ATE266241T1 - Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung - Google Patents

Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung

Info

Publication number
ATE266241T1
ATE266241T1 AT00985043T AT00985043T ATE266241T1 AT E266241 T1 ATE266241 T1 AT E266241T1 AT 00985043 T AT00985043 T AT 00985043T AT 00985043 T AT00985043 T AT 00985043T AT E266241 T1 ATE266241 T1 AT E266241T1
Authority
AT
Austria
Prior art keywords
conductive
electrical industry
silicone paste
production
silicone
Prior art date
Application number
AT00985043T
Other languages
German (de)
English (en)
Inventor
El Cadi Mohamed Ait
Jean-Alec Ducros
Original Assignee
Laird Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laird Technologies Inc filed Critical Laird Technologies Inc
Application granted granted Critical
Publication of ATE266241T1 publication Critical patent/ATE266241T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0831—Gold
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S277/00—Seal for a joint or juncture
    • Y10S277/92—Seal including electromagnetic shielding feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component
    • Y10T428/12104—Particles discontinuous
    • Y10T428/12111—Separated by nonmetal matrix or binder [e.g., welding electrode, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24008—Structurally defined web or sheet [e.g., overall dimension, etc.] including fastener for attaching to external surface
    • Y10T428/24017—Hook or barb
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
AT00985043T 1999-12-09 2000-11-16 Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung ATE266241T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19959262A DE19959262A1 (de) 1999-12-09 1999-12-09 Leitfähiges pastöses Material und dessen Verwendung
PCT/EP2000/011371 WO2001043146A1 (en) 1999-12-09 2000-11-16 Non-silicone conductive paste for the electrical industry, and its use

Publications (1)

Publication Number Publication Date
ATE266241T1 true ATE266241T1 (de) 2004-05-15

Family

ID=7931917

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00985043T ATE266241T1 (de) 1999-12-09 2000-11-16 Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung

Country Status (10)

Country Link
US (4) US6518496B1 (OSRAM)
EP (1) EP1240648B8 (OSRAM)
JP (1) JP4436993B2 (OSRAM)
KR (1) KR100743732B1 (OSRAM)
AT (1) ATE266241T1 (OSRAM)
AU (1) AU2159401A (OSRAM)
CA (1) CA2394050A1 (OSRAM)
DE (2) DE19959262A1 (OSRAM)
ES (1) ES2220577T3 (OSRAM)
WO (1) WO2001043146A1 (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19959262A1 (de) * 1999-12-09 2001-06-21 Altoflex S A Leitfähiges pastöses Material und dessen Verwendung
US20040057198A1 (en) * 2002-03-11 2004-03-25 Helmut Kahl Device housing comprising an electromagnetically shielded region
US7018701B2 (en) * 2002-06-06 2006-03-28 Fuji Polymer Industries Co., Ltd. Thermally conductive sheet and method for manufacturing the same
US7346549B2 (en) * 2002-06-27 2008-03-18 At&T Knowledge Ventures, L.P. System and method for wirelessly transacting access to a set of events and associated digital content/products
US6864573B2 (en) * 2003-05-06 2005-03-08 Daimlerchrysler Corporation Two piece heat sink and device package
KR101155940B1 (ko) 2003-11-05 2012-07-05 다우 코닝 코포레이션 열 전도성 그리스, 당해 그리스가 사용되는 방법 및디바이스
SE0302985D0 (sv) * 2003-11-13 2003-11-13 Mydata Automation Ab A method for generating a jetting program
JP2005187793A (ja) * 2003-12-24 2005-07-14 Rohm & Haas Electronic Materials Llc 改良された接着剤
US20090169724A1 (en) * 2007-12-27 2009-07-02 Toshiaki Ogiwara Conductive paste for use in membrane touch switch applications
FR2939441B1 (fr) 2008-12-08 2010-12-24 Solvay Procede de preparation d'un materiau polymere transparent comprenant des nanoparticules minerales ayant un facteur de forme strictement superieur a 1,0
US7816785B2 (en) * 2009-01-22 2010-10-19 International Business Machines Corporation Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
JP5651676B2 (ja) 2009-03-16 2015-01-14 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 熱伝導性グリース、並びに、該グリースを用いる方法及びデバイス
JP5632852B2 (ja) * 2010-08-27 2014-11-26 Ｄｏｗａエレクトロニクス株式会社 低温焼結性銀ナノ粒子組成物および該組成物を用いて形成された電子物品
KR101048083B1 (ko) * 2010-10-14 2011-07-11 주식회사 이노칩테크놀로지 전자파 차폐 가스켓
US9999158B2 (en) 2013-01-03 2018-06-12 Henkel IP & Holding GmbH Thermally conductive EMI suppression compositions
EP3105300B1 (en) 2014-02-13 2019-08-21 Honeywell International Inc. Compressible thermal interface materials
WO2017152353A1 (en) 2016-03-08 2017-09-14 Honeywell International Inc. Phase change material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3653959A (en) * 1970-04-14 1972-04-04 Grace W R & Co Encapsulating and potting composition and process
US4011360A (en) * 1974-04-10 1977-03-08 Chomerics, Inc. Electrically conductive silicone rubber stock
EP0103695A1 (en) * 1982-07-16 1984-03-28 Showa Denko Kabushiki Kaisha Vulcanized olefin-based rubber composition
JPS61123665A (ja) * 1984-11-19 1986-06-11 Matsushita Electric Ind Co Ltd 導電性樹脂組成物の製造方法
JPS6333443A (ja) * 1986-07-28 1988-02-13 Sumitomo Bakelite Co Ltd 導電性樹脂組成物
US4994903A (en) * 1989-12-18 1991-02-19 Texas Instruments Incorporated Circuit substrate and circuit using the substrate
AU635393B2 (en) * 1989-12-21 1993-03-18 Amesbury Group, Inc. Catalytic, water-soluble polymeric films for metal coatings
EP0555184B1 (de) * 1992-02-07 1996-07-17 Ciba-Geigy Ag Füllstoff für wärmeleitende Kunststoffe
EP0562179A1 (en) * 1992-03-26 1993-09-29 Sumitomo Chemical Company, Limited Electroconductive resin composition
JPH06136211A (ja) * 1992-10-22 1994-05-17 Asahi Chem Ind Co Ltd スチレン系樹脂組成物
DE4319965C3 (de) * 1993-06-14 2000-09-14 Emi Tec Elektronische Material Verfahren zur Herstellung eines Gehäuses mit elektromagnetischer Abschirmung
JP3490500B2 (ja) * 1994-06-28 2004-01-26 鐘淵化学工業株式会社 硬化性導電性組成物
AU2740695A (en) * 1994-07-01 1996-01-25 Neste Oy Electrically conducting polymer compositions
WO1996036057A1 (en) * 1995-05-10 1996-11-14 Littelfuse, Inc. Ptc circuit protection device and manufacturing process for same
US6294257B1 (en) * 1997-03-11 2001-09-25 Zeon Corporation Conductive elastomer film, method for production thereof, and conductive elastomer composition
WO1998040439A1 (en) * 1997-03-14 1998-09-17 Minnesota Mining And Manufacturing Company Cure-on-demand, moisture-curable compositions having reactive silane functionality
JP3913859B2 (ja) * 1997-09-10 2007-05-09 株式会社カネカ 硬化性組成物
US6281433B1 (en) * 1999-08-03 2001-08-28 Lucent Technologies Inc. Faceplate for network switching apparatus
DE19959262A1 (de) * 1999-12-09 2001-06-21 Altoflex S A Leitfähiges pastöses Material und dessen Verwendung

