作成に使用する材料の価格が低いこと、及び製作コストを、特に加工工程を単純化することにより低減することが必要である。
【０００４】
チップ及びアンテナを含むＲＦＩＤ装置のアンテナにチップを接続する方法は、「フリップチップ」組立技術に基づく。この技術は、アンテナとその基板に対しチップの能動側を直接接続することを特徴とし、チップ受動側の基板に対する接合とアンテナに対するその配線とから成り「ワイヤボンディング」と呼ばれる古い配線技術と対照的である。
【０００５】
「フリップチップ」組立技術には、主要なステップ４つが含まれる。
−重合又は金属化によりチップ接点を形成するステップ、
−チップ接点とアンテナ接点との接触によりチップをカードのアンテナに接続するステップ、
−チップとアンテナ支持体との間の空隙を接着性誘電物質で満たすステップ。
使用する接点の型により、多数の変形が存在する。
合金ベース（錫／鉛）の接点に関しては、チップをアンテナ接点上に配置し、組立体を熱して半田付け接続を得る。
金接点に関しては、改質した「ワイヤボンディング」技術に準じて配置されたチップを、金／金サーモソニック接続によりアンテナに対して接続する。
導電接着性ポリマベースの接点に関しては、アンテナの接点上に先ず導電性接着剤をチップ接点に向けて配置し、その上にチップを配置する。組立体を加熱して導電性接着剤を重合する。
【０００６】
使用される型の変形に関わりなく「フリップチップ」技術は、追加の必須のステップを含む。これは、チップを位置付けする前に導電性接着剤をアンテナ接点の上に配置するステップを含む。この接着剤は一般的に導電性エポキシ／銀接着剤である。この接着剤が、チップとアンテナとの間の電気接続を簡略化する。
【０００７】
しかし、このような接着剤を使うとき、ポリマ混合物を架橋しなければならない。この架橋は、加熱又は紫外線照射によっておこなう。
このような接着剤の使用には、多数の欠点がある。第１の欠点は、エネルギに関連する。接着剤重合の必要は、加熱又は紫外線照射によるエネルギ消費を伴い、また適切な装置を必要とする。
【０００８】
別の欠点は、アンテナ支持体製造工程で使用される一定の材料が、加熱に際して変形することである。この変形により、アンテナに切れ目が入ることがある。
さらに別の欠点は、導電性接着剤をアンテナ接点上に配置してチップを位置付けするとき接着剤が流れることがあり、これが短絡を生じることである。
これら後の２つの欠点により、著しい生産高損失を生じることがあり、それがコンタクトレス・スマートカード、コンタクトレスチケット及びＲＦＩＤ一般の原価を甚だしく増加する。
【０００９】
この理由で、フランス特許出願２，７７８，３０８号に開示された別の技術は、チップの接続端子をアンテナ接点の未乾燥インクの中に埋め込むステップから成る。残念ながら、この技術は、湿ったインクの使用が、製造ライン内に、また事実上、カードに対するチップ接続と同時に、シルクスクリーンインク塗布工程を必要とする限りカード製造工程の連続実施が妨げられる。
【００１０】
【発明の解決しようとする課題】
本発明の目的は、チップをＲＦＩＤ装置特にコンタクトレス・スマートカードのアンテナに対し接続するための、エネルギ負担がなく、良好な製造生産高を達成することの出来る簡略化法を提供することによりこれら難点を緩和することにある。
【００１１】
【課題を解決するための手段】
本発明はしたがって変形可能で非弾性の接点を有するコンタクトレス・スマートカードのアンテナに対するチップ接続方法に関わる。そのアンテナは、変形可能な非弾性材料で製造されたアンテナ支持体上に導電性インクを用いて印刷されたものである。この工程は、以下のステップを含む。
【００１２】
−非変形性材料製の接点を備えたチップを、アンテナ支持体上に、接点がアンテナ接点に向くよう、位置付けるステップ、及び
−圧力印加の結果チップ接点がアンテナ支持体及びアンテナ接点を変形し、支持体及びアンテナ接点は印加した圧力を解放した後も変形を保ち、それによりチップ接点とアンテナ接点との間に最大接触面積が得られるよう、チップに圧力を印加するステップ。
好ましい実施形態によれば、製造工程は、チップを支持体に関し固定位置に保つため、チップを位置付けるステップの前に、接着性誘電物質をアンテナ支持体上で前記アンテナ接点の間に配置するステップから成る追加ステップを含む。
【００１３】
【発明の実施の形態】
本発明の目的、対象及び特徴は、添付図面との関連で取り上げたとき以下の記述からいっそう明らかになるであろう。
本発明による方法の第１ステップには、チップ接続を形成するステップから成る。このようなチップ１０を図１に示す。このチップはＩＳＯスマートカードで良い。しかし、可搬チケット型無接触物体用には、もっと小さい寸法であって良い。接点１２は、変形不能材料を用いチップの能動側１４に形成される。これらの形状は円錐形であるのが好ましい。これらの接点は金属化により形成される。この場合、接点は錫／鉛などの合金で形成される。これらの接点はまた金で形成される。別の実施例によれば、接点は重合により形成される。この場合、接点は導電性ポリマで形成される。
【００１４】
アンテナ支持体を図２に示す。この支持体１６は、非弾性変形可能材料から成る。変形可能でその変形を維持する繊維質材料が好ましい。好適実施例によれば、アンテナ支持体は紙製である。アンテナは導電性インクを用いて印刷される。好ましい印刷工程はシルクスクリーン法である。チップとアンテナを接触させるため２つの接点１８もまた形成される。使用する導電性インクは、銀、銅及び炭素など導電性要素を混入したポリマであるのが好適である。アンテナ支持体１６の上には、アンテナの２接点１８の間に、接着性誘電物質２０を配置する。この接着性物質は、チップを接続してから接着剤を塗布する「フリップチップ」工程と異なり、チップを支持体上に配置する前に塗布する。したがって、このステップは、実行し易いので出来高が遙かに良い。接着剤は、エポキシ樹脂又はシアノアクリレート接着剤である。
【００１５】
接点１８を形成するインクが乾燥し接着物質を塗布したら、チップ接点がアンテナ接点と向き合うよう、チップをアンテナ支持体上に位置付けする。チップ接点１２が支持体１６とアンテナ接点１８を図３に示すように変形させるよう、チップ１０に圧力を印加する。この変形は痕跡の形となり、その内径は接点１２の外形に正確に一致する。このようにして、チップ接点１２と接点１８の導電性インクとの間には最大接触面積上でほぼ完璧な接触が出来上がる。支持体１６を製造する材料は、接点１８の導電性インクと同様に変形可能で非弾性で、これら２つの材料は、圧力が解放されたときでも元の形状に戻らない性質を有する。これは、支持体１６の材料が紙などの繊維質物質であるとき特に当てはまる。
【００１６】
圧力の結果、接着性誘電物質２０が拡がって接点間のチップ全面を覆う。これにより、チップ１０とアンテナ支持体１６との間の機械的組立−またそれによりチップとアンテナ支持体との間の電気接触−を強化することが出来る。
本方法は、こうしてチップとアンテナとの間の電気接触を改善するのに導電性接着剤の使用を不要にする。これはまた、この接着剤を重合するためのエネルギ、特に加熱エネルギ、の必要を無くする。
【００１７】
本発明にしたがう方法によれば、耐熱性がないため従来無視されてきた材料から成るアンテナ支持体を使用することが出来る。
加えて、チップとアンテナとの間の接続が強化される。チップとアンテナ支持体との間のほぼ完璧な組立及び大きい接触面積により、チップ−アンテナ接続破断の危険性が限局される。こうしてカードの品質が改善される。
【図面の簡単な説明】
【図１】 チップ接点配置ステップ後の、チップの正面図を示す。
【図２】 誘電物質堆積ステップ後の、アンテナ支持体とアンテナの正面図を示す。
【図３】 チップ位置付けステップ後の、アンテナ支持体の正面図を示す。

Claims (8)

  1. 変形可能な非弾性材料製の繊維質材料からなるアンテナ支持体（１６）上に配置されたチップとアンテナとを特徴とし、前記アンテナはこれもまた変形可能な非弾性で前記支持体上に導電性インクを用いて印刷された接点（１８）を特徴とする、コンタクトレス・スマートカード型高周波識別装置のアンテナに対するチップ（１０）の接続方法であって、
