ES2192833T3 - Composiciones piezoelectricas ceramica-polimero mejoradas. - Google Patents
Composiciones piezoelectricas ceramica-polimero mejoradas.Info
- Publication number
- ES2192833T3 ES2192833T3 ES99905420T ES99905420T ES2192833T3 ES 2192833 T3 ES2192833 T3 ES 2192833T3 ES 99905420 T ES99905420 T ES 99905420T ES 99905420 T ES99905420 T ES 99905420T ES 2192833 T3 ES2192833 T3 ES 2192833T3
- Authority
- ES
- Spain
- Prior art keywords
- polymer
- component
- piezoelectric
- composite material
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/092—Forming composite materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Laminated Bodies (AREA)
Abstract
Un material compuesto piezoeléctrico que comprende un primer componente que es un polvo piezoeléctrico y un segundo componente que tiene conectividad tridimensional que comprende un polímero, comprendiendo dicho primer componente partículas piezoeléctricas esféricas, teniendo las partículas un diámetro cuyo valor medio ponderado es de 30 mm a 200 mm, siendo la pérdida dieléctrica de dicho polímero menor que 0, 02 a 1 kHz, y estando comprendido el volumen total de todos los componentes del material compuesto distintos de dicho polímero entre 50 por ciento en volumen y 74 por ciento en volumen del material compuesto, caracterizado porque dicho polímero se adhiere sustancialmente a dicho primer componente, la deformación elástica S33 del material compuesto piezoeléctrico está comprendida entre 1, 5 x 10-10 y 6, 0 x 10-10 m2/N, y dicho polímero es un polímero orgánico que comprende un polietileno de baja densidad o poli(1-buteno).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/003,625 US5951908A (en) | 1998-01-07 | 1998-01-07 | Piezoelectrics and related devices from ceramics dispersed in polymers |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2192833T3 true ES2192833T3 (es) | 2003-10-16 |
Family
ID=21706765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES99905420T Expired - Lifetime ES2192833T3 (es) | 1998-01-07 | 1999-01-07 | Composiciones piezoelectricas ceramica-polimero mejoradas. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5951908A (es) |
EP (1) | EP1044466B1 (es) |
JP (1) | JP2002501301A (es) |
CA (1) | CA2317735A1 (es) |
DE (1) | DE69906248T2 (es) |
ES (1) | ES2192833T3 (es) |
WO (1) | WO1999035670A2 (es) |
Families Citing this family (71)
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US20030215606A1 (en) * | 2002-05-17 | 2003-11-20 | Clancy Donald J. | Dispersible dielectric particles and methods of forming the same |
JP4224710B2 (ja) * | 2004-06-09 | 2009-02-18 | セイコーエプソン株式会社 | 圧電素子、圧電アクチュエーター、圧電ポンプ、インクジェット式記録ヘッド、インクジェットプリンター、表面弾性波素子、周波数フィルタ、発振器、電子回路、薄膜圧電共振器、および電子機器 |
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US7923497B2 (en) * | 2005-11-23 | 2011-04-12 | General Electric Company | Antiferroelectric polymer composites, methods of manufacture thereof, and articles comprising the same |
US7443082B2 (en) * | 2006-03-03 | 2008-10-28 | Basf Corporation | Piezoelectric polymer composite article and system |
US8470921B2 (en) * | 2006-05-10 | 2013-06-25 | The United States Of America As Represented By The Secretary Of The Navy | Ultra-low permeability polymeric encapsulated acoustic device and method |
US9086737B2 (en) * | 2006-06-15 | 2015-07-21 | Apple Inc. | Dynamically controlled keyboard |
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US8247484B2 (en) * | 2008-06-12 | 2012-08-21 | General Electric Company | High temperature polymer composites and methods of making the same |
US20090309259A1 (en) * | 2008-06-12 | 2009-12-17 | General Electric Company | High temperature polymer composites comprising antiferroelectric particles and methods of making the same |
US8110744B2 (en) * | 2008-08-19 | 2012-02-07 | Apple Inc. | Flexible shielded cable |
US9390857B2 (en) * | 2008-09-30 | 2016-07-12 | General Electric Company | Film capacitor |
US8020314B2 (en) * | 2008-10-31 | 2011-09-20 | Corning Incorporated | Methods and apparatus for drying ceramic green bodies with microwaves |
US8286488B2 (en) * | 2009-05-01 | 2012-10-16 | General Electric Company | Apparatus and system for measuring material thickness |
US8487759B2 (en) | 2009-09-30 | 2013-07-16 | Apple Inc. | Self adapting haptic device |
JP5800897B2 (ja) * | 2010-06-15 | 2015-10-28 | スリーエム イノベイティブ プロパティズ カンパニー | 可変静電容量センサ及びその作製方法 |
WO2012014278A1 (ja) * | 2010-07-27 | 2012-02-02 | 株式会社ユーテック | ポーリング処理方法、プラズマポーリング装置、圧電体及びその製造方法 |
US10013058B2 (en) | 2010-09-21 | 2018-07-03 | Apple Inc. | Touch-based user interface with haptic feedback |
US10120446B2 (en) | 2010-11-19 | 2018-11-06 | Apple Inc. | Haptic input device |
EP2608287B1 (en) | 2011-12-22 | 2014-04-16 | Meggitt A/S | Flexible piezoelectric material, production and use thereof |
US9178509B2 (en) | 2012-09-28 | 2015-11-03 | Apple Inc. | Ultra low travel keyboard |
KR20150131241A (ko) | 2013-03-15 | 2015-11-24 | 브라이엄 영 유니버시티 | 스트레인 게이지로서 사용되는 복합 재료 |
US10260968B2 (en) | 2013-03-15 | 2019-04-16 | Nano Composite Products, Inc. | Polymeric foam deformation gauge |
WO2015020663A1 (en) | 2013-08-08 | 2015-02-12 | Honessa Development Laboratories Llc | Sculpted waveforms with no or reduced unforced response |
US9779592B1 (en) | 2013-09-26 | 2017-10-03 | Apple Inc. | Geared haptic feedback element |
WO2015047343A1 (en) | 2013-09-27 | 2015-04-02 | Honessa Development Laboratories Llc | Polarized magnetic actuators for haptic response |
WO2015047356A1 (en) | 2013-09-27 | 2015-04-02 | Bodhi Technology Ventures Llc | Band with haptic actuators |
US10126817B2 (en) | 2013-09-29 | 2018-11-13 | Apple Inc. | Devices and methods for creating haptic effects |
US10236760B2 (en) | 2013-09-30 | 2019-03-19 | Apple Inc. | Magnetic actuators for haptic response |
US9317118B2 (en) | 2013-10-22 | 2016-04-19 | Apple Inc. | Touch surface for simulating materials |
US10276001B2 (en) | 2013-12-10 | 2019-04-30 | Apple Inc. | Band attachment mechanism with haptic response |
US10079336B2 (en) * | 2014-01-13 | 2018-09-18 | Meggitt A/S | Flexible piezoelectric material, production and use thereof |
US9501912B1 (en) | 2014-01-27 | 2016-11-22 | Apple Inc. | Haptic feedback device with a rotating mass of variable eccentricity |
CN106489116B (zh) | 2014-04-21 | 2019-08-16 | 苹果公司 | 用于电子设备的多触摸输入设备的力的分配 |
DE102015209639A1 (de) | 2014-06-03 | 2015-12-03 | Apple Inc. | Linearer Aktuator |
KR102143310B1 (ko) | 2014-09-02 | 2020-08-28 | 애플 인크. | 햅틱 통지 |
US9857246B2 (en) | 2014-09-17 | 2018-01-02 | Sensable Technologies, Llc | Sensing system including a sensing membrane |
WO2016099667A1 (en) * | 2014-12-15 | 2016-06-23 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Controlling crosslinking density and processing parameters of phthalonitriles |
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US10353467B2 (en) | 2015-03-06 | 2019-07-16 | Apple Inc. | Calibration of haptic devices |
AU2016100399B4 (en) | 2015-04-17 | 2017-02-02 | Apple Inc. | Contracting and elongating materials for providing input and output for an electronic device |
WO2017044618A1 (en) | 2015-09-08 | 2017-03-16 | Apple Inc. | Linear actuators for use in electronic devices |
