ES2220577T3 - Pista conductiva sin silicona para la industria electrica, y su utilizacion. - Google Patents
Pista conductiva sin silicona para la industria electrica, y su utilizacion.Info
- Publication number
- ES2220577T3 ES2220577T3 ES00985043T ES00985043T ES2220577T3 ES 2220577 T3 ES2220577 T3 ES 2220577T3 ES 00985043 T ES00985043 T ES 00985043T ES 00985043 T ES00985043 T ES 00985043T ES 2220577 T3 ES2220577 T3 ES 2220577T3
- Authority
- ES
- Spain
- Prior art keywords
- mixture
- particles
- elastomer
- powder
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims abstract description 51
- 239000002245 particle Substances 0.000 claims abstract description 27
- 229920001971 elastomer Polymers 0.000 claims abstract description 15
- 239000000806 elastomer Substances 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052810 boron oxide Inorganic materials 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- -1 polyoxypropylene Polymers 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- 241000430525 Aurinia saxatilis Species 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- 241000557876 Centaurea cineraria Species 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 229920001296 polysiloxane Polymers 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 7
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 229920000098 polyolefin Polymers 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6598—Shield material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0831—Gold
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S277/00—Seal for a joint or juncture
- Y10S277/92—Seal including electromagnetic shielding feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T428/12063—Nonparticulate metal component
- Y10T428/12104—Particles discontinuous
- Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24008—Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface
- Y10T428/24017—Hook or barb
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19959262A DE19959262A1 (de) | 1999-12-09 | 1999-12-09 | Leitfähiges pastöses Material und dessen Verwendung |
| DE19959262 | 1999-12-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2220577T3 true ES2220577T3 (es) | 2004-12-16 |
Family
ID=7931917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES00985043T Expired - Lifetime ES2220577T3 (es) | 1999-12-09 | 2000-11-16 | Pista conductiva sin silicona para la industria electrica, y su utilizacion. |
Country Status (10)
| Country | Link |
|---|---|
| US (4) | US6518496B1 (OSRAM) |
| EP (1) | EP1240648B8 (OSRAM) |
| JP (1) | JP4436993B2 (OSRAM) |
| KR (1) | KR100743732B1 (OSRAM) |
| AT (1) | ATE266241T1 (OSRAM) |
| AU (1) | AU2159401A (OSRAM) |
| CA (1) | CA2394050A1 (OSRAM) |
| DE (2) | DE19959262A1 (OSRAM) |
| ES (1) | ES2220577T3 (OSRAM) |
| WO (1) | WO2001043146A1 (OSRAM) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19959262A1 (de) * | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
| US20040057198A1 (en) * | 2002-03-11 | 2004-03-25 | Helmut Kahl | Device housing comprising an electromagnetically shielded region |
| US7018701B2 (en) * | 2002-06-06 | 2006-03-28 | Fuji Polymer Industries Co., Ltd. | Thermally conductive sheet and method for manufacturing the same |
| US7346549B2 (en) * | 2002-06-27 | 2008-03-18 | At&T Knowledge Ventures, L.P. | System and method for wirelessly transacting access to a set of events and associated digital content/products |
| US6864573B2 (en) * | 2003-05-06 | 2005-03-08 | Daimlerchrysler Corporation | Two piece heat sink and device package |
| KR101155940B1 (ko) | 2003-11-05 | 2012-07-05 | 다우 코닝 코포레이션 | 열 전도성 그리스, 당해 그리스가 사용되는 방법 및디바이스 |
| SE0302985D0 (sv) * | 2003-11-13 | 2003-11-13 | Mydata Automation Ab | A method for generating a jetting program |
| JP2005187793A (ja) * | 2003-12-24 | 2005-07-14 | Rohm & Haas Electronic Materials Llc | 改良された接着剤 |
| US20090169724A1 (en) * | 2007-12-27 | 2009-07-02 | Toshiaki Ogiwara | Conductive paste for use in membrane touch switch applications |
| FR2939441B1 (fr) | 2008-12-08 | 2010-12-24 | Solvay | Procede de preparation d'un materiau polymere transparent comprenant des nanoparticules minerales ayant un facteur de forme strictement superieur a 1,0 |
| US7816785B2 (en) * | 2009-01-22 | 2010-10-19 | International Business Machines Corporation | Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package |
| JP5651676B2 (ja) | 2009-03-16 | 2015-01-14 | ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ | 熱伝導性グリース、並びに、該グリースを用いる方法及びデバイス |
| JP5632852B2 (ja) * | 2010-08-27 | 2014-11-26 | Ｄｏｗａエレクトロニクス株式会社 | 低温焼結性銀ナノ粒子組成物および該組成物を用いて形成された電子物品 |
| KR101048083B1 (ko) * | 2010-10-14 | 2011-07-11 | 주식회사 이노칩테크놀로지 | 전자파 차폐 가스켓 |
| US9999158B2 (en) | 2013-01-03 | 2018-06-12 | Henkel IP & Holding GmbH | Thermally conductive EMI suppression compositions |
| EP3105300B1 (en) | 2014-02-13 | 2019-08-21 | Honeywell International Inc. | Compressible thermal interface materials |
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3653959A (en) * | 1970-04-14 | 1972-04-04 | Grace W R & Co | Encapsulating and potting composition and process |
| US4011360A (en) * | 1974-04-10 | 1977-03-08 | Chomerics, Inc. | Electrically conductive silicone rubber stock |
| EP0103695A1 (en) * | 1982-07-16 | 1984-03-28 | Showa Denko Kabushiki Kaisha | Vulcanized olefin-based rubber composition |
| JPS61123665A (ja) * | 1984-11-19 | 1986-06-11 | Matsushita Electric Ind Co Ltd | 導電性樹脂組成物の製造方法 |
| JPS6333443A (ja) * | 1986-07-28 | 1988-02-13 | Sumitomo Bakelite Co Ltd | 導電性樹脂組成物 |
| US4994903A (en) * | 1989-12-18 | 1991-02-19 | Texas Instruments Incorporated | Circuit substrate and circuit using the substrate |
| AU635393B2 (en) * | 1989-12-21 | 1993-03-18 | Amesbury Group, Inc. | Catalytic, water-soluble polymeric films for metal coatings |
| EP0555184B1 (de) * | 1992-02-07 | 1996-07-17 | Ciba-Geigy Ag | Füllstoff für wärmeleitende Kunststoffe |
| EP0562179A1 (en) * | 1992-03-26 | 1993-09-29 | Sumitomo Chemical Company, Limited | Electroconductive resin composition |
| JPH06136211A (ja) * | 1992-10-22 | 1994-05-17 | Asahi Chem Ind Co Ltd | スチレン系樹脂組成物 |
| DE4319965C3 (de) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung |
| JP3490500B2 (ja) * | 1994-06-28 | 2004-01-26 | 鐘淵化学工業株式会社 | 硬化性導電性組成物 |
| AU2740695A (en) * | 1994-07-01 | 1996-01-25 | Neste Oy | Electrically conducting polymer compositions |
| WO1996036057A1 (en) * | 1995-05-10 | 1996-11-14 | Littelfuse, Inc. | Ptc circuit protection device and manufacturing process for same |
| US6294257B1 (en) * | 1997-03-11 | 2001-09-25 | Zeon Corporation | Conductive elastomer film, method for production thereof, and conductive elastomer composition |
| WO1998040439A1 (en) * | 1997-03-14 | 1998-09-17 | Minnesota Mining And Manufacturing Company | Cure-on-demand, moisture-curable compositions having reactive silane functionality |
| JP3913859B2 (ja) * | 1997-09-10 | 2007-05-09 | 株式会社カネカ | 硬化性組成物 |
| US6281433B1 (en) * | 1999-08-03 | 2001-08-28 | Lucent Technologies Inc. | Faceplate for network switching apparatus |
| DE19959262A1 (de) * | 1999-12-09 | 2001-06-21 | Altoflex S A | Leitfähiges pastöses Material und dessen Verwendung |
-
1999
- 1999-12-09 DE DE19959262A patent/DE19959262A1/de not_active Withdrawn
-
2000
- 2000-09-25 US US09/669,083 patent/US6518496B1/en not_active Expired - Fee Related
- 2000-11-16 EP EP00985043A patent/EP1240648B8/en not_active Expired - Lifetime
- 2000-11-16 DE DE60010515T patent/DE60010515T2/de not_active Expired - Lifetime
- 2000-11-16 JP JP2001543744A patent/JP4436993B2/ja not_active Expired - Fee Related
- 2000-11-16 KR KR1020027007233A patent/KR100743732B1/ko not_active Expired - Fee Related
- 2000-11-16 AT AT00985043T patent/ATE266241T1/de not_active IP Right Cessation
- 2000-11-16 CA CA002394050A patent/CA2394050A1/en not_active Abandoned
- 2000-11-16 AU AU21594/01A patent/AU2159401A/en not_active Abandoned
- 2000-11-16 WO PCT/EP2000/011371 patent/WO2001043146A1/en not_active Ceased
- 2000-11-16 ES ES00985043T patent/ES2220577T3/es not_active Expired - Lifetime
-
2001
- 2001-11-08 US US10/010,475 patent/US6780927B2/en not_active Expired - Fee Related
- 2001-11-08 US US10/006,755 patent/US6563044B2/en not_active Expired - Fee Related
- 2001-11-08 US US10/008,752 patent/US6921780B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6921780B2 (en) | 2005-07-26 |
| US20020039662A1 (en) | 2002-04-04 |
| US6563044B2 (en) | 2003-05-13 |
| JP4436993B2 (ja) | 2010-03-24 |
| US6780927B2 (en) | 2004-08-24 |
| US20020068145A1 (en) | 2002-06-06 |
| DE60010515D1 (de) | 2004-06-09 |
| US6518496B1 (en) | 2003-02-11 |
| EP1240648B8 (en) | 2005-01-19 |
| ATE266241T1 (de) | 2004-05-15 |
| KR100743732B1 (ko) | 2007-07-27 |
| EP1240648A1 (en) | 2002-09-18 |
| DE19959262A1 (de) | 2001-06-21 |
| AU2159401A (en) | 2001-06-18 |
| JP2003516610A (ja) | 2003-05-13 |
| EP1240648B1 (en) | 2004-05-06 |
| US20020051862A1 (en) | 2002-05-02 |
| WO2001043146A1 (en) | 2001-06-14 |
| CA2394050A1 (en) | 2001-06-14 |
| DE60010515T2 (de) | 2005-05-12 |
| KR20030076920A (ko) | 2003-09-29 |
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