    −前記チップ（１０）を支持体に対して固定位置に維持するよう、チップを位置付ける前に、前記支持体（１６）上の前記チップに対面する位置に熱硬化性のものを除く接着性誘電物質（２０）を配置するステップと、
    −非変形性材料製の接点（１２）を備えたチップ（１０）を、前記アンテナ支持体上に、前記チップ接点がアンテナの接点（１８）に直面するよう、位置決めするステップと、
    −圧力印加の結果、前記チップ接点が前記支持体と前記アンテナ接点とを変形し、支持体と前記アンテナ接点とは印加した圧力が解放された後もその変形を保ち、前記変形は痕跡の形となり、その内径はチップ接点の外形に正確に一致し、従って、前記チップ接点と前記アンテナの導電性インクとの間に、最大接触面積が得られるようにするよう、前記チップに圧力を印加するステップと、
    の各ステップを含み、かつ、前記接着性誘電物質（２０）を加熱により硬化するステップを含まないことを特徴とする方法。
  2. 前記繊維質材料が紙である請求項１に記載の方法。
  3. 前記チップ（１０）を支持体に対して固定位置に維持するよう、チップを位置付ける前に、前記支持体（１６）上で２つの前記アンテナの接点（１８）の間に前記接着性誘電物質（２０）を配置する請求項１又は２に記載の方法。
  4. アンテナ支持体（１６）に塗布される接着性誘電物質（２０）がシアノアクリレートである請求項３に記載の方法。
  5. チップ（１２）の接点が金属化により得られる請求項１乃至４の何れか１つに記載の方法。
  6. チップ（１２）の接点が重合により得られる請求項１乃至４の何れか１つに記載の方法。
  7. チップ（１２）の接点の形状が円錐形である請求項１乃至６の何れか１つに記載の方法。
  8. 前記アンテナが前記導電性インクを用いるスクリーン印刷技術により得られる請求項１乃至７の何れか１つに記載の方法。
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HK1061296A1 (en) 2004-09-10
PT1309940E (pt) 2009-06-08
EP1309940A1 (fr) 2003-05-14
CA2418737C (fr) 2012-05-22
WO2002103627A1 (fr) 2002-12-27
TWI230360B (en) 2005-04-01
IL154105A (en) 2006-12-10
EP1309940B1 (fr) 2009-03-04
ES2323858T3 (es) 2009-07-27
DK1309940T3 (da) 2009-06-29
JP2004521515A (ja) 2004-07-15
CY1109116T1 (el) 2014-07-02
CN1295646C (zh) 2007-01-17
FR2826153B1 (fr) 2004-05-28
AU2002327869B2 (en) 2007-10-18
US20020192856A1 (en) 2002-12-19
IL154105A0 (en) 2003-07-31
CA2418737A1 (fr) 2002-12-27
CN1463414A (zh) 2003-12-24
ATE424591T2 (de) 2009-03-15
US6770509B2 (en) 2004-08-03
KR20030025286A (ko) 2003-03-28
EP1309940B2 (fr) 2018-09-19
RU2298254C2 (ru) 2007-04-27
FR2826153A1 (fr) 2002-12-20
ES2323858T5 (es) 2019-03-05
ZA200300984B (en) 2003-05-23
BR0205601A (pt) 2003-07-08
KR100961671B1 (ko) 2010-06-09
MXPA03001309A (es) 2003-10-06

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