CN105470381B (zh) | 2016-01-11 | 2019-01-11 | 京东方科技集团股份有限公司 | 一种发电结构及其制备方法、电子设备 |
US10039080B2 (en) | 2016-03-04 | 2018-07-31 | Apple Inc. | Situationally-aware alerts |
US10268272B2 (en) | 2016-03-31 | 2019-04-23 | Apple Inc. | Dampening mechanical modes of a haptic actuator using a delay |
US10622538B2 (en) | 2017-07-18 | 2020-04-14 | Apple Inc. | Techniques for providing a haptic output and sensing a haptic input using a piezoelectric body |
US11726076B2 (en) | 2017-08-22 | 2023-08-15 | Cidra Concrete Systems Inc. | Techniques for monitoring slump characteristic of concrete in a rotating container or drum |
US20210028347A1 (en) * | 2018-03-20 | 2021-01-28 | Sabic Global Technologies B.V. | Flexible and low cost piezoelectric composites with high d33 values |
CN109410589B (zh) * | 2018-08-30 | 2021-07-27 | 广州大学 | 一种基于压电复合板的车辆违章检测系统 |
US10691211B2 (en) | 2018-09-28 | 2020-06-23 | Apple Inc. | Button providing force sensing and/or haptic output |
US10599223B1 (en) | 2018-09-28 | 2020-03-24 | Apple Inc. | Button providing force sensing and/or haptic output |
JP6630007B1 (ja) | 2019-01-31 | 2020-01-15 | 住友理工株式会社 | 圧電センサおよびその製造方法 |
KR102649798B1 (ko) * | 2019-06-28 | 2024-03-20 | 후지필름 가부시키가이샤 | 압전 필름 |
US11380470B2 (en) | 2019-09-24 | 2022-07-05 | Apple Inc. | Methods to control force in reluctance actuators based on flux related parameters |
CN111781271B (zh) * | 2020-07-14 | 2022-03-08 | 电子科技大学 | 一种柔性声表面波气体传感器及其制备方法 |
US11977683B2 (en) | 2021-03-12 | 2024-05-07 | Apple Inc. | Modular systems configured to provide localized haptic feedback using inertial actuators |
CN117715981A (zh) * | 2021-07-22 | 2024-03-15 | 施乐公司 | 用于增材制造的压电粉末颗粒及其相关方法 |
US11809631B2 (en) | 2021-09-21 | 2023-11-07 | Apple Inc. | Reluctance haptic engine for an electronic device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4675123A (en) * | 1979-01-17 | 1987-06-23 | Ngk Spark Plug Co., Ltd. | Piezoelectric composite material |
JPS6051750A (ja) * | 1983-08-30 | 1985-03-23 | Murata Mfg Co Ltd | 防振複合体 |
US5043622A (en) * | 1985-06-07 | 1991-08-27 | Hoechst Celanese Corp. | Easily poled 0-3 piezoelectric composites for transducer applications |
US4944891A (en) * | 1985-06-07 | 1990-07-31 | Hoechst Celanese Corp. | Easily poled 0-3 piezoelectric composites for transducer applications |
US4624796A (en) * | 1985-06-07 | 1986-11-25 | Celanese Corporation | Piezoelectric filler and flexible piezoelectric composites |
US5702629A (en) * | 1996-03-21 | 1997-12-30 | Alliedsignal Inc. | Piezeoelectric ceramic-polymer composites |
-
1998
- 1998-01-07 US US09/003,625 patent/US5951908A/en not_active Expired - Fee Related
-
1999
- 1999-01-07 CA CA002317735A patent/CA2317735A1/en not_active Abandoned
- 1999-01-07 DE DE69906248T patent/DE69906248T2/de not_active Expired - Fee Related
- 1999-01-07 WO PCT/US1999/000283 patent/WO1999035670A2/en active IP Right Grant
- 1999-01-07 JP JP2000527965A patent/JP2002501301A/ja not_active Withdrawn
- 1999-01-07 EP EP99905420A patent/EP1044466B1/en not_active Expired - Lifetime
- 1999-01-07 ES ES99905420T patent/ES2192833T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1044466A2 (en) | 2000-10-18 |
WO1999035670A2 (en) | 1999-07-15 |
US5951908A (en) | 1999-09-14 |
EP1044466B1 (en) | 2003-03-26 |
JP2002501301A (ja) | 2002-01-15 |
DE69906248T2 (de) | 2003-12-04 |
WO1999035670A3 (en) | 2000-04-06 |
WO1999035670A9 (en) | 1999-10-21 |
DE69906248D1 (de) | 2003-04-30 |
CA2317735A1 (en) | 1999-07-15 |
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