Also Published As

Publication number Publication date
US6921780B2 (en) 2005-07-26
US20020039662A1 (en) 2002-04-04
US6563044B2 (en) 2003-05-13
JP4436993B2 (ja) 2010-03-24
US6780927B2 (en) 2004-08-24
US20020068145A1 (en) 2002-06-06
DE60010515D1 (de) 2004-06-09
US6518496B1 (en) 2003-02-11
EP1240648B8 (en) 2005-01-19
KR100743732B1 (ko) 2007-07-27
EP1240648A1 (en) 2002-09-18
DE19959262A1 (de) 2001-06-21
AU2159401A (en) 2001-06-18
JP2003516610A (ja) 2003-05-13
EP1240648B1 (en) 2004-05-06
ES2220577T3 (es) 2004-12-16
US20020051862A1 (en) 2002-05-02
WO2001043146A1 (en) 2001-06-14
CA2394050A1 (en) 2001-06-14
DE60010515T2 (de) 2005-05-12
KR20030076920A (ko) 2003-09-29

Similar Documents

Publication Publication Date Title
ATE266241T1 (de) Leitfähige, nichtsilikonische paste für die elektrische industrie und ihre verwendung
MY123025A (en) Electrolytic capacitor and its manufacturing method
TWI256167B (en) Electrode, and electrochemical component employing the electrode
DK1367307T3 (da) Piezoventil
TW200518241A (en) Device having a compliant element pressed between substrates
ATE402407T1 (de) Kohlenstoff-nano-röhrchen-vorrichtung
DE69613645D1 (de) Kostengünstiges hochleistungsgehäuse für mikrowellenschaltungen im 90 ghz-bereich mit bga ein/ausgangsformat und keramischer substrattechnologie
EP1251559A3 (en) Multiple terminal capacitor structure
ATE297551T1 (de) Mikroelektrodensystem
AU5549500A (en) Conductive structures
WO2005003726A3 (en) Hydrocyclone wear-detection sensor
DE50311953D1 (de) Galvanisches Element mit dünnen Elektroden
DE60327951D1 (de) Kontaktanordnung mit metallschaummaterialien für elektrische verbindungen
DE502004001196D1 (de) Elektrisches verbindungselement, insbesondere für elektro wer kzeugschalter
TW200511894A (en) Organic electroluminescent element
DE59905594D1 (de) Folie für einen folienkondensator und folienkondensator
DE50211674D1 (de) Elektromechanischer wandler mit mindestens einem piezoelektrischen element
PL350191A1 (en) Sebocytes, sebocyte cell lines and applications thereof
DE50205819D1 (de) Steckverbinder mit Isolations- und Dichtungselement
DE50302346D1 (de) Durchführungsklemme
SE9804119D0 (sv) Elektriskt kontaktelement
SE0102491D0 (sv) Kontaktelement
DE602004027949D1 (de) Elektrisches kontaktelement für elektrische mittel- oder hochspanungsgeräte und entsprechendes verfahren und geräte
HUP0001962A2 (hu) Monovezető elem felületi érintkezés észlelésére
CN116096599A8 (zh) 终端及适用于终端上的电子设备